FR2858254B1 - Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif - Google Patents
Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositifInfo
- Publication number
- FR2858254B1 FR2858254B1 FR0408375A FR0408375A FR2858254B1 FR 2858254 B1 FR2858254 B1 FR 2858254B1 FR 0408375 A FR0408375 A FR 0408375A FR 0408375 A FR0408375 A FR 0408375A FR 2858254 B1 FR2858254 B1 FR 2858254B1
- Authority
- FR
- France
- Prior art keywords
- interpist
- filling
- hollow
- equipment
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/18—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material only one side of the work coming into contact with the liquid or other fluent material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0408375A FR2858254B1 (fr) | 2003-07-30 | 2004-07-29 | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0309351A FR2858255A1 (fr) | 2003-07-30 | 2003-07-30 | Procede de remplissage de zones situees en creux par entrainement de l'air et remplacement par du produit en mouvement |
FR0403455A FR2858253A1 (fr) | 2003-07-30 | 2004-04-02 | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime |
FR0408375A FR2858254B1 (fr) | 2003-07-30 | 2004-07-29 | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2858254A1 FR2858254A1 (fr) | 2005-02-04 |
FR2858254B1 true FR2858254B1 (fr) | 2007-10-05 |
Family
ID=34068749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0408375A Expired - Fee Related FR2858254B1 (fr) | 2003-07-30 | 2004-07-29 | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2858254B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7410090B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Conductive bonding material fill techniques |
US9314864B2 (en) | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05337425A (ja) * | 1992-06-04 | 1993-12-21 | Ibiden Co Ltd | 高粘度ペーストの充填方法及び充填装置 |
JP3085451B2 (ja) * | 1996-04-22 | 2000-09-11 | 富士通株式会社 | 製造ラインおよびそれによって製造される多層プリント配線基板 |
JP3410639B2 (ja) * | 1997-07-23 | 2003-05-26 | 株式会社日立製作所 | ペースト充填方法及びはんだ付け方法及びペースト印刷機 |
FR2803228B1 (fr) * | 2000-01-03 | 2002-02-08 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
JP3952872B2 (ja) * | 2001-10-10 | 2007-08-01 | 株式会社デンソー | 流動状物質の充填装置および充填方法 |
FR2845858B1 (fr) * | 2002-10-11 | 2004-12-10 | Novatec Sa Soc | Dispositif de remplissage de zones ouvertes situees en creux par rapport a une surface |
-
2004
- 2004-07-29 FR FR0408375A patent/FR2858254B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2858254A1 (fr) | 2005-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090331 |