1328773 玖、發明說明： 【發明所屬之技術領域】 本發明係關於無接觸晶片卡的製法，更明確地說，本 發明係關於增強平坦度之無接觸晶片卡的製法。 【先前技術】 無接觸晶片卡係一種逐漸廣泛運用於各種領域的系統 。因此’於運輸領域中，已經將其開發成_種付費機構。 同樣的應用亦可於電子錢包中發現。有許多公司還開發出 利用無接觸晶片卡來辨識其員工的機構。 藉由位於該無接觸卡中的天線與位於讀卡機中的另一 天線之間的遠距電磁耦合’或是讓該卡直接與該讀卡機碰 觸，便可達到於-無接觸卡與相關的讀取裝置進行資訊交 換的目的。為產生、儲存以及處理該資訊，該卡配備—連 接至該天線的晶片。該天線係位於兩個卡片主體之間的支 :體上外側表面上印製有與該卡片的日後用法相關的 θ像。該天線支標體係一塑膠的介t支樓體或是一由纖維 特料（例如紙張）所製成的支撐體。 於利用由纖維材料製作而成之天線支撐體的無接觸晶 卡中，邊天線係網印於該天線支撐體之上而該晶片則 係固定於該天線支撐體之上，使得其兩個終端連接至兩個 天線終端。 ,接著，於層合步驟期間，構成該等卡片主體的pvc層 糸置於該天線支撲體的任-側之上。而後便對該層合體進 ^以$〇接著’該層合體便於約15(^的溫度下進行 1328773 熱處理。於此同時壓合該層合體，以熔化該等不同的層。 於熱與壓力的組合作用下’該等PVC層便會軟化而且該等 内層則會流體化。因此’與該天線支撐體產生接觸之卡片 主體内層的流體化PVC便會困住天線與晶片，而兩個卡片 主體的液態PVC則會透過先前已製作於該天線支揮體中的 通孔截斷部而彼此接觸。 不幸的係上面的方法具有數項缺點，尤其是該卡片的 最終型態不夠美觀的缺點。因此，於該等卡片主體的内層 流體化期間，外層會軟化，並且以變形程度小於pvc内層 之變形程度的方式而與因該天線厚度、該晶片以及該等通 孔截斷部所導致的该天線支撑體的起伏形狀相符。本質上 ’肉眼並無法看見該些微米的起伏形狀，不過，當印製該 卡片主體之外層的外表面時’該等起伏形狀便會於印製圖 像的顏色中造成色調改變。更確切地說，就印製的卡片主 體而言，於將該等卡片主體層合於該天線支撐體上的層合 步驟期間，過大的厚度會造成該等壓印點分離，因而讓該 顏色變得比較亮；而該天線支撐體的截斷部（該等卡片主 體之内層的PVC會流入其中）則會讓該等壓印點變得更為接 近，因而讓該顏色變得比較暗。雖然不會影響到該卡片作 業的情形，不過，對於審美條件極度苛求的使用者而言， 仍然會發現該最終卡片外觀上的瑕庇。 另一項缺點係當將該晶片直接放置於該天線支撐體之 上時，其可能會因該層合步驟期間所遭受到的壓力而破壞 。在使用模組（也就是用以置放該晶片的電子電路）的前提 1328773 下便可解決此項問題《於此情況中，可以利用金線將該晶 片連接至此電路（「打線」）。而後便可利用環氧樹脂來塗 佈該晶片與該等線路，以便保護它們。理所當然的，此種 解決方式必須花費較長的時間而且比較困難，而且也比較 昂貴。 【發明内容】 所以，本發明的目的係利用將該晶片直接放置於該天 線支撐體之上的技術來達到無接觸卡的製法，同時保護該 晶片使其不會於該無接觸卡的製法期間遭到破壞。 所以，本發明係關於一種無接觸晶片卡的製法，該晶 片卡包括一天線支撐體（其上利用網印置放著該天線），以 及包括連接至該天線兩終端的晶片，以及位於該天線支撐 體任一側之上的至少兩個卡片主體，該等卡片主體係於壓 力下利用熱層合方式進行配置的熱塑性塑膠薄片。該熱塑 I·生塑膠薄片（其係配置於該晶片所在之該天線支撐體的表 面上）被打出一通孔，而且其厚度比該晶片的厚度至少高 出10%，該通孔的位置與該晶片垂直，因此當於進行層合 步驟之前將該薄片放置於該天線支樓體之上的話，該晶片 便會位於通孔内部，並且因而讓該晶片不會於該層合步驟 期間遭受到任何的壓力。 【實施方式】 閱項下面說明時參考隨附圖式將可更明白本發明的目 的、目標以及特徵。 根據圖1所示之本發明的較佳實施例，該天線支撐體 y纖、准材料（例如紙張）製作而a，並且厚度約A 90 “ m 據本發明之0曰片卡的製作係先於其支撐體4。上製作該 、°玄天線係由兩個網印聚合物導電油墨迴圈42與44 t作而成，其包合道^适 电凡素，例如銀、銅或碳。每個迴圈 '八 鳊連接至同樣為網印的天線的其中一個焊墊，迴 '、會連接至焊墊36 ’而迴圈44則會連接至焊墊38。該 等坦圈會透過一常稱為跨接點(該圖中並未顯示)的電橋而 互相連接。於該跨接點及迴圈42之間會網印一由介電油墨 所組成的絕緣帶。 電子模組或晶片50係固定於天線支撐體4〇之上，並 且直接連接至該天線的焊墊36與38,由於導電黏著層的 關係，因而便可達到歐姆接觸的目的。應該注意的係雖然 根據本發明製作而成的無接觸卡可配備一電子模組或是單 曰曰片，不過，下文所述的較佳實施例則係關於具有單一 晶片的無接觸卡。所以，該晶片的焊墊（圖中未顯示）會接 觸到該天線的焊墊36與38。利用導電黏著劑或是直接接 觸而不使用任何的黏著劑皆可達到歐姆連接的目的。天線 支撐體40還包括兩個凹口 52與54，如圖2所示，較佳係 於網印該天線之後才形成該等凹口。該等兩個凹口可用以 增強電子模組或晶片50的機械強度。 因為該天線以及該晶片的關係，所以天線支樓體4〇會 具有截斷部及/或通孔以及起伏形狀。因此，天線支樓體 4〇的兩個表面皆不平坦，更明確地說’上面有網印該天線 的表面會不平坦。 據本毛月之方法的後續步驟為於天轉支樓體40之上 層熱塑性塑膠層或薄片。此步驟為該卡片各個組成 :的第一層合階段，其剖面圖結果如® 3所示。此第一層 拼^驟係於及天線支撑體4Q的每_側上藉由熱壓合兩片均 貝的熱塑性塑膠薄片62與64來進行熔化。該溫度座壓力 分別約為⑽t及25()Pa。酉己置於該天線支撑體表面上用 从接收晶片50的熱塑性塑膠薄片62被打出一通孔56,而 且其厚度比電子模組或晶片5。的厚度至少高iB 5%。通孔 2係位於熱塑性塑膠薄片62之上因此當於進行層合之 ⑴將薄片62放置於支樓體4G之上的話，該電子模組或晶 片5〇便會位於其内部，使得電子模組或晶片50不會與薄 片62產生接觸。通孔56較佳的形狀為圓形。如果將厚度 8 〇 # m且面積為1 · 5mm2的晶片50直接連接至該天線的 話’那麼熱塑性塑夥層62的厚度便會等於2〇Mm，而通 孔56的直徑便會等於3mm。 因此於弟一層合步驟期間’該壓力係施加於熱塑性 塑膠薄片62或64之上，而非施加於晶片5〇之上，因此該 曰曰片50並不會受到任何會造成其損壞的應力作用。該溫度 必須足以讓薄片62與64的材料軟化而且可以完全流動， 以填補凹口 52與54以及支撐體40之中其它可能的截斷部 ’並且填補通孔56’以及困住該天線支撐體產生之起伏形 狀（例如因該天線的迴圈42與44所造成的起伏形狀）。 因此’便可於整片熱塑性塑膠中困住天線支撐體的 起伏形狀’從而形成一厚度約等於4〇〇//|11的塑化天線支撐 10 1328773 體6〇。先前製造於該天線支撑體上的可能的截斷部進一 # · 可讓兩片熱塑性塑膠薄片62與64以更佳的狀態炫化在一 起所生成的塑化天線支撐體60便可消除原來的天線支撐 體40中任何的厚度差異。 >考圖4，。亥卡片的各個組成層的第二層合階段係在 該塑化天線支撐體6〇的每一側上層合兩個卡片主體。