FR2826510B1 - Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical - Google Patents

Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical

Info

Publication number
FR2826510B1
FR2826510B1 FR0207914A FR0207914A FR2826510B1 FR 2826510 B1 FR2826510 B1 FR 2826510B1 FR 0207914 A FR0207914 A FR 0207914A FR 0207914 A FR0207914 A FR 0207914A FR 2826510 B1 FR2826510 B1 FR 2826510B1
Authority
FR
France
Prior art keywords
vertical transistor
producing
memory device
transistor
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0207914A
Other languages
English (en)
Other versions
FR2826510A1 (fr
Inventor
Peter Hagemeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of FR2826510A1 publication Critical patent/FR2826510A1/fr
Application granted granted Critical
Publication of FR2826510B1 publication Critical patent/FR2826510B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H01L29/7926—Vertical transistors, i.e. transistors having source and drain not in the same horizontal plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66666—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
FR0207914A 2001-06-26 2002-06-26 Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical Expired - Lifetime FR2826510B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10130766A DE10130766B4 (de) 2001-06-26 2001-06-26 Vertikal-Transistor, Speicheranordnung sowie Verfahren zum Herstellen eines Vertikal-Transistors

Publications (2)

Publication Number Publication Date
FR2826510A1 FR2826510A1 (fr) 2002-12-27
FR2826510B1 true FR2826510B1 (fr) 2005-08-19

Family

ID=7689491

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0207914A Expired - Lifetime FR2826510B1 (fr) 2001-06-26 2002-06-26 Transistor vertical, dispositif de memoire ainsi que procede pour produire un transistor vertical

Country Status (5)

Country Link
US (1) US6768166B2 (fr)
CN (1) CN1265466C (fr)
DE (1) DE10130766B4 (fr)
FR (1) FR2826510B1 (fr)
GB (1) GB2380857B (fr)

