AU2003236870A1 - Integrated circuit module and method for making same - Google Patents
Integrated circuit module and method for making sameInfo
- Publication number
- AU2003236870A1 AU2003236870A1 AU2003236870A AU2003236870A AU2003236870A1 AU 2003236870 A1 AU2003236870 A1 AU 2003236870A1 AU 2003236870 A AU2003236870 A AU 2003236870A AU 2003236870 A AU2003236870 A AU 2003236870A AU 2003236870 A1 AU2003236870 A1 AU 2003236870A1
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuit
- circuit module
- making same
- making
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0203766A FR2837982B1 (en) | 2002-03-26 | 2002-03-26 | INTEGRATED CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME |
FR02/03766 | 2002-03-26 | ||
PCT/FR2003/000941 WO2003081669A1 (en) | 2002-03-26 | 2003-03-25 | Integrated circuit module and method for making same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003236870A1 true AU2003236870A1 (en) | 2003-10-08 |
Family
ID=27839200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003236870A Abandoned AU2003236870A1 (en) | 2002-03-26 | 2003-03-25 | Integrated circuit module and method for making same |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003236870A1 (en) |
FR (1) | FR2837982B1 (en) |
WO (1) | WO2003081669A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9299634B2 (en) | 2006-05-16 | 2016-03-29 | Broadcom Corporation | Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages |
US9013035B2 (en) | 2006-06-20 | 2015-04-21 | Broadcom Corporation | Thermal improvement for hotspots on dies in integrated circuit packages |
FR2917236B1 (en) * | 2007-06-07 | 2009-10-23 | Commissariat Energie Atomique | METHOD FOR PRODUCING VIA IN A RECONSTITUTED SUBSTRATE |
CN102169840A (en) * | 2011-01-30 | 2011-08-31 | 南通富士通微电子股份有限公司 | Encapsulation method of system level fan-out wafer |
DE102012206289B4 (en) * | 2012-04-17 | 2016-02-25 | Forschungsverbund Berlin E.V. | Semiconductor device composite structure with heat dissipation structure and associated manufacturing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5151776A (en) * | 1989-03-28 | 1992-09-29 | General Electric Company | Die attachment method for use in high density interconnected assemblies |
DE3925604A1 (en) * | 1989-08-02 | 1991-02-07 | Siemens Ag | Contacting housing-less semiconductor circuits or substrate - forms depressions in substrate such that circuit surfaces lie in substrate surface plane |
US5111278A (en) * | 1991-03-27 | 1992-05-05 | Eichelberger Charles W | Three-dimensional multichip module systems |
US5353498A (en) * | 1993-02-08 | 1994-10-11 | General Electric Company | Method for fabricating an integrated circuit module |
US5561085A (en) * | 1994-12-19 | 1996-10-01 | Martin Marietta Corporation | Structure for protecting air bridges on semiconductor chips from damage |
US6084308A (en) * | 1998-06-30 | 2000-07-04 | National Semiconductor Corporation | Chip-on-chip integrated circuit package and method for making the same |
-
2002
- 2002-03-26 FR FR0203766A patent/FR2837982B1/en not_active Expired - Fee Related
-
2003
- 2003-03-25 WO PCT/FR2003/000941 patent/WO2003081669A1/en not_active Application Discontinuation
- 2003-03-25 AU AU2003236870A patent/AU2003236870A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2837982A1 (en) | 2003-10-03 |
FR2837982B1 (en) | 2005-02-18 |
WO2003081669A1 (en) | 2003-10-02 |
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