DE60045143D1 - Kühlvorrichtung für elektronisches Bauelement - Google Patents

Kühlvorrichtung für elektronisches Bauelement

Info

Publication number
DE60045143D1
DE60045143D1 DE60045143T DE60045143T DE60045143D1 DE 60045143 D1 DE60045143 D1 DE 60045143D1 DE 60045143 T DE60045143 T DE 60045143T DE 60045143 T DE60045143 T DE 60045143T DE 60045143 D1 DE60045143 D1 DE 60045143D1
Authority
DE
Germany
Prior art keywords
electronic component
cooling device
cooling
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60045143T
Other languages
English (en)
Inventor
Byoung-Young Bae
Soon-Kyo Hong
Kwanak-Gu Sung
Hong-Kyun Yim
Pundang-Gu Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE60045143D1 publication Critical patent/DE60045143D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE60045143T 1999-01-13 2000-01-12 Kühlvorrichtung für elektronisches Bauelement Expired - Lifetime DE60045143D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990000719A KR20000050679A (ko) 1999-01-13 1999-01-13 전자기기용 방열장치

Publications (1)

Publication Number Publication Date
DE60045143D1 true DE60045143D1 (de) 2010-12-09

Family

ID=19571185

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60045143T Expired - Lifetime DE60045143D1 (de) 1999-01-13 2000-01-12 Kühlvorrichtung für elektronisches Bauelement

Country Status (5)

Country Link
US (1) US6232680B1 (de)
EP (1) EP1020911B1 (de)
JP (1) JP2000223871A (de)
KR (1) KR20000050679A (de)
DE (1) DE60045143D1 (de)