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EP1530803A2 (fr) * 2002-06-21 2005-05-18 Micron Technology, Inc. Cellule de memoire nrom, groupement de cellules de memoire et dispositifs et procedes correspondants
US7750389B2 (en) * 2003-12-16 2010-07-06 Micron Technology, Inc. NROM memory cell, memory array, related devices and methods
KR100474850B1 (ko) * 2002-11-15 2005-03-11 삼성전자주식회사 수직 채널을 가지는 비휘발성 ｓｏｎｏｓ 메모리 및 그 제조방법
JP2004349291A (ja) * 2003-05-20 2004-12-09 Renesas Technology Corp 半導体装置およびその製造方法
US6963104B2 (en) * 2003-06-12 2005-11-08 Advanced Micro Devices, Inc. Non-volatile memory device
US6849481B1 (en) * 2003-07-28 2005-02-01 Chartered Semiconductor Manufacturing Ltd. Thyristor-based SRAM and method for the fabrication thereof
DE10350751B4 (de) * 2003-10-30 2008-04-24 Infineon Technologies Ag Verfahren zum Herstellen eines vertikalen Feldeffekttransistors und Feldeffekt-Speichertransistor, insbesondere FLASH-Speichertransistor
US6933558B2 (en) * 2003-12-04 2005-08-23 Advanced Micro Devices, Inc. Flash memory device
US7050330B2 (en) * 2003-12-16 2006-05-23 Micron Technology, Inc. Multi-state NROM device
US7241654B2 (en) * 2003-12-17 2007-07-10 Micron Technology, Inc. Vertical NROM NAND flash memory array
US20050208769A1 (en) * 2004-03-19 2005-09-22 Manish Sharma Semiconductor structure
US7423310B2 (en) * 2004-09-29 2008-09-09 Infineon Technologies Ag Charge-trapping memory cell and charge-trapping memory device
CN100403550C (zh) * 2005-08-05 2008-07-16 西安电子科技大学 垂直型宽禁带半导体器件结构及制作方法
KR100707217B1 (ko) 2006-05-26 2007-04-13 삼성전자주식회사 리세스-타입 제어 게이트 전극을 구비하는 반도체 메모리소자 및 그 제조 방법
KR20080035211A (ko) 2006-10-18 2008-04-23 삼성전자주식회사 리세스-타입 제어 게이트 전극을 구비하는 반도체 메모리소자
US7851848B2 (en) 2006-11-01 2010-12-14 Macronix International Co., Ltd. Cylindrical channel charge trapping devices with effectively high coupling ratios
US8546863B2 (en) * 2007-04-19 2013-10-01 Nxp B.V. Nonvolatile memory cell comprising a nanowire and manufacturing method thereof
US8633537B2 (en) 2007-05-25 2014-01-21 Cypress Semiconductor Corporation Memory transistor with multiple charge storing layers and a high work function gate electrode
US9449831B2 (en) 2007-05-25 2016-09-20 Cypress Semiconductor Corporation Oxide-nitride-oxide stack having multiple oxynitride layers
JP5460950B2 (ja) * 2007-06-06 2014-04-02 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP2010010596A (ja) * 2008-06-30 2010-01-14 Toshiba Corp 不揮発性半導体記憶装置及びその製造方法
US8153482B2 (en) * 2008-09-22 2012-04-10 Sharp Laboratories Of America, Inc. Well-structure anti-punch-through microwire device
JP2011066109A (ja) * 2009-09-16 2011-03-31 Unisantis Electronics Japan Ltd 半導体記憶装置
KR101085155B1 (ko) 2010-11-16 2011-11-18 서강대학교산학협력단 터널링 전계효과 트랜지스터를 이용한 1ｔ 디램 셀 소자
US8916920B2 (en) * 2011-07-19 2014-12-23 Macronix International Co., Ltd. Memory structure with planar upper surface
KR102215973B1 (ko) * 2012-07-01 2021-02-16 롱지튜드 플래쉬 메모리 솔루션즈 리미티드 다수의 전하 저장 층들을 갖는 메모리 트랜지스터
CN102931237B (zh) * 2012-10-10 2015-07-22 哈尔滨工程大学 垂直非对称环栅mosfet器件的结构及其制造方法
US9673209B2 (en) 2014-05-16 2017-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method for fabricating the same
CN105321885B (zh) * 2014-07-02 2018-04-13 旺宏电子股份有限公司 内存装置及其制造方法
US9799776B2 (en) 2015-06-15 2017-10-24 Stmicroelectronics, Inc. Semi-floating gate FET
US9805935B2 (en) 2015-12-31 2017-10-31 International Business Machines Corporation Bottom source/drain silicidation for vertical field-effect transistor (FET)
US10002962B2 (en) 2016-04-27 2018-06-19 International Business Machines Corporation Vertical FET structure
US9812567B1 (en) 2016-05-05 2017-11-07 International Business Machines Corporation Precise control of vertical transistor gate length
US9653575B1 (en) 2016-05-09 2017-05-16 International Business Machines Corporation Vertical transistor with a body contact for back-biasing
US9842931B1 (en) 2016-06-09 2017-12-12 International Business Machines Corporation Self-aligned shallow trench isolation and doping for vertical fin transistors
US9853127B1 (en) 2016-06-22 2017-12-26 International Business Machines Corporation Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process
US10217863B2 (en) 2016-06-28 2019-02-26 International Business Machines Corporation Fabrication of a vertical fin field effect transistor with an asymmetric gate structure
US10243073B2 (en) 2016-08-19 2019-03-26 International Business Machines Corporation Vertical channel field-effect transistor (FET) process compatible long channel transistors
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Also Published As

Publication number Publication date
US6768166B2 (en) 2004-07-27
GB0214803D0 (en) 2002-08-07
CN1265466C (zh) 2006-07-19
FR2826510A1 (fr) 2002-12-27
DE10130766B4 (de) 2005-08-11
GB2380857B (en) 2005-08-31
DE10130766A1 (de) 2003-01-09
GB2380857A (en) 2003-04-16
US20030015755A1 (en) 2003-01-23
CN1400669A (zh) 2003-03-05

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