FR2863084B1 - Module pour des cartes a puce ou des systemes d'identification sans contact - Google Patents
Module pour des cartes a puce ou des systemes d'identification sans contactInfo
- Publication number
- FR2863084B1 FR2863084B1 FR0411740A FR0411740A FR2863084B1 FR 2863084 B1 FR2863084 B1 FR 2863084B1 FR 0411740 A FR0411740 A FR 0411740A FR 0411740 A FR0411740 A FR 0411740A FR 2863084 B1 FR2863084 B1 FR 2863084B1
- Authority
- FR
- France
- Prior art keywords
- module
- chip cards
- identification systems
- contactless identification
- contactless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Wire Bonding (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10356153A DE10356153B4 (de) | 2003-12-02 | 2003-12-02 | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2863084A1 FR2863084A1 (fr) | 2005-06-03 |
FR2863084B1 true FR2863084B1 (fr) | 2011-04-08 |
Family
ID=34559749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0411740A Expired - Fee Related FR2863084B1 (fr) | 2003-12-02 | 2004-11-04 | Module pour des cartes a puce ou des systemes d'identification sans contact |
Country Status (5)
Country | Link |
---|---|
US (2) | US7100836B2 (fr) |
CN (1) | CN1624718B (fr) |
DE (1) | DE10356153B4 (fr) |
FR (1) | FR2863084B1 (fr) |
RU (1) | RU2282893C2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10356153B4 (de) * | 2003-12-02 | 2010-01-14 | Infineon Technologies Ag | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
DE102008016274A1 (de) * | 2008-03-28 | 2009-10-01 | Smartrac Ip B.V. | Chipträger für ein Transpondermodul sowie Transpondermodul |
DE102009056122A1 (de) * | 2009-11-30 | 2011-06-01 | Smartrac Ip B.V. | Verfahren zur Kontaktierung eines Chips |
EP2562692B1 (fr) * | 2011-08-25 | 2013-10-09 | Textilma Ag | Module de puce RFID |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63193896A (ja) * | 1987-02-06 | 1988-08-11 | 株式会社東芝 | 薄膜電磁変換器 |
RU1503575C (ru) | 1987-07-06 | 1994-08-15 | Ленинградское научно-производственное объединение "Авангард" | Оптический информационный носитель |
US5071787A (en) | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
US5198647A (en) * | 1989-11-28 | 1993-03-30 | Mitsubishi Denki Kabushiki Kaisha | Plural-coil non-contact ic card having pot cores and shielding walls |
DE4034225C2 (de) * | 1990-10-26 | 1994-01-27 | Reinhard Jurisch | Datenträger für Identifikationssysteme |
DE9422424U1 (de) | 1994-02-04 | 2002-02-21 | Giesecke & Devrient GmbH, 81677 München | Chipkarte mit einem elektronischen Modul |
WO1996005614A1 (fr) * | 1994-08-12 | 1996-02-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Soudage des puces a bosses avec un adhesif non-conducteur |
DE19630049A1 (de) | 1996-07-25 | 1998-01-29 | Siemens Ag | Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone |
AU4705097A (en) * | 1996-10-09 | 1998-05-05 | Evc Rigid Film Gmbh | Method and connection arrangement for producing a smart card |
JPH10203066A (ja) * | 1997-01-28 | 1998-08-04 | Hitachi Ltd | 非接触icカード |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
DE69831592T2 (de) * | 1997-11-14 | 2006-06-22 | Toppan Printing Co. Ltd. | Zusammengesetzte ic-karte |
JP3451373B2 (ja) * | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
DE10030667A1 (de) * | 2000-06-23 | 2002-01-03 | Friedrich Jambor | Vorrichtung zur Herstellung von Dual Interface Ausweiskarten |
DE10108080C1 (de) * | 2001-02-20 | 2002-04-04 | Infineon Technologies Ag | Kontaktlos arbeitender Datenträger mit einer kapazitiv an das Modul gekoppelten Antennenspule |
FR2823888B1 (fr) * | 2001-04-24 | 2005-02-18 | Gemplus Card Int | Procede de fabrication d'une carte sans contact ou hybride et carte obtenue |
DE10356153B4 (de) * | 2003-12-02 | 2010-01-14 | Infineon Technologies Ag | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
-
2003
- 2003-12-02 DE DE10356153A patent/DE10356153B4/de not_active Revoked
-
2004
- 2004-11-04 FR FR0411740A patent/FR2863084B1/fr not_active Expired - Fee Related
- 2004-12-01 US US11/001,781 patent/US7100836B2/en active Active
- 2004-12-01 RU RU2004135206/09A patent/RU2282893C2/ru active
- 2004-12-02 CN CN2004100980631A patent/CN1624718B/zh active Active
-
2006
- 2006-06-30 US US11/479,295 patent/US7451936B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN1624718A (zh) | 2005-06-08 |
DE10356153B4 (de) | 2010-01-14 |
US7100836B2 (en) | 2006-09-05 |
US7451936B2 (en) | 2008-11-18 |
US20060243812A1 (en) | 2006-11-02 |
US20050116051A1 (en) | 2005-06-02 |
FR2863084A1 (fr) | 2005-06-03 |
CN1624718B (zh) | 2010-05-26 |
RU2282893C2 (ru) | 2006-08-27 |
RU2004135206A (ru) | 2006-05-10 |
DE10356153A1 (de) | 2005-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20060731 |
|
RN | Application for restoration | ||
FC | Decision of inpi director general to approve request for restoration | ||
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
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PLFP | Fee payment |
Year of fee payment: 14 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |
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PLFP | Fee payment |
Year of fee payment: 18 |
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PLFP | Fee payment |
Year of fee payment: 19 |