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ATE329371T1 (de) * 2001-07-30 2006-06-15 Michael-Georg Bistekos Einrichtung zur kühlung von gehausen, raumen, bauteilen, medien u. dgl
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JP4572548B2 (ja) * 2004-03-18 2010-11-04 ソニー株式会社 気体噴出装置
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JP2008525709A (ja) * 2004-12-23 2008-07-17 サブマシン コーポレイション 反動駆動エネルギー伝達装置
JP5088526B2 (ja) * 2005-04-18 2012-12-05 ソニー株式会社 噴流発生装置及び電子機器
JP4887652B2 (ja) * 2005-04-21 2012-02-29 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) * 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器
JP2006305453A (ja) * 2005-04-27 2006-11-09 Sony Corp 振動装置、噴流発生装置及び電子機器
JP2006310586A (ja) * 2005-04-28 2006-11-09 Sony Corp 気流発生装置及び電子機器
EP1722412B1 (de) * 2005-05-02 2012-08-29 Sony Corporation Sprühstrahlvorrichtung mit entsprechendem elektronischen Gerät
US8057057B2 (en) * 2006-08-11 2011-11-15 Lg Innotek Co., Ltd. Light unit and liquid crystal display device having the same
US20080056314A1 (en) * 2006-08-31 2008-03-06 Northrop Grumman Corporation High-power laser-diode package system
US20080137289A1 (en) * 2006-12-08 2008-06-12 General Electric Company Thermal management system for embedded environment and method for making same
TW200839495A (en) * 2007-03-30 2008-10-01 Cooler Master Co Ltd Structure of water cooling head
TW200847901A (en) * 2007-05-18 2008-12-01 Cooler Master Co Ltd Water-cooling heat-dissipation system
US7619894B2 (en) * 2008-02-22 2009-11-17 Inventec Corporation Heat dissipation device
US10274263B2 (en) 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US9615482B2 (en) 2009-12-11 2017-04-04 General Electric Company Shaped heat sinks to optimize flow
EP2288247B1 (de) * 2009-08-21 2013-05-01 Siemens Aktiengesellschaft Automatisierungssystem mit Kühleinheit
US20110042226A1 (en) * 2009-08-23 2011-02-24 Shyh-Ming Chen Manufacturing process of a high efficiency heat dissipating device
US8776871B2 (en) * 2009-11-19 2014-07-15 General Electric Company Chassis with distributed jet cooling
JP4900503B2 (ja) * 2010-06-21 2012-03-21 ソニー株式会社 気体噴出装置及び電子機器
KR101164624B1 (ko) 2010-07-07 2012-07-11 임용훈 전자기력을 이용한 강제대류 유발 열전달 히트싱크 장치
CN102313265B (zh) * 2010-07-08 2013-02-20 绿种子能源科技股份有限公司 具有散热功能的电子装置
CN102315180A (zh) * 2010-07-08 2012-01-11 绿种子能源科技股份有限公司 具有散热功能的电子装置及其散热模块
EP2426409B1 (de) * 2010-09-01 2014-03-05 Goodrich Lighting Systems GmbH Vorrichtung zur Erzeugung eines Kühlluftstroms in einer Vorzugsströmungsrichtung zur Kühlung von elektrischen Bauteilen
EP2656491A4 (de) * 2010-11-10 2017-01-11 Inseat Solutions, Llc Vibrierende einheiten
JP5708786B2 (ja) * 2011-02-23 2015-04-30 富士通株式会社 アクチュエータ、マイクロポンプ、及び電子機器
KR101275361B1 (ko) * 2011-05-26 2013-06-17 삼성전기주식회사 압전 방식의 냉각 장치
KR101275409B1 (ko) * 2011-05-26 2013-06-17 삼성전기주식회사 전자석 방식의 냉각 장치
TWI507118B (zh) 2013-03-01 2015-11-01 Hon Hai Prec Ind Co Ltd 散熱裝置及電子裝置
CN104023502B (zh) * 2013-03-01 2016-12-28 鸿富锦精密工业（深圳）有限公司 散热装置及电子装置
US9230878B2 (en) * 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
US20140376185A1 (en) * 2013-06-19 2014-12-25 Fairchild Korea Semiconductor Ltd. Cooling device
KR101447832B1 (ko) * 2013-08-27 2014-11-25 (주)토탈솔루션 전자기기용 냉각장치
CN104735953B (zh) * 2013-12-20 2017-11-24 华为技术有限公司 散热装置
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
US10973693B2 (en) * 2015-05-18 2021-04-13 Smith & Nephew Plc Negative pressure wound therapy apparatus and methods
EP3334472B1 (de) 2015-08-13 2023-11-22 Smith&Nephew, Inc. Systeme und verfahren zur anwendung von therapien mit reduziertem druck
CN108061024A (zh) * 2016-11-09 2018-05-22 英业达(重庆)有限公司 气流产生装置及气流产生方法
CN108061025A (zh) * 2016-11-09 2018-05-22 英业达(重庆)有限公司 气流产生装置及气流产生方法
TWI624595B (zh) * 2016-11-17 2018-05-21 英業達股份有限公司 氣流產生裝置及氣流產生方法
WO2018150267A2 (en) 2017-02-15 2018-08-23 Smith & Nephew Pte. Limited Negative pressure wound therapy apparatuses and methods for using the same
TWI623686B (zh) * 2017-02-20 2018-05-11 研能科技股份有限公司 氣冷散熱裝置
CN106686955A (zh) * 2017-02-23 2017-05-17 合肥联宝信息技术有限公司 一种散热装置和电子设备
WO2019063467A1 (en) 2017-09-29 2019-04-04 T.J.Smith And Nephew,Limited APPARATUS FOR TREATING NEGATIVE PRESSURE WAVES WITH REMOVABLE PANELS
CN109899327B (zh) * 2017-12-07 2021-09-21 昆山纬绩资通有限公司 气流产生装置
GB201813282D0 (en) 2018-08-15 2018-09-26 Smith & Nephew System for medical device activation and opertion
GB201804347D0 (en) 2018-03-19 2018-05-02 Smith & Nephew Inc Securing control of settings of negative pressure wound therapy apparatuses and methods for using the same
WO2019211731A1 (en) 2018-04-30 2019-11-07 Smith & Nephew Pte. Limited Systems and methods for controlling dual mode negative pressure wound therapy apparatus
GB201806988D0