FR2808233B1 - Procede de liaison par fils, et appareil a ondes acoustiques de surface - Google Patents

Procede de liaison par fils, et appareil a ondes acoustiques de surface

Info

Publication number
FR2808233B1
FR2808233B1 FR0103623A FR0103623A FR2808233B1 FR 2808233 B1 FR2808233 B1 FR 2808233B1 FR 0103623 A FR0103623 A FR 0103623A FR 0103623 A FR0103623 A FR 0103623A FR 2808233 B1 FR2808233 B1 FR 2808233B1
Authority
FR
France
Prior art keywords
bonding method
wire bonding
acoustic wave
surface acoustic
wave apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0103623A
Other languages
English (en)
Other versions
FR2808233A1 (fr
Inventor
Norihiko Takada
Hisamitsu Kamenaga
Shingo Iwasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of FR2808233A1 publication Critical patent/FR2808233A1/fr
Application granted granted Critical
Publication of FR2808233B1 publication Critical patent/FR2808233B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/129—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or workpieces
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    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
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    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
FR0103623A 2000-03-17 2001-03-16 Procede de liaison par fils, et appareil a ondes acoustiques de surface Expired - Fee Related FR2808233B1 (fr)

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JP2000075287A JP2001267355A (ja) 2000-03-17 2000-03-17 ワイヤボンディング方法およびこのワイヤボンディング方法を用いた弾性表面波装置

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FR2808233A1 FR2808233A1 (fr) 2001-11-02
FR2808233B1 true FR2808233B1 (fr) 2006-05-19

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JP (1) JP2001267355A (fr)
KR (1) KR20010092326A (fr)
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JP2001267355A (ja) * 2000-03-17 2001-09-28 Murata Mfg Co Ltd ワイヤボンディング方法およびこのワイヤボンディング方法を用いた弾性表面波装置

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Publication number Priority date Publication date Assignee Title
US3507033A (en) * 1965-01-06 1970-04-21 Western Electric Co Ultrasonic bonding method
US3959747A (en) * 1975-04-30 1976-05-25 Rca Corporation Metallized lithium niobate and method of making
JPS6159760A (ja) 1984-08-30 1986-03-27 Mitsubishi Metal Corp 半導体装置の結線用Ａｌ合金極細線
GB2177639B (en) 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
US5221449A (en) * 1990-10-26 1993-06-22 International Business Machines Corporation Method of making Alpha-Ta thin films
FR2714200B1 (fr) * 1993-11-25 1996-12-27 Fujitsu Ltd Dispositif à onde acoustique de surface et son procédé de fabrication.
US5492263A (en) * 1994-05-26 1996-02-20 Delco Electronics Corp. Method for wire bonding an aluminum wire to a lead of an electronics package
JP3173300B2 (ja) * 1994-10-19 2001-06-04 株式会社村田製作所 ラブ波デバイス
JPH08124973A (ja) 1994-10-26 1996-05-17 Fuji Electric Co Ltd 超音波ワイヤボンディング方法
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
JP3308759B2 (ja) * 1995-04-10 2002-07-29 日本電気株式会社 弾性表面波装置
JPH09298442A (ja) * 1996-03-08 1997-11-18 Tdk Corp 弾性表面波装置及びその製造方法
EP0794616B1 (fr) * 1996-03-08 2003-01-29 Matsushita Electric Industrial Co., Ltd. Composant électronique et procédé pour sa fabrication
JP3464106B2 (ja) 1996-11-28 2003-11-05 京セラ株式会社 弾性表面波装置
JP3339350B2 (ja) 1997-02-20 2002-10-28 株式会社村田製作所 弾性表面波装置
US6302973B1 (en) * 1997-08-04 2001-10-16 Corus Aluminium Walzprodukte Gmbh High strength Al-Mg-Zn-Si alloy for welded structures and brazing application
JPH1168504A (ja) * 1997-08-11 1999-03-09 Murata Mfg Co Ltd 表面波装置
JP2001267355A (ja) * 2000-03-17 2001-09-28 Murata Mfg Co Ltd ワイヤボンディング方法およびこのワイヤボンディング方法を用いた弾性表面波装置

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CN1317876A (zh) 2001-10-17
US20010022484A1 (en) 2001-09-20
GB2361888A (en) 2001-11-07
GB0105752D0 (en) 2001-04-25
TW503616B (en) 2002-09-21
JP2001267355A (ja) 2001-09-28
US6757946B2 (en) 2004-07-06
GB2361888B (en) 2002-04-24
CN1167116C (zh) 2004-09-15
KR20010092326A (ko) 2001-10-24
FR2808233A1 (fr) 2001-11-02

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