FR2852973B1 - Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. - Google Patents

Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Info

Publication number
FR2852973B1
FR2852973B1 FR0303867A FR0303867A FR2852973B1 FR 2852973 B1 FR2852973 B1 FR 2852973B1 FR 0303867 A FR0303867 A FR 0303867A FR 0303867 A FR0303867 A FR 0303867A FR 2852973 B1 FR2852973 B1 FR 2852973B1
Authority
FR
France
Prior art keywords
metal oxides
electrolysis
coating
metal
acqueus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0303867A
Other languages
English (en)
Other versions
FR2852973A1 (fr
Inventor
Francoise Andolfatto
Philippe Joubert
Gerard Duboeuf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kem One SAS
Original Assignee
Atofina SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0303867A priority Critical patent/FR2852973B1/fr
Application filed by Atofina SA filed Critical Atofina SA
Priority to US10/550,646 priority patent/US7790233B2/en
Priority to CA2520584A priority patent/CA2520584C/fr
Priority to EP04742353A priority patent/EP1608795B1/fr
Priority to MXPA05010353A priority patent/MXPA05010353A/es
Priority to ES04742353T priority patent/ES2270380T3/es
Priority to JP2006505751A priority patent/JP4532471B2/ja
Priority to KR1020057018365A priority patent/KR101111369B1/ko
Priority to CN2004800147636A priority patent/CN1795291B/zh
Priority to BRPI0408905-7A priority patent/BRPI0408905A/pt
Priority to UAA200510604A priority patent/UA80610C2/uk
Priority to AT04742353T priority patent/ATE330043T1/de
Priority to PL04742353T priority patent/PL1608795T3/pl
Priority to DE602004001230T priority patent/DE602004001230T2/de
Priority to PCT/FR2004/000746 priority patent/WO2004087992A2/fr
Publication of FR2852973A1 publication Critical patent/FR2852973A1/fr
Priority to ZA200507825A priority patent/ZA200507825B/en
Application granted granted Critical
Publication of FR2852973B1 publication Critical patent/FR2852973B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/04—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1225—Deposition of multilayers of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1241—Metallic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/14—Alkali metal compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
    • C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
    • C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
    • C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
FR0303867A 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. Expired - Fee Related FR2852973B1 (fr)

Priority Applications (16)

Application Number Priority Date Filing Date Title
FR0303867A FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.
UAA200510604A UA80610C2 (en) 2003-03-28 2004-03-25 Method for the coating of metal oxides formation on the electroconductive support, activated cathode, which is obtained by this method and its use for electrolysis of water solutions of alkali chlorides
EP04742353A EP1608795B1 (fr) 2003-03-28 2004-03-25 Procede de formation d un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins.
MXPA05010353A MXPA05010353A (es) 2003-03-28 2004-03-25 Procedimiento de formacion de un revestimiento de oxidos metalicos sobre un substrato electroconductor, catodo activado resultante y su utilizacion para la electrolisis de soluciones acuosas de cloruros de metales alcalinos.
ES04742353T ES2270380T3 (es) 2003-03-28 2004-03-25 Procedimiento de formacion de un revestimiento de oxidos metalicos sobre un sustrato electro-conductor, catodo activado resultante y su utilizacion para la electrolisis de soluciones acuosas de cloruros de metales alcalinos.
JP2006505751A JP4532471B2 (ja) 2003-03-28 2004-03-25 導電性基材上に金属酸化物の被膜を形成する方法と、それによって得られる活性カソードと、アルカリ金属塩化物水溶液の電気分解でのその使用
KR1020057018365A KR101111369B1 (ko) 2003-03-28 2004-03-25 전도성 기판상에 금속 산화물의 코팅을 형성하는 방법,그로 얻어진 활성 음극, 및 알카리 금속 염화물 수용액의전기분해에 사용되는 상기 음극의 용도
CN2004800147636A CN1795291B (zh) 2003-03-28 2004-03-25 在导电基材上形成金属氧化物涂层的方法,由此得到的活化阴极及其在碱金属氯化物水溶液电解中的应用
US10/550,646 US7790233B2 (en) 2003-03-28 2004-03-25 Method for the formation of a coating of metal oxides on an electrically-conductive substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides
CA2520584A CA2520584C (fr) 2003-03-28 2004-03-25 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins
AT04742353T ATE330043T1 (de) 2003-03-28 2004-03-25 Verfahren zur herstellung einer metalloxidbeschichtung auf einem leitfähigen substrat, aktivierte kathode davon und ihre verwendung zur elektrolyse von wässriger alkalichlorid-lösungen
PL04742353T PL1608795T3 (pl) 2003-03-28 2004-03-25 Sposób wytwarzania powłoki z tlenków metali na podłożu elektroprzewodzącym, katoda aktywowana będąca jego rezultatem i jej zastosowanie w elektolizie wodnych roztworów chlorków metali alkaicznych
DE602004001230T DE602004001230T2 (de) 2003-03-28 2004-03-25 Verfahren zur herstellung einer metalloxidbeschichtung auf einem leitfähigen substrat, aktivierte kathode davon und ihre verwendung zur elektrolyse von wässriger alkalichlorid-lösungen
PCT/FR2004/000746 WO2004087992A2 (fr) 2003-03-28 2004-03-25 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins.
BRPI0408905-7A BRPI0408905A (pt) 2003-03-28 2004-03-25 processo de formação de um revestimento de óxidos metálicos sobre um substrato eletrocondutor, catodo ativado que resulta dele e sua utilização para a eletrólise de soluções aquosas de cloretos de metais alcalinos
ZA200507825A ZA200507825B (en) 2003-03-28 2005-09-27 Method for the formation of a coating of metal oxides on an electrically-conducting substrate, resultant activated cathode and use thereof for the electrolysis of aqueous solutions of alkaline metal chlorides

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0303867A FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Publications (2)

Publication Number Publication Date
FR2852973A1 FR2852973A1 (fr) 2004-10-01
FR2852973B1 true FR2852973B1 (fr) 2006-05-26

Family

ID=32947259

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0303867A Expired - Fee Related FR2852973B1 (fr) 2003-03-28 2003-03-28 Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins.

