FR2795202B1 - Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact - Google Patents
Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contactInfo
- Publication number
- FR2795202B1 FR2795202B1 FR9907553A FR9907553A FR2795202B1 FR 2795202 B1 FR2795202 B1 FR 2795202B1 FR 9907553 A FR9907553 A FR 9907553A FR 9907553 A FR9907553 A FR 9907553A FR 2795202 B1 FR2795202 B1 FR 2795202B1
- Authority
- FR
- France
- Prior art keywords
- card
- contact
- communication interface
- contactless communication
- manufacturing cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9907553A FR2795202B1 (fr) | 1999-06-15 | 1999-06-15 | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact |
AU52289/00A AU5228900A (en) | 1999-06-15 | 2000-05-30 | Cards and method for making cards having a communication interface with and without contact |
PCT/FR2000/001489 WO2000077728A1 (fr) | 1999-06-15 | 2000-05-30 | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9907553A FR2795202B1 (fr) | 1999-06-15 | 1999-06-15 | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2795202A1 FR2795202A1 (fr) | 2000-12-22 |
FR2795202B1 true FR2795202B1 (fr) | 2001-08-31 |
Family
ID=9546806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9907553A Expired - Fee Related FR2795202B1 (fr) | 1999-06-15 | 1999-06-15 | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5228900A (fr) |
FR (1) | FR2795202B1 (fr) |
WO (1) | WO2000077728A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE302473T1 (de) | 2000-01-19 | 2005-09-15 | Fractus Sa | Raumfüllende miniaturantenne |
EP1415270B1 (fr) * | 2001-07-31 | 2016-08-03 | Quotainne Enterprises LLC | Support de donnees dote d'un ensemble de contacts |
AU2002340506A1 (en) | 2002-11-07 | 2004-06-07 | Fractus, S.A. | Integrated circuit package including miniature antenna |
WO2006008180A1 (fr) | 2004-07-23 | 2006-01-26 | Fractus S.A. | Antenne dans un boitier a interaction electromagnetique reduite avec des elements integres sur la puce |
WO2007147629A1 (fr) | 2006-06-23 | 2007-12-27 | Fractus, S.A. | Module de puce, carte sim, dispositif sans fil et procédé de communication sans fil |
US8738103B2 (en) | 2006-07-18 | 2014-05-27 | Fractus, S.A. | Multiple-body-configuration multimedia and smartphone multifunction wireless devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
EP0818752A2 (fr) * | 1996-07-08 | 1998-01-14 | Fela Holding AG | Carte à circuits (Inlet) pour des cartes à puces |
FR2764414B1 (fr) * | 1997-06-10 | 1999-08-06 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
-
1999
- 1999-06-15 FR FR9907553A patent/FR2795202B1/fr not_active Expired - Fee Related
-
2000
- 2000-05-30 AU AU52289/00A patent/AU5228900A/en not_active Abandoned
- 2000-05-30 WO PCT/FR2000/001489 patent/WO2000077728A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2795202A1 (fr) | 2000-12-22 |
AU5228900A (en) | 2001-01-02 |
WO2000077728A1 (fr) | 2000-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2769390B1 (fr) | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact | |
FR2867589B1 (fr) | Procede de fabrication de carte a puce sans contact et carte a puce sans contact | |
FR2768880B1 (fr) | Demodulateur pour carte a puce sans contact | |
HK1048198B (zh) | 可變電容耦合天線和其製造方法以及無接觸芯片卡 | |
FR2824939B1 (fr) | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede | |
FR2716281B1 (fr) | Procédé de fabrication d'une carte sans contact. | |
FR2716555B1 (fr) | Procédé de fabrication d'une carte sans contact. | |
AU3310900A (en) | Contactless smart card reader | |
FR2778475B1 (fr) | Carte a memoire du type sans contact, et procede de fabrication d'une telle carte | |
DE60105905D1 (de) | Datenkommunikationsverfahren mit Chipkarte | |
ZA200103067B (en) | Optical and smart card identification reader. | |
FR2664406B1 (fr) | Carte de circuit integre sans contact. | |
DE69801575D1 (de) | Kontaktlose chipkarte mit rf-kommunikationsmitteln | |
FR2724477B1 (fr) | Procede de fabrication de cartes sans contact | |
NO20020015D0 (no) | Smartkort-leser | |
DE69926286D1 (de) | Kartenleser/-schreiber und Kommunikationsverfahren | |
FR2663764B1 (fr) | Carte sans contact. | |
FR2795202B1 (fr) | Carte et procede de fabrication de cartes ayant une interface de communication a contact et sans contact | |
FR2786902B1 (fr) | Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication | |
DE60042506D1 (de) | Chipkartenleser | |
FR2735929B1 (fr) | Carte sans contact passive | |
FR2764414B1 (fr) | Procede de fabrication de carte a puce sans contact | |
FR2859559B1 (fr) | Lecteur de carte sans contact | |
AU3061700A (en) | Smart card and reader/writer | |
FR2776448B1 (fr) | Terminal de telecommunication lecteur de carte a puce |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100226 |