CA2520584C - Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins - Google Patents
Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins Download PDFInfo
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- CA2520584C CA2520584C CA2520584A CA2520584A CA2520584C CA 2520584 C CA2520584 C CA 2520584C CA 2520584 A CA2520584 A CA 2520584A CA 2520584 A CA2520584 A CA 2520584A CA 2520584 C CA2520584 C CA 2520584C
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/14—Alkali metal compounds
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
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- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Chemically Coating (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
Abstract
L'invention concerne un procédé de formation d'un revêtement d'oxydes métalliques comprenant au moins un métal précieux du groupe VIII de la classification des éléments éventuellement associé à du titane et/ou du zirconium sur un substrat électroconducteur en acier ou en fer, qui consiste à appliquer une solution d'acétylacétonates dudit (desdits) métal (métaux) dissout(s) dans un (des) solvant(s) solubilisant spécifiquement chaque acétylacétonate métallique, puis à sécher et calciner le substrat revêtu. L'invention concerne également une cathode activée obtenue à partir du substrat électroconducteur revêtu d'oxydes métalliques et son utilisation pour l'électrolyse de solutions aqueuses de chlorures de métaux alcalins.
Claims (21)
1. Procédé de formation d'un revêtement d'oxydes métalliques comprenant au moins un métal précieux du groupe VIII de la classification périodique des éléments éventuellement associé à du titane et/ou du zirconium, sur un substrat électroconducteur, ledit procédé consistant à appliquer sur ledit substrat une solution comprenant au moins un composé organométallique puis à transformer ledit (ou lesdits) composé(s) organométallique(s) en oxyde(s) métallique(s) au moyen d'un traitement thermique, ledit procédé étant caractérisé en ce que le substrat électroconducteur est en acier ou en fer et en ce que la seule solution appliquée sur ledit substrat est une solution, non aqueuse, d'acétylacétonate métallique ou d'un mélange d'acétylacétonates métalliques dissout(s) dans un (des) solvant(s) solubilisant spécifiquement chaque acétylacétonate métallique, le (les) solvant(s) étant choisi(s) parmi les alcools, les cétones, les chlorométhanes ou un mélange de deux ou plusieurs solvants ci-dessus mentionnés.
2. Procédé selon la revendication 1, caractérisé en ce que le métal précieux du groupe VIII de la classification périodique des éléments est le ruthénium, le rhodium, le palladium, l'osmium, l'iridium ou le platine.
3. Procédé selon la revendication 2, caractérisé en ce que le métal précieux est le ruthénium ou l'iridium.
4. Procédé selon la revendication 3, caractérisé en ce que le métal précieux est le ruthénium.
5. Procédé selon la revendication 1, caractérisé en ce que l'alcool est l'éthanol ou l'isopropanol.
6. Procédé selon la revendication 1, caractérisé en ce que la cétone est l'acétone.
7. Procédé selon la revendication 1, caractérisé en ce que le chlorométhane est le chloroforme.
8. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la solution d'acétylacétonate métallique est obtenue par dissolution dudit acétylacétonate métallique dans son solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique.
9. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la solution contenant plusieurs acétylacétonates métalliques est obtenue:
- soit par dissolution desdits acétylacétonates métalliques dans un mélange de solvants contenant les solvants spécifiques desdits acétylacétonates métalliques;
- soit par mélange de solutions ne contenant qu'un seul acétylacétonate métallique obtenues par dissolution dudit acétylacétonate métallique dans un solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique dudit acétylacétonate.
- soit par dissolution desdits acétylacétonates métalliques dans un mélange de solvants contenant les solvants spécifiques desdits acétylacétonates métalliques;
- soit par mélange de solutions ne contenant qu'un seul acétylacétonate métallique obtenues par dissolution dudit acétylacétonate métallique dans un solvant spécifique ou dans un mélange de solvants contenant le solvant spécifique dudit acétylacétonate.
10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce que, pour obtenir le revêtement d'oxyde(s) métallique(s), on effectue dans une première étape, un prétraitement du substrat en acier ou en fer puis dans une seconde étape, on dépose sur ledit substrat prétraité la solution contenant le (ou les) acétylacétonate(s) métallique(s), on sèche puis on calcine le substrat ainsi revêtu.
11. Procédé selon la revendication 10, caractérisé en ce que le séchage est effectué à une température au plus égale à 150°C.
12. Procédé selon la revendication 10, caractérisé en ce que le substrat revêtu par le (ou les) acétylacétonate(s) métallique(s) est calciné sous air ou bien sous gaz inerte enrichi avec de l'oxygène à une température au moins égale à
300°C pendant une durée allant de 10 minutes à 2 heures.
