FR2834384B1 - Emetteur-recepteur optique, connecteur, unite de substrat, emetteur optique, recepteur optique et dispositif a semiconducteurs. - Google Patents
Emetteur-recepteur optique, connecteur, unite de substrat, emetteur optique, recepteur optique et dispositif a semiconducteurs.Info
- Publication number
- FR2834384B1 FR2834384B1 FR0216803A FR0216803A FR2834384B1 FR 2834384 B1 FR2834384 B1 FR 2834384B1 FR 0216803 A FR0216803 A FR 0216803A FR 0216803 A FR0216803 A FR 0216803A FR 2834384 B1 FR2834384 B1 FR 2834384B1
- Authority
- FR
- France
- Prior art keywords
- optical
- connector
- semiconductor device
- substrate unit
- transceiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001399654 | 2001-12-28 | ||
JP2002084164A JP4197234B2 (ja) | 2001-12-28 | 2002-03-25 | 光通信器 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2834384A1 FR2834384A1 (fr) | 2003-07-04 |
FR2834384B1 true FR2834384B1 (fr) | 2007-02-16 |
Family
ID=26625372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0216803A Expired - Fee Related FR2834384B1 (fr) | 2001-12-28 | 2002-12-27 | Emetteur-recepteur optique, connecteur, unite de substrat, emetteur optique, recepteur optique et dispositif a semiconducteurs. |
Country Status (3)
Country | Link |
---|---|
US (2) | US6937824B2 (fr) |
JP (1) | JP4197234B2 (fr) |
FR (1) | FR2834384B1 (fr) |
Families Citing this family (34)
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JP2005044963A (ja) * | 2003-07-28 | 2005-02-17 | Tdk Corp | レーザダイオードモジュール |
JP2005165165A (ja) * | 2003-12-05 | 2005-06-23 | Suzuka Fuji Xerox Co Ltd | レセプタクル及びレセプタクルの製造方法 |
JP2005197659A (ja) * | 2003-12-08 | 2005-07-21 | Sony Corp | 光学装置及び画像生成装置 |
US20050201065A1 (en) * | 2004-02-13 | 2005-09-15 | Regnier Kent E. | Preferential ground and via exit structures for printed circuit boards |
US8238699B2 (en) * | 2005-03-04 | 2012-08-07 | Finisar Corporation | Semiconductor-based optical transceiver |
JP4496240B2 (ja) * | 2007-08-10 | 2010-07-07 | 株式会社東芝 | インターフェイスモジュール付きlsiパッケージ |
KR101404529B1 (ko) * | 2008-01-30 | 2014-06-09 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 플라즈몬 증강 발광 다이오드 |
JP2009260126A (ja) * | 2008-04-18 | 2009-11-05 | Hitachi Cable Ltd | 光通信器 |
US8837159B1 (en) * | 2009-10-28 | 2014-09-16 | Amazon Technologies, Inc. | Low-profile circuit board assembly |
JP5428978B2 (ja) * | 2010-03-19 | 2014-02-26 | 三菱電機株式会社 | 半導体光変調装置 |
CN102375185B (zh) * | 2010-08-20 | 2013-11-13 | 国碁电子(中山)有限公司 | 光收发器及其制造方法 |
DK2431778T3 (en) * | 2010-09-17 | 2017-01-16 | Gigoptix-Helix Ag | Flexible configurable optical subunit |
US9036675B2 (en) * | 2011-02-25 | 2015-05-19 | Rohm Co. Ltd. | Communication module and portable electronic device |
CN103168396B (zh) * | 2011-07-01 | 2016-10-19 | 申泰公司 | 用于ic封装的收发机和接口 |
CN103814314B (zh) * | 2011-09-29 | 2016-10-12 | 富士通株式会社 | 光模块 |
JP2014135360A (ja) * | 2013-01-09 | 2014-07-24 | Panasonic Corp | 光電気変換装置 |