此第 二步驟係在熱塑性塑膠薄片62肖64凝固所需要的時間& _ 度之後的一段特定時間長度以後來實施，其係藉由献壓人 兩層熱塑性塑膠層66請其厚度約等於〜)來進彳 · 熔化，用以於支撐體60的塑化平坦表面上製作該等卡片主 體。卡片主體66與68兩者皆已經於其外部表面上事先印 製該卡片的自有圖像。因為塑化天線支撐體6〇具有均勻的 厚度，所以此步驟比較類似於黏著結合，而非熔化。因此 ’此階段中所需要的壓力與溫度會遠低於傳統方法中所使 用的壓力與溫度。此層合步驟所需要的溫度與壓力僅分別 約為^^匚及150Pa。再者，加壓與加熱循環的持續時間同 樣也會縮短。 m 於進行第一層合步驟之前可先將熱塑性塑膠薄片Μ、 64裁切成最終晶片卡的尺寸。亦可於進行第—層合步驟之 後再將其裁切成最終晶片卡的尺寸。於後者情況中，係在 進行第一層合步驟之後才將塑化天線支撐體6〇裁切成該卡 片的尺寸，不過，並未脫離本發明的範_。 根據本發明的變化例’配置於該天線支撑體中與用 以接收電子模組或晶片50相反表面上的熱塑性塑膠薄片 11 1328773 64也可打出一通孔58。通孔58係位於熱孿性塑膠薄片64 之上’因此其係疊置於電子模組或晶片50的位置之上。於 :匕情況中，在第一層合步驟期間，該晶片可受到完全的保 濩，避免受到因施加於該等熱塑性塑膠薄片62與Μ之上 的壓力所引起的任何應力的破壞。 〃 根據應用於無接觸晶片卡之本發明的方法的第二變化 例為通孔56的面積太大，而無法於第—層合步驟期間被熱 塑性塑膠薄片62的材料補滿。於此情況中，於第一層合步 驟之後所獲得的天線支撐體6〇將會因通孔％的關二包 含-空洞，所以便不平坦。所以，支樓體6〇可於通孔Μ 的位置處接收環氧樹脂型的樹脂，用以保護電子模組或晶 片50，並且讓塑化天線支撐體60變得更為平坦。 /亥等卡片i體之組成層所使用#熱塑性塑膠最佳的係 聚氣乙烯(PVC) ’不過亦可使用下面的熱塑性塑膠：聚酯 (PET、PETG)、聚丙烯(PP)、聚碳酸酯(pc)或丙烯牘-丁二 烯-苯乙烯（ABS)。 必須提出的係··由塑膠支樓體(例如聚醋或聚醯胺)或 環乳樹脂玻璃支樓體上的金屬迴圈製作而成的天線，相較 於其支#體同樣也會呈現出起伏形狀。所以，本發明可應 用於任何類型的天線支撐體以及任何類型的天線，尤其是 其上的天線呈現出起伏形狀的支揮體。不論溫度為何，用 以製作本發明之天線支撑體的材料的尺寸都必須維持穩定 ’特別是能夠耐受約18(rc的溫度而不會產生變形或變化 的材料。 12 1^28773 【圖式簡單說明】 圖】所示的' r'…、接觸晶片卡的天線支撑體的示意圖， 圖2所示的在.几#1328773 发明Invention Description: TECHNICAL FIELD The present invention relates to a method of manufacturing a contactless wafer card, and more particularly to a method of manufacturing a contactless wafer card that enhances flatness. [Prior Art] A contactless chip card is a system that is gradually used in various fields. Therefore, in the field of transportation, it has been developed into a payment institution. The same application can also be found in the e-wallet. Many companies have also developed organizations that use contactless chip cards to identify their employees. The contactless card can be achieved by remote electromagnetic coupling between the antenna located in the contactless card and another antenna located in the card reader or by directly touching the card with the card reader. The purpose of information exchange with the associated reading device. To generate, store, and process the information, the card is equipped with a chip that is coupled to the antenna. The antenna is located between the two card bodies: an outer surface of the body is printed with a θ image associated with the future use of the card. The antenna support system is a plastic t-substrate or a support made of fiber material such as paper. In a contactless crystal card using an antenna support made of a fiber material, an edge antenna is screen printed on the antenna support and the wafer is fixed on the antenna support such that the two terminals thereof Connect to two antenna terminals. Next, during the laminating step, the pvc layer constituting the card body is placed on either side of the antenna baffle. Then, the laminate is subjected to $〇 and then the laminate is subjected to a heat treatment of 1318773 at a temperature of about 15 (at the same time, the laminate is simultaneously pressed to melt the different layers. Under the combined action, the PVC layers will soften and the inner layers will be fluidized. Therefore, the fluidized PVC inside the card body that comes into