300°C pendant une durée allant de 10 minutes à 2 heures.
13. Procédé selon la revendication 12, caractérisé en ce que la calcination est effectuée à une température comprise entre 400°C et 600°C.
14. Procédé selon la revendication 10, caractérisé en ce que la seconde étape est répétée plus d'une fois.
15. Procédé selon la revendication 14, caractérisé en ce que la seconde étape est répétée entre 2 et 6 fois.
16. Substrat électroconducteur en acier ou en fer portant un revêtement d'oxydes métalliques formé au moyen d'un procédé selon l'une quelconque des revendications 1 à 15.
17. Utilisation du substrat électroconducteur selon la revendication 16 pour l'obtention d'une cathode activée.
18. Utilisation d'une cathode activée selon la revendication 17 pour l'électrolyse de solutions aqueuses de chlorures de métaux alcalins.
19. Utilisation selon la revendication 18, caractérisée en ce que les solutions aqueuses de chlorures de métaux alcalins sont des solutions aqueuses de chlorure de sodium.
20. Procédé de fabrication de chlore et d'hydroxyde de métal alcalin par électrolyse du chlorure correspondant au moyen d'une cathode selon la revendication 17.
21. Procédé de fabrication de chlorate de métaux alcalins par électrolyse du chlorure correspondant au moyen d'une cathode selon la revendication 17.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0303867A FR2852973B1 (fr) | 2003-03-28 | 2003-03-28 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur; cathode activee en resultant et son utilisation pour l'electrolyse de solutions acqueuses de chorures de meteaux alcalins. |
FR03/03867 | 2003-03-28 | ||
PCT/FR2004/000746 WO2004087992A2 (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins. |
Publications (2)
Publication Number | Publication Date |
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CA2520584A1 CA2520584A1 (fr) | 2004-10-14 |
CA2520584C true CA2520584C (fr) | 2011-08-23 |
Family
ID=32947259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CA2520584A Expired - Fee Related CA2520584C (fr) | 2003-03-28 | 2004-03-25 | Procede de formation d'un revetement d'oxydes metalliques sur un substrat electroconducteur, cathode activee en resultant et son utilisation pour l'electrolyse de solutions aqueuses de chlorures de metaux alcalins |
Country Status (16)
Country | Link |
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US (1) | US7790233B2 (fr) |
EP (1) | EP1608795B1 (fr) |
JP (1) | JP4532471B2 (fr) |
KR (1) | KR101111369B1 (fr) |
CN (1) | CN1795291B (fr) |
AT (1) | ATE330043T1 (fr) |
BR (1) | BRPI0408905A (fr) |
CA (1) | CA2520584C (fr) |
DE (1) | DE602004001230T2 (fr) |
ES (1) | ES2270380T3 (fr) |
FR (1) | FR2852973B1 (fr) |
MX (1) | MXPA05010353A (fr) |
PL (1) | PL1608795T3 (fr) |
UA (1) | UA80610C2 (fr) |
WO (1) | WO2004087992A2 (fr) |
ZA (1) | ZA200507825B (fr) |
Families Citing this family (8)
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JP2006283143A (ja) * | 2005-03-31 | 2006-10-19 | Dainippon Printing Co Ltd | 金属酸化物膜の製造方法 |
GB0714021D0 (en) * | 2007-07-18 | 2007-08-29 | Green Metals Ltd | Improvements in anode materials |
US8022004B2 (en) * | 2008-05-24 | 2011-09-20 | Freeport-Mcmoran Corporation | Multi-coated electrode and method of making |
WO2010136877A1 (fr) | 2009-05-26 | 2010-12-02 | Agency For Science, Technology And Research | Mutéines de la pyrroline-5-carboxylate réductase 1 |
CN102505127A (zh) * | 2011-12-29 | 2012-06-20 | 文广 | 贵金属改性钛阳极材料的制备方法 |
WO2015137193A1 (fr) * | 2014-03-12 | 2015-09-17 | Jsr株式会社 | Composition de production de dispositif à semi-conducteur et procédé de formation de motif faisant appel à ladite composition de production de dispositif à semi-conducteur |
CN106521433A (zh) * | 2015-09-09 | 2017-03-22 | 宁波江丰电子材料股份有限公司 | 环件结构及其加工方法 |