US9235017B1 (en) * | 2014-10-01 | 2016-01-12 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver with a heat dissipating structure |
JP6229649B2 (ja) * | 2014-12-08 | 2017-11-15 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
JP6654364B2 (ja) * | 2015-06-12 | 2020-02-26 | 日本ルメンタム株式会社 | 光モジュール |
JP6627397B2 (ja) * | 2015-10-09 | 2020-01-08 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール及び光伝送装置 |
US10050409B2 (en) * | 2016-09-22 | 2018-08-14 | Innovative Micro Technology | Microfabricated optical apparatus with grounded metal layer |
JP7069558B2 (ja) * | 2017-03-31 | 2022-05-18 | 住友大阪セメント株式会社 | 光通信モジュール及びそれに用いる光変調器 |
JP7013880B2 (ja) * | 2018-01-12 | 2022-02-01 | 住友大阪セメント株式会社 | 光変調器、及び光送信装置 |
JP7013879B2 (ja) | 2018-01-12 | 2022-02-01 | 住友大阪セメント株式会社 | 光変調器、及びそれを用いた光送信装置 |
JP7013942B2 (ja) * | 2018-02-28 | 2022-02-01 | 住友大阪セメント株式会社 | 光変調器、及び光伝送装置 |
CN110247220B (zh) | 2018-03-07 | 2020-12-18 | 台达电子工业股份有限公司 | 连接件、连接件制作方法及信号引脚组合件 |
FR3079358B1 (fr) * | 2018-03-23 | 2020-12-25 | Schneider Electric Ind Sas | Equipement electrique et procede de mise a la terre pour un tel equipement |
JP7135382B2 (ja) * | 2018-03-30 | 2022-09-13 | 住友大阪セメント株式会社 | 光変調器、及び光送信装置 |
US10877330B2 (en) * | 2018-10-19 | 2020-12-29 | HKC Corporation Limited | Display device |
TWI736979B (zh) * | 2019-09-12 | 2021-08-21 | 啓碁科技股份有限公司 | 電子裝置及其主機板以及封裝系統模組 |
CN110618505A (zh) * | 2019-09-24 | 2019-12-27 | 武汉光迅科技股份有限公司 | 一种光接收端组件和光模块 |
JP2021114655A (ja) * | 2020-01-16 | 2021-08-05 | 株式会社フジクラ | 基板及びアンテナモジュール |
TWI820659B (zh) * | 2021-06-22 | 2023-11-01 | 達方電子股份有限公司 | 印刷電路結構 |
CN116306459B (zh) * | 2023-02-28 | 2024-06-04 | 本源科仪(成都)科技有限公司 | 量子芯片版图的引脚布置方法、***、介质及设备 |
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US7044657B2 (en) * | 2002-03-19 | 2006-05-16 | Finisar Corporation | Transistor outline package with exteriorly mounted resistors |
US7131850B2 (en) * | 2003-07-29 | 2006-11-07 | Intel Corporation | Socket for a microelectronic component having reduced electrical resistance and inductance |
US7077661B2 (en) * | 2004-02-18 | 2006-07-18 | Intel Corporation | Socket for having the same conductor inserts for signal, power and ground |
US6971887B1 (en) * | 2004-06-24 | 2005-12-06 | Intel Corporation | Multi-portion socket and related apparatuses |
-
2002
- 2002-03-25 JP JP2002084164A patent/JP4197234B2/ja not_active Expired - Lifetime
- 2002-12-02 US US10/307,285 patent/US6937824B2/en not_active Expired - Fee Related
- 2002-12-27 FR FR0216803A patent/FR2834384B1/fr not_active Expired - Fee Related
-
2005
- 2005-07-21 US US11/185,747 patent/US7955090B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7955090B2 (en) | 2011-06-07 |
JP2003258363A (ja) | 2003-09-12 |
JP4197234B2 (ja) | 2008-12-17 |
FR2834384A1 (fr) | 2003-07-04 |
US20050281528A1 (en) | 2005-12-22 |
US20030123818A1 (en) | 2003-07-03 |
US6937824B2 (en) | 2005-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20120831 |