FR2863084B1 - Module pour des cartes a puce ou des systemes d'identification sans contact - Google Patents

Module pour des cartes a puce ou des systemes d'identification sans contact

Info

Publication number
FR2863084B1
FR2863084B1 FR0411740A FR0411740A FR2863084B1 FR 2863084 B1 FR2863084 B1 FR 2863084B1 FR 0411740 A FR0411740 A FR 0411740A FR 0411740 A FR0411740 A FR 0411740A FR 2863084 B1 FR2863084 B1 FR 2863084B1
Authority
FR
France
Prior art keywords
module
chip cards
identification systems
contactless identification
contactless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0411740A
Other languages
English (en)
Other versions
FR2863084A1 (fr
Inventor
Frank Puschner
Hipper Andreas Muller
Andreas Karl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34559749&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2863084(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of FR2863084A1 publication Critical patent/FR2863084A1/fr
Application granted granted Critical
Publication of FR2863084B1 publication Critical patent/FR2863084B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0411740A 2003-12-02 2004-11-04 Module pour des cartes a puce ou des systemes d'identification sans contact Expired - Fee Related FR2863084B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10356153A DE10356153B4 (de) 2003-12-02 2003-12-02 Modul für kontaktlose Chipkarten oder Identifizierungssysteme

Publications (2)

Publication Number Publication Date
FR2863084A1 FR2863084A1 (fr) 2005-06-03
FR2863084B1 true FR2863084B1 (fr) 2011-04-08

Family

ID=34559749

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0411740A Expired - Fee Related FR2863084B1 (fr) 2003-12-02 2004-11-04 Module pour des cartes a puce ou des systemes d'identification sans contact

Country Status (5)

Country Link
US (2) US7100836B2 (fr)
CN (1) CN1624718B (fr)
DE (1) DE10356153B4 (fr)
FR (1) FR2863084B1 (fr)
RU (1) RU2282893C2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10356153B4 (de) * 2003-12-02 2010-01-14 Infineon Technologies Ag Modul für kontaktlose Chipkarten oder Identifizierungssysteme
DE102008016274A1 (de) * 2008-03-28 2009-10-01 Smartrac Ip B.V. Chipträger für ein Transpondermodul sowie Transpondermodul
DE102009056122A1 (de) * 2009-11-30 2011-06-01 Smartrac Ip B.V. Verfahren zur Kontaktierung eines Chips
EP2562692B1 (fr) * 2011-08-25 2013-10-09 Textilma Ag Module de puce RFID

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193896A (ja) * 1987-02-06 1988-08-11 株式会社東芝 薄膜電磁変換器
RU1503575C (ru) 1987-07-06 1994-08-15 Ленинградское научно-производственное объединение "Авангард" Оптический информационный носитель
US5071787A (en) 1989-03-14 1991-12-10 Kabushiki Kaisha Toshiba Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
US5198647A (en) * 1989-11-28 1993-03-30 Mitsubishi Denki Kabushiki Kaisha Plural-coil non-contact ic card having pot cores and shielding walls
DE4034225C2 (de) * 1990-10-26 1994-01-27 Reinhard Jurisch Datenträger für Identifikationssysteme
DE9422424U1 (de) 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chipkarte mit einem elektronischen Modul
WO1996005614A1 (fr) * 1994-08-12 1996-02-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Soudage des puces a bosses avec un adhesif non-conducteur
DE19630049A1 (de) 1996-07-25 1998-01-29 Siemens Ag Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone
AU4705097A (en) * 1996-10-09 1998-05-05 Evc Rigid Film Gmbh Method and connection arrangement for producing a smart card
JPH10203066A (ja) * 1997-01-28 1998-08-04 Hitachi Ltd 非接触ｉｃカード
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
DE69831592T2 (de) * 1997-11-14 2006-06-22 Toppan Printing Co. Ltd. Zusammengesetzte ic-karte
JP3451373B2 (ja) * 1999-11-24 2003-09-29 オムロン株式会社 電磁波読み取り可能なデータキャリアの製造方法
DE10030667A1 (de) * 2000-06-23 2002-01-03 Friedrich Jambor Vorrichtung zur Herstellung von Dual Interface Ausweiskarten
DE10108080C1 (de) * 2001-02-20 2002-04-04 Infineon Technologies Ag Kontaktlos arbeitender Datenträger mit einer kapazitiv an das Modul gekoppelten Antennenspule
FR2823888B1 (fr) * 2001-04-24 2005-02-18 Gemplus Card Int Procede de fabrication d'une carte sans contact ou hybride et carte obtenue
DE10356153B4 (de) * 2003-12-02 2010-01-14 Infineon Technologies Ag Modul für kontaktlose Chipkarten oder Identifizierungssysteme

Also Published As

Publication number Publication date
CN1624718A (zh) 2005-06-08
DE10356153B4 (de) 2010-01-14
US7100836B2 (en) 2006-09-05
US7451936B2 (en) 2008-11-18
US20060243812A1 (en) 2006-11-02
US20050116051A1 (en) 2005-06-02
FR2863084A1 (fr) 2005-06-03
CN1624718B (zh) 2010-05-26
RU2282893C2 (ru) 2006-08-27
RU2004135206A (ru) 2006-05-10
DE10356153A1 (de) 2005-07-07

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