Country Status (16)

Country Link
US (1) US7790233B2 (fr)
EP (1) EP1608795B1 (fr)
JP (1) JP4532471B2 (fr)
KR (1) KR101111369B1 (fr)
CN (1) CN1795291B (fr)
AT (1) ATE330043T1 (fr)
BR (1) BRPI0408905A (fr)
CA (1) CA2520584C (fr)
DE (1) DE602004001230T2 (fr)
ES (1) ES2270380T3 (fr)
FR (1) FR2852973B1 (fr)
MX (1) MXPA05010353A (fr)
PL (1) PL1608795T3 (fr)
UA (1) UA80610C2 (fr)
WO (1) WO2004087992A2 (fr)
ZA (1) ZA200507825B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283143A (ja) * 2005-03-31 2006-10-19 Dainippon Printing Co Ltd 金属酸化物膜の製造方法
GB0714021D0 (en) * 2007-07-18 2007-08-29 Green Metals Ltd Improvements in anode materials
US8124556B2 (en) * 2008-05-24 2012-02-28 Freeport-Mcmoran Corporation Electrochemically active composition, methods of making, and uses thereof
CN102482337A (zh) 2009-05-26 2012-05-30 新加坡科技研究局 吡咯啉-5-羧酸还原酶1的突变蛋白
CN102505127A (zh) * 2011-12-29 2012-06-20 文广 贵金属改性钛阳极材料的制备方法
WO2015137193A1 (fr) * 2014-03-12 2015-09-17 Jsr株式会社 Composition de production de dispositif à semi-conducteur et procédé de formation de motif faisant appel à ladite composition de production de dispositif à semi-conducteur
CN106521433A (zh) * 2015-09-09 2017-03-22 宁波江丰电子材料股份有限公司 环件结构及其加工方法
IT201900020026A1 (it) * 2019-10-30 2021-04-30 Industrie De Nora Spa Elettrodo per evoluzione elettrolitica di idrogeno

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850668A (en) 1972-06-05 1974-11-26 Johnson Matthey Co Ltd Impregnation of graphite with ruthenium compounds
US4300992A (en) 1975-05-12 1981-11-17 Hodogaya Chemical Co., Ltd. Activated cathode
US4100049A (en) * 1977-07-11 1978-07-11 Diamond Shamrock Corporation Coated cathode for electrolysis cells
FR2583781A1 (fr) * 1985-06-24 1986-12-26 Atochem Cathode pour electrolyse et un procede de fabrication de ladite cathode
FR2596776B1 (fr) * 1986-04-03 1988-06-03 Atochem Cathode pour electrolyse et un procede de fabrication de ladite cathode
JPH0766816B2 (ja) * 1989-01-13 1995-07-19 東洋インキ製造株式会社 ガス拡散型複合電極の製造方法
US5997956A (en) * 1995-08-04 1999-12-07 Microcoating Technologies Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
US5864051A (en) * 1997-11-10 1999-01-26 Uop Selective oxidation catalyst process for preparing the catalyst and process using the catalyst
JP3383838B2 (ja) * 1999-02-25 2003-03-10 独立行政法人産業技術総合研究所 金属酸化物の製造方法及び微細パターンの形成方法
FR2797646B1 (fr) * 1999-08-20 2002-07-05 Atofina Cathode utilisable pour l'electrolyse de solutions aqueuses
US7258899B1 (en) * 2001-12-13 2007-08-21 Amt Holdings, Inc. Process for preparing metal coatings from liquid solutions utilizing cold plasma
US20040077494A1 (en) * 2002-10-22 2004-04-22 Labarge William J. Method for depositing particles onto a catalytic support

Also Published As

Publication number Publication date
MXPA05010353A (es) 2005-12-14
WO2004087992A2 (fr) 2004-10-14
WO2004087992A3 (fr) 2005-02-17
BRPI0408905A (pt) 2006-03-28
PL1608795T3 (pl) 2006-11-30
FR2852973A1 (fr) 2004-10-01
EP1608795A2 (fr) 2005-12-28
DE602004001230T2 (de) 2007-04-19
CN1795291B (zh) 2011-08-31
US7790233B2 (en) 2010-09-07
ATE330043T1 (de) 2006-07-15
US20060263614A1 (en) 2006-11-23
JP4532471B2 (ja) 2010-08-25
CN1795291A (zh) 2006-06-28
DE602004001230D1 (de) 2006-07-27
ES2270380T3 (es) 2007-04-01
KR20050114265A (ko) 2005-12-05
JP2006521469A (ja) 2006-09-21
KR101111369B1 (ko) 2012-04-09
ZA200507825B (en) 2007-01-31
CA2520584C (fr) 2011-08-23
CA2520584A1 (fr) 2004-10-14
UA80610C2 (en) 2007-10-10
EP1608795B1 (fr) 2006-06-14

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