AU2003236870A1 - Integrated circuit module and method for making same - Google Patents

Integrated circuit module and method for making same

Info

Publication number
AU2003236870A1
AU2003236870A1 AU2003236870A AU2003236870A AU2003236870A1 AU 2003236870 A1 AU2003236870 A1 AU 2003236870A1 AU 2003236870 A AU2003236870 A AU 2003236870A AU 2003236870 A AU2003236870 A AU 2003236870A AU 2003236870 A1 AU2003236870 A1 AU 2003236870A1
Authority
AU
Australia
Prior art keywords
integrated circuit
circuit module
making same
making
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003236870A
Inventor
Carine Marcoux
Marie-Jose Molino
Bruno Reig
Jean-Luc Valard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Publication of AU2003236870A1 publication Critical patent/AU2003236870A1/en
Abandoned legal-status Critical Current

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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2003236870A 2002-03-26 2003-03-25 Integrated circuit module and method for making same Abandoned AU2003236870A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0203766A FR2837982B1 (en) 2002-03-26 2002-03-26 INTEGRATED CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME
FR02/03766 2002-03-26
PCT/FR2003/000941 WO2003081669A1 (en) 2002-03-26 2003-03-25 Integrated circuit module and method for making same

Publications (1)

Publication Number Publication Date
AU2003236870A1 true AU2003236870A1 (en) 2003-10-08

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AU2003236870A Abandoned AU2003236870A1 (en) 2002-03-26 2003-03-25 Integrated circuit module and method for making same

Country Status (3)

Country Link
AU (1) AU2003236870A1 (en)
FR (1) FR2837982B1 (en)
WO (1) WO2003081669A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9299634B2 (en) 2006-05-16 2016-03-29 Broadcom Corporation Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US9013035B2 (en) 2006-06-20 2015-04-21 Broadcom Corporation Thermal improvement for hotspots on dies in integrated circuit packages
FR2917236B1 (en) * 2007-06-07 2009-10-23 Commissariat Energie Atomique METHOD FOR PRODUCING VIA IN A RECONSTITUTED SUBSTRATE
CN102169840A (en) * 2011-01-30 2011-08-31 南通富士通微电子股份有限公司 Encapsulation method of system level fan-out wafer
DE102012206289B4 (en) * 2012-04-17 2016-02-25 Forschungsverbund Berlin E.V. Semiconductor device composite structure with heat dissipation structure and associated manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151776A (en) * 1989-03-28 1992-09-29 General Electric Company Die attachment method for use in high density interconnected assemblies
DE3925604A1 (en) * 1989-08-02 1991-02-07 Siemens Ag Contacting housing-less semiconductor circuits or substrate - forms depressions in substrate such that circuit surfaces lie in substrate surface plane
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5561085A (en) * 1994-12-19 1996-10-01 Martin Marietta Corporation Structure for protecting air bridges on semiconductor chips from damage
US6084308A (en) * 1998-06-30 2000-07-04 National Semiconductor Corporation Chip-on-chip integrated circuit package and method for making the same

Also Published As

Publication number Publication date
FR2837982A1 (en) 2003-10-03
FR2837982B1 (en) 2005-02-18
WO2003081669A1 (en) 2003-10-02

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MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase