FR2837982B1 - Module de circuits integres et procede de fabrication correspondant - Google Patents

Module de circuits integres et procede de fabrication correspondant

Info

Publication number
FR2837982B1
FR2837982B1 FR0203766A FR0203766A FR2837982B1 FR 2837982 B1 FR2837982 B1 FR 2837982B1 FR 0203766 A FR0203766 A FR 0203766A FR 0203766 A FR0203766 A FR 0203766A FR 2837982 B1 FR2837982 B1 FR 2837982B1
Authority
FR
France
Prior art keywords
manufacturing
same
integrated circuit
circuit module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0203766A
Other languages
English (en)
Other versions
FR2837982A1 (fr
Inventor
Bruno Reig
Carine Marcoux
Marie Jose Molino
Jean Luc Valard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR0203766A priority Critical patent/FR2837982B1/fr
Priority to PCT/FR2003/000941 priority patent/WO2003081669A1/fr
Priority to AU2003236870A priority patent/AU2003236870A1/en
Publication of FR2837982A1 publication Critical patent/FR2837982A1/fr
Application granted granted Critical
Publication of FR2837982B1 publication Critical patent/FR2837982B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0203766A 2002-03-26 2002-03-26 Module de circuits integres et procede de fabrication correspondant Expired - Fee Related FR2837982B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0203766A FR2837982B1 (fr) 2002-03-26 2002-03-26 Module de circuits integres et procede de fabrication correspondant
PCT/FR2003/000941 WO2003081669A1 (fr) 2002-03-26 2003-03-25 Module de circuits integres et procede de fabrication correspondant
AU2003236870A AU2003236870A1 (en) 2002-03-26 2003-03-25 Integrated circuit module and method for making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0203766A FR2837982B1 (fr) 2002-03-26 2002-03-26 Module de circuits integres et procede de fabrication correspondant

Publications (2)

Publication Number Publication Date
FR2837982A1 FR2837982A1 (fr) 2003-10-03
FR2837982B1 true FR2837982B1 (fr) 2005-02-18

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AU (1) AU2003236870A1 (fr)
FR (1) FR2837982B1 (fr)
WO (1) WO2003081669A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9299634B2 (en) 2006-05-16 2016-03-29 Broadcom Corporation Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US9013035B2 (en) 2006-06-20 2015-04-21 Broadcom Corporation Thermal improvement for hotspots on dies in integrated circuit packages
FR2917236B1 (fr) * 2007-06-07 2009-10-23 Commissariat Energie Atomique Procede de realisation de via dans un substrat reconstitue.
CN102169840A (zh) * 2011-01-30 2011-08-31 南通富士通微电子股份有限公司 ***级扇出晶圆封装方法
DE102012206289B4 (de) * 2012-04-17 2016-02-25 Forschungsverbund Berlin E.V. Halbleiterbauelement-Verbundstruktur mit Wärmeableitstruktur und dazugehöriges Herstellungsverfahren

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Publication number Priority date Publication date Assignee Title
US5151776A (en) * 1989-03-28 1992-09-29 General Electric Company Die attachment method for use in high density interconnected assemblies
DE3925604A1 (de) * 1989-08-02 1991-02-07 Siemens Ag Kontaktierung von ungehaeusten halbleiterschaltungen auf substraten
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5561085A (en) * 1994-12-19 1996-10-01 Martin Marietta Corporation Structure for protecting air bridges on semiconductor chips from damage
US6084308A (en) * 1998-06-30 2000-07-04 National Semiconductor Corporation Chip-on-chip integrated circuit package and method for making the same

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FR2837982A1 (fr) 2003-10-03
WO2003081669A1 (fr) 2003-10-02
AU2003236870A1 (en) 2003-10-08

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