FR2851674B1 - Procede de fabrication d'une carte a puce sans contact a planeite renforcee - Google Patents

Procede de fabrication d'une carte a puce sans contact a planeite renforcee

Info

Publication number
FR2851674B1
FR2851674B1 FR0307906A FR0307906A FR2851674B1 FR 2851674 B1 FR2851674 B1 FR 2851674B1 FR 0307906 A FR0307906 A FR 0307906A FR 0307906 A FR0307906 A FR 0307906A FR 2851674 B1 FR2851674 B1 FR 2851674B1
Authority
FR
France
Prior art keywords
chip card
contactless chip
manufacturing contactless
reinforced plane
reinforced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0307906A
Other languages
English (en)
Other versions
FR2851674A1 (fr
Inventor
Georges Kayanakis
Christophe Halope
Pierre Benato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASK SA
Original Assignee
ASK SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0302258A external-priority patent/FR2844620B1/fr
Application filed by ASK SA filed Critical ASK SA
Priority to FR0307906A priority Critical patent/FR2851674B1/fr
Priority to AU2003276335A priority patent/AU2003276335A1/en
Priority to PCT/FR2003/002703 priority patent/WO2004084130A1/fr
Priority to TW92125178A priority patent/TWI328773B/zh
Publication of FR2851674A1 publication Critical patent/FR2851674A1/fr
Application granted granted Critical
Publication of FR2851674B1 publication Critical patent/FR2851674B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR0307906A 2003-02-25 2003-06-30 Procede de fabrication d'une carte a puce sans contact a planeite renforcee Expired - Fee Related FR2851674B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0307906A FR2851674B1 (fr) 2003-02-25 2003-06-30 Procede de fabrication d'une carte a puce sans contact a planeite renforcee
AU2003276335A AU2003276335A1 (en) 2003-02-25 2003-09-12 Method for manufacturing a reinforced planar contactless chip card
PCT/FR2003/002703 WO2004084130A1 (fr) 2003-02-25 2003-09-12 Procede de fabrication d’une carte a puce sans contact a planeite renforcee
TW92125178A TWI328773B (en) 2003-02-25 2003-09-12 Method of manufacturing a contactless chip card with enhanced evenness

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0302258A FR2844620B1 (fr) 2002-09-13 2003-02-25 Procede de fabrication d'une carte a puce sans contact ou hybride contact - sans contact a planeite renforcee
FR0307906A FR2851674B1 (fr) 2003-02-25 2003-06-30 Procede de fabrication d'une carte a puce sans contact a planeite renforcee

Publications (2)

Publication Number Publication Date
FR2851674A1 FR2851674A1 (fr) 2004-08-27
FR2851674B1 true FR2851674B1 (fr) 2005-05-06

Family

ID=32826954

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0307906A Expired - Fee Related FR2851674B1 (fr) 2003-02-25 2003-06-30 Procede de fabrication d'une carte a puce sans contact a planeite renforcee

Country Status (4)

Country Link
AU (1) AU2003276335A1 (fr)
FR (1) FR2851674B1 (fr)
TW (1) TWI328773B (fr)
WO (1) WO2004084130A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008103870A1 (fr) 2007-02-23 2008-08-28 Newpage Wisconsin System Inc. Étiquette d'identification en papier multifonctionnelle
EP2973236B1 (fr) * 2013-03-15 2019-01-09 X-Card Holdings, LLC Méthode de fabrication d'une couche centrale pour une carte contenant des informations, et produits résultants
FR3042296B1 (fr) * 2015-10-09 2018-11-30 Fenotag Produit, procede et outil industriel permettant la fabrication de tags rfid dans le domaine de la tracabilite de produits textiles comme par exemple dans les blanchisseries industrielles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US6441736B1 (en) * 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
US6294998B1 (en) * 2000-06-09 2001-09-25 Intermec Ip Corp. Mask construction for profile correction on an RFID smart label to improve print quality and eliminate detection

Also Published As

Publication number Publication date
WO2004084130A1 (fr) 2004-09-30
TW200416613A (en) 2004-09-01
AU2003276335A1 (en) 2004-10-11
TWI328773B (en) 2010-08-11
FR2851674A1 (fr) 2004-08-27

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Legal Events

Date Code Title Description
GC Lien (pledge) constituted
GC Lien (pledge) constituted
GC Lien (pledge) constituted

Effective date: 20110608

RG Lien (pledge) cancelled

Effective date: 20140825

PLFP Fee payment

Year of fee payment: 13

GC Lien (pledge) constituted

Effective date: 20151210

ST Notification of lapse

Effective date: 20170228