IT201900020026A1 (it) * | 2019-10-30 | 2021-04-30 | Industrie De Nora Spa | Elettrodo per evoluzione elettrolitica di idrogeno |
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US4300992A (en) | 1975-05-12 | 1981-11-17 | Hodogaya Chemical Co., Ltd. | Activated cathode |
US4100049A (en) * | 1977-07-11 | 1978-07-11 | Diamond Shamrock Corporation | Coated cathode for electrolysis cells |
FR2583781A1 (fr) * | 1985-06-24 | 1986-12-26 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
FR2596776B1 (fr) * | 1986-04-03 | 1988-06-03 | Atochem | Cathode pour electrolyse et un procede de fabrication de ladite cathode |
JPH0766816B2 (ja) * | 1989-01-13 | 1995-07-19 | 東洋インキ製造株式会社 | ガス拡散型複合電極の製造方法 |
BR9610069A (pt) * | 1995-08-04 | 2000-05-09 | Microcoating Technologies | Disposição de vapor quìmico e formação de pó usando-se pulverização térmica com soluções de fluido quase super-crìticas e super-crìticas |
US5864051A (en) * | 1997-11-10 | 1999-01-26 | Uop | Selective oxidation catalyst process for preparing the catalyst and process using the catalyst |
JP3383838B2 (ja) * | 1999-02-25 | 2003-03-10 | 独立行政法人産業技術総合研究所 | 金属酸化物の製造方法及び微細パターンの形成方法 |
FR2797646B1 (fr) * | 1999-08-20 | 2002-07-05 | Atofina | Cathode utilisable pour l'electrolyse de solutions aqueuses |
US7258899B1 (en) * | 2001-12-13 | 2007-08-21 | Amt Holdings, Inc. | Process for preparing metal coatings from liquid solutions utilizing cold plasma |
US20040077494A1 (en) * | 2002-10-22 | 2004-04-22 | Labarge William J. | Method for depositing particles onto a catalytic support |
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2003
- 2003-03-28 FR FR0303867A patent/FR2852973B1/fr not_active Expired - Fee Related
-
2004
- 2004-03-25 ES ES04742353T patent/ES2270380T3/es not_active Expired - Lifetime
- 2004-03-25 AT AT04742353T patent/ATE330043T1/de not_active IP Right Cessation
- 2004-03-25 DE DE602004001230T patent/DE602004001230T2/de not_active Expired - Lifetime
- 2004-03-25 CN CN2004800147636A patent/CN1795291B/zh not_active Expired - Fee Related
- 2004-03-25 BR BRPI0408905-7A patent/BRPI0408905A/pt not_active Application Discontinuation
- 2004-03-25 WO PCT/FR2004/000746 patent/WO2004087992A2/fr active Application Filing
- 2004-03-25 JP JP2006505751A patent/JP4532471B2/ja not_active Expired - Fee Related
- 2004-03-25 PL PL04742353T patent/PL1608795T3/pl unknown
- 2004-03-25 UA UAA200510604A patent/UA80610C2/uk unknown
- 2004-03-25 CA CA2520584A patent/CA2520584C/fr not_active Expired - Fee Related
- 2004-03-25 EP EP04742353A patent/EP1608795B1/fr not_active Expired - Lifetime
- 2004-03-25 US US10/550,646 patent/US7790233B2/en not_active Expired - Fee Related
- 2004-03-25 MX MXPA05010353A patent/MXPA05010353A/es active IP Right Grant
- 2004-03-25 KR KR1020057018365A patent/KR101111369B1/ko not_active IP Right Cessation
-
2005
- 2005-09-27 ZA ZA200507825A patent/ZA200507825B/en unknown
Also Published As
Publication number | Publication date |
---|---|
ATE330043T1 (de) | 2006-07-15 |
JP4532471B2 (ja) | 2010-08-25 |
CN1795291B (zh) | 2011-08-31 |
EP1608795A2 (fr) | 2005-12-28 |
KR20050114265A (ko) | 2005-12-05 |
PL1608795T3 (pl) | 2006-11-30 |
ES2270380T3 (es) | 2007-04-01 |
BRPI0408905A (pt) | 2006-03-28 |
US20060263614A1 (en) | 2006-11-23 |
FR2852973B1 (fr) | 2006-05-26 |
JP2006521469A (ja) | 2006-09-21 |
CN1795291A (zh) | 2006-06-28 |
DE602004001230D1 (de) | 2006-07-27 |
DE602004001230T2 (de) | 2007-04-19 |
KR101111369B1 (ko) | 2012-04-09 |
WO2004087992A2 (fr) | 2004-10-14 |
UA80610C2 (en) | 2007-10-10 |
MXPA05010353A (es) | 2005-12-14 |
ZA200507825B (en) | 2007-01-31 |
EP1608795B1 (fr) | 2006-06-14 |
CA2520584A1 (fr) | 2004-10-14 |
US7790233B2 (en) | 2010-09-07 |
FR2852973A1 (fr) | 2004-10-01 |
WO2004087992A3 (fr) | 2005-02-17 |
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