contact with the antenna support traps the antenna and the wafer, and the two card bodies The liquid PVC will be in contact with each other through the through-hole cut-offs previously made in the antenna body. Unfortunately, the above method has several disadvantages, especially the disadvantage that the final form of the card is not aesthetically pleasing. During fluidization of the inner layer of the card body, the outer layer is softened, and the degree of deformation is less than the degree of deformation of the inner layer of the pvc, and the antenna support caused by the thickness of the antenna, the wafer, and the through-cut portion of the through hole. The undulating shape of the body is consistent. Essentially, the microscopic undulating shape cannot be seen by the naked eye, but when the outer surface of the outer layer of the card body is printed, the undulations The shape causes a change in hue in the color of the printed image. More specifically, in the case of the printed card body, during the lamination step of laminating the card body to the antenna support, it is too large The thickness of the embossing point will cause the color to become brighter; and the cut-off portion of the antenna support (the PVC of the inner layer of the card body will flow into it) will cause the embossed dots to become It is closer, thus making the color darker. Although it does not affect the card operation, users who are extremely demanding in aesthetic conditions will still find the appearance of the final card. Another disadvantage is that when the wafer is placed directly on the antenna support, it may be destroyed by the pressure experienced during the lamination step. In the use of the module (that is, to place the wafer) This problem can be solved by the premise of 1328773. In this case, the wafer can be connected to the circuit using a gold wire ("wire"). Then it can be coated with epoxy resin. The wafer and the lines are protected to protect them. Of course, such a solution must take a long time and is difficult and expensive. [Invention] Therefore, the object of the present invention is to directly place the wafer. The technology above the antenna support achieves the method of manufacturing a contactless card while protecting the wafer from being damaged during the manufacturing process of the contactless card. Therefore, the present invention relates to a method for manufacturing a contactless chip card. The chip card includes an antenna support on which the antenna is placed by means of a screen, and a wafer including two terminals connected to the antenna, and at least two card bodies located on either side of the antenna support a thermoplastic plastic sheet configured by a thermal lamination method under pressure. The thermoplastic I. green plastic sheet (which is disposed on the surface of the antenna support on which the wafer is located) is punched through a through hole. And the thickness thereof is at least 10% higher than the thickness of the wafer, and the position of the through hole is perpendicular to the wafer, so