FR2806529B1 - Procede d'ajustage d'un parametre electrique sur un composant electronique integre - Google Patents
Procede d'ajustage d'un parametre electrique sur un composant electronique integreInfo
- Publication number
- FR2806529B1 FR2806529B1 FR0003260A FR0003260A FR2806529B1 FR 2806529 B1 FR2806529 B1 FR 2806529B1 FR 0003260 A FR0003260 A FR 0003260A FR 0003260 A FR0003260 A FR 0003260A FR 2806529 B1 FR2806529 B1 FR 2806529B1
- Authority
- FR
- France
- Prior art keywords
- adjusting
- electronic component
- electrical parameter
- integrated electronic
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0003260A FR2806529B1 (fr) | 2000-03-14 | 2000-03-14 | Procede d'ajustage d'un parametre electrique sur un composant electronique integre |
EP01913999A EP1264338A1 (fr) | 2000-03-14 | 2001-03-13 | Procede d'ajustage d'un parametre electrique sur un composant electronique integre |
PCT/FR2001/000750 WO2001069671A1 (fr) | 2000-03-14 | 2001-03-13 | Procede d'ajustage d'un parametre electrique sur un composant electronique integre |
AU39391/01A AU3939101A (en) | 2000-03-14 | 2001-03-13 | Method for adjusting an electrical parameter on an integrated electronic component |
US10/276,509 US7704757B2 (en) | 2000-03-14 | 2001-03-13 | Method for adjusting an electrical parameter on an integrated electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0003260A FR2806529B1 (fr) | 2000-03-14 | 2000-03-14 | Procede d'ajustage d'un parametre electrique sur un composant electronique integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2806529A1 FR2806529A1 (fr) | 2001-09-21 |
FR2806529B1 true FR2806529B1 (fr) | 2005-03-04 |
Family
ID=8848071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0003260A Expired - Fee Related FR2806529B1 (fr) | 2000-03-14 | 2000-03-14 | Procede d'ajustage d'un parametre electrique sur un composant electronique integre |
Country Status (5)
Country | Link |
---|---|
US (1) | US7704757B2 (fr) |
EP (1) | EP1264338A1 (fr) |
AU (1) | AU3939101A (fr) |
FR (1) | FR2806529B1 (fr) |
WO (1) | WO2001069671A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7022251B2 (en) * | 2003-06-19 | 2006-04-04 | Agilent Technologies, Inc. | Methods for forming a conductor on a dielectric |
US6953698B2 (en) * | 2003-06-19 | 2005-10-11 | Agilent Technologies, Inc. | Methods for making microwave circuits |
US20040258841A1 (en) * | 2003-06-19 | 2004-12-23 | Casey John F. | Methods for depositing a thickfilm dielectric on a substrate |
JP2017116297A (ja) * | 2015-12-21 | 2017-06-29 | 株式会社ミツトヨ | 画像測定方法及び画像測定機 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4769883A (en) * | 1983-03-07 | 1988-09-13 | Westinghouse Electric Corp. | Method for tuning a microwave integrated circuit |
US5079600A (en) * | 1987-03-06 | 1992-01-07 | Schnur Joel M | High resolution patterning on solid substrates |
EP0496491A1 (fr) * | 1991-01-22 | 1992-07-29 | National Semiconductor Corporation | Support de chip, résistance, capacité dépourvu de pattes de connexion et son procédé de fabrication |
FR2710192B1 (fr) * | 1991-07-29 | 1996-01-26 | Gen Electric | Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. |
US5442297A (en) * | 1994-06-30 | 1995-08-15 | International Business Machines Corporation | Contactless sheet resistance measurement method and apparatus |
US5528153A (en) * | 1994-11-07 | 1996-06-18 | Texas Instruments Incorporated | Method for non-destructive, non-contact measurement of dielectric constant of thin films |
-
2000
- 2000-03-14 FR FR0003260A patent/FR2806529B1/fr not_active Expired - Fee Related
-
2001
- 2001-03-13 EP EP01913999A patent/EP1264338A1/fr not_active Withdrawn
- 2001-03-13 WO PCT/FR2001/000750 patent/WO2001069671A1/fr active Application Filing
- 2001-03-13 AU AU39391/01A patent/AU3939101A/en not_active Abandoned
- 2001-03-13 US US10/276,509 patent/US7704757B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1264338A1 (fr) | 2002-12-11 |
WO2001069671A1 (fr) | 2001-09-20 |
US20040023482A1 (en) | 2004-02-05 |
FR2806529A1 (fr) | 2001-09-21 |
AU3939101A (en) | 2001-09-24 |
US7704757B2 (en) | 2010-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2382462B (en) | A circuit including a semiconductor component and an operating method for the semiconductor component | |
HK1029662A1 (en) | Semiconductor device and method for manufacturing the same circuit substrate and electronic device. | |
DE69936493D1 (de) | Verbindungsstruktur für Leiterplatte, elektro-optische Vorrichtung, damit versehenes elektronisches Gerät und Herstellungsverfahren für elektro-optische Vorrichtung | |
DE69942468D1 (de) | Leiterplatte und Herstellungsverfahren dafür | |
DE60045143D1 (de) | Kühlvorrichtung für elektronisches Bauelement | |
EP0973191A4 (fr) | Procede de production de circuit integre | |
FR2851373B1 (fr) | Procede de fabrication d'un circuit electronique integre incorporant des cavites | |
SG77721A1 (en) | A semiconductor integrated circuit device an a method of manufacturing the same | |
FR2838879B1 (fr) | Dispositif de connexion d'un boitier electronique | |
DE59906429D1 (de) | Elektronische Vorrichtung | |
SG88765A1 (en) | Method for forming an integrated circuit | |
DE69839906D1 (de) | Herstellungsverfahren für eine integrierte Schaltung | |
DE69942467D1 (de) | Leiterplatte und Herstellungsverfahren dafür | |
FR2832852B1 (fr) | Procede de fabrication d'un composant electronique incorporant un micro-composant inductif | |
FR2806529B1 (fr) | Procede d'ajustage d'un parametre electrique sur un composant electronique integre | |
FR2781577B1 (fr) | Procede de fabrication d'un circuit optique integre | |
FR2833411B1 (fr) | Procede de fabrication d'un composant electronique incorporant un micro-composant inductif | |
FR2813972B1 (fr) | Procede de brouillage de la consommation electrique d'un circuit integre | |
FR2779255B1 (fr) | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre | |
FR2781603B1 (fr) | Procede de formation d'une capacite sur un circuit integre | |
FR2862424B1 (fr) | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif | |
HK1026507A1 (en) | Axially-lead type electronic parts and circuit substrate device for mounting the same. | |
DE50104125D1 (de) | Herstellungsverfahren für ein elektronisches gerät | |
FR2785700B1 (fr) | Procede de gestion d'un circuit electronique | |
FR2775099B1 (fr) | Procede de fabrication d'une carte a circuit integre |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
RN | Application for restoration | ||
RN | Application for restoration | ||
D3 | Ip right revived | ||
ST | Notification of lapse |
Effective date: 20120511 |