when the lamination step is performed Before the sheet was placed over the building body of the antenna branch, then the wafer would be positioned inside the through hole, and thus does not allow the wafer to the bonding layer is subjected during the step of any pressure. [Embodiment] The objects, objects, and features of the present invention will become more apparent from the description of the appended claims. According to the preferred embodiment of the present invention shown in FIG. 1, the antenna support y fiber, the quasi-material (for example, paper) is made to be a, and the thickness is about A 90" m according to the invention. The Vision antenna is made of two screen printing polymer conductive ink loops 42 and 44 t, which are coated with electric wires, such as silver, copper or carbon. Each loop 'eight turns is connected to one of the pads of the same screen printed antenna, back ', will be connected to the pad 36' and the loop 44 will be connected to the pad 38. The cans will pass through one The bridges, often referred to as jumpers (not shown in the figure), are interconnected. An insulating tape composed of dielectric ink is screen printed between the jumper and the loop 42. The wafer 50 is fixed on the antenna support 4〇, and is directly connected to the pads 36 and 38 of the antenna, and the ohmic contact can be achieved due to the relationship of the conductive adhesive layer. It should be noted that although according to the present invention The contactless card can be equipped with an electronic module or a single cymbal, however, as described below. The embodiment is directed to a contactless card having a single wafer. Therefore, the pad of the wafer (not shown) will contact the pads 36 and 38 of the antenna. The conductive adhesive or direct contact is used without any use. The adhesive support can achieve the purpose of ohmic connection. The antenna support 40 further includes two recesses 52 and 54, as shown in Fig. 2, preferably after the screen is printed on the antenna to form the recesses. The recesses can be used to enhance the mechanical strength of the electronic module or wafer 50. Because of the relationship between the antenna and the wafer, the antenna support body 4 has a cut-off portion and/or a through-hole and an undulating shape. Therefore, the antenna branch The two surfaces of the body 4 are not flat, more specifically, the surface of the antenna on which the screen is printed may be uneven. The subsequent step of the method according to the method of the present month is to apply a thermoplastic layer on the top of the body 40. Or a sheet. This step is the first lamination phase of the card composition: the cross-sectional result is shown as ® 3. This first layer is tied to each side of the antenna support 4Q by heat. Pressing two pieces of uniform thermoplastic The sheets 62 and 64 are melted. The temperature seat pressures are about (10) t and 25 () Pa, respectively. The surface of the antenna support is placed on the surface of the antenna support with a through hole 56 punched from the thermoplastic plastic sheet 62 of the receiving wafer 50, and The thickness is at least 5% higher than the thickness of the electronic module or the wafer 5. The through hole 2 is located above the thermoplastic plastic sheet 62. Therefore, when the laminate is placed (1) to place the sheet 62 on the support body 4G, The electronic module or wafer 5 will be located inside so that the electronic module or wafer 50 does not come into contact with the sheet 62. The through hole 56 is preferably circular in shape if the thickness is 8 〇# m and the area is 1 · If the 5mm2 wafer 50 is directly connected to the antenna, then the thickness of the thermoplastic plastic layer 62 will be equal to 2 〇Mm, and the diameter of the through hole 56 will be equal to 3 mm. Therefore, during the step of the first layer, the pressure is applied to the thermoplastic plastic sheet 62 or 64 instead of being applied to the wafer 5, so that the sheet 50 is not subjected to any stress which causes damage. . The temperature must be sufficient to soften the material of the sheets 62 and 64 and to flow completely to fill the notches 52 and 54 and other possible cut-offs in the support 40 and fill the through holes 56' and trap the antenna support. The undulating shape (for example, the undulating shape caused by the loops 42 and 44 of the antenna). Therefore, the undulating shape of the antenna support can be trapped in the entire thermoplastic sheet to form a plasticized antenna support 10 1328773 body 6 having a thickness of about 4 Å//|11. The possible truncated portion previously fabricated on the antenna support can eliminate the original antenna by allowing the two thermoplastic sheets 62 and 64 to be spliced together in a better state to form the plasticized antenna support 60. Any difference in thickness in the support 40. > Test Figure 4. The second lamination phase of each of the constituent layers of the Hai card is to laminate two card bodies on each side of the plasticized antenna support 6〇. This second step is carried out after a certain length of time after the time & _ degree required for the thermoplastic sheet 62 to be solidified, by applying two layers of thermoplastic layer 66 to the thickness of the thermoplastic sheet 66. The melt is applied to form the card body on the plasticized flat surface of the support 60. Both card bodies 66 and 68 have previously printed their own images of the card on their exterior surfaces. Since the plasticized antenna support 6 has a uniform thickness, this step is more similar to adhesive bonding than melting. Therefore, the pressure and temperature required in this stage will be much lower than the pressure and temperature used in conventional methods. The temperature and pressure required for this lamination step are only about ^^ and 150 Pa, respectively. Furthermore, the duration of pressurization and heating cycles is also reduced. m The thermoplastic sheet Μ, 64 may be first cut to the size of the final wafer card prior to the first lamination step. It can also be cut to the size of the final wafer card after the first lamination step. In the latter case, the plasticized antenna support 6 is cut into the size of the card after the first lamination step, but does not deviate from the scope of the present invention. A through hole 58 can also be formed in accordance with a variation of the present invention disposed in the antenna support and a thermoplastic plastic sheet 11 1328773 64 on the opposite side of the surface from which the electronic module or wafer 50 is received. The through holes 58 are located above the thermal plastic sheet 64 so that they are stacked over the electronic module or wafer 50. In the case of 匕, during the first lamination step, the wafer is completely protected from any stress damage caused by the pressure applied to the thermoplastic sheet 62 and the crucible.第二 According to a second variant of the method of the invention applied to a contactless wafer card, the area of the vias 56 is too large to be filled by the material of the thermoplastic sheet 62 during the first lamination step. In this case, the antenna support body 6 obtained after the first lamination step will be uneven due to the pass-through of the through-hole %. Therefore, the support body 6 接收 can receive the epoxy resin type at the position of the through hole , to protect the electronic module or the wafer 50 and to make the plasticized antenna support 60 flatter. /Hai and other cards used in the body layer of the body # thermoplastic thermoplastics best polyester gas (PVC) 'but can also use the following thermoplastics: polyester (PET, PETG), polypropylene (PP), polycarbonate Ester (pc) or acrylonitrile-butadiene-styrene (ABS). The system that must be proposed is an antenna made of a metal ring on a plastic branch (such as polyester or polyamide) or a ring-shaped resin glass slab, which is also presented in comparison with its support. Out of the undulating shape. Therefore, the present invention is applicable to any type of antenna support as well as any type of antenna, and in particular, the antenna thereon exhibits an undulating shape of the body. Regardless of the temperature, the material used to make the antenna support of the present invention must be dimensionally stable 'especially a material capable of withstanding a temperature of about 18 (rc without deformation or change.) 12 1^28773 Brief Description] The diagram shows the 'r'..., the schematic diagram of the antenna support that contacts the chip card, as shown in Figure 2.
解描# Μ &者圖1所示之天線支撐體的轴線B-B 所獲得的剖面圖， 斤示的係一無接觸晶片卡的塑化天線支擇體 面圖， σ 圖4所示的係根據本發明之無接觸晶片卡的剖面圖。 【元件符號說明】 36，38 40 42, 44 50 52, 54 56, 58 60 62, 64 66, 68 焊墊 天線支撐體 迴圈 電子模組或晶片 凹口 通孔 塑化天線支撐體 熱塑性塑膠薄片 熱塑性塑膠層（卡片主體） 13解 amp amp 者 者 者 图 图 图 图 图 图 图 图 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线 天线A cross-sectional view of a contactless wafer card in accordance with the present invention. [Component Symbol Description] 36,38 40 42, 44 50 52, 54 56, 58 60 62, 64 66, 68 Pad Antenna Support Loop Electronic Module or Wafer Notch Through Hole Plasticized Antenna Support Thermoplastic Sheet Thermoplastic plastic layer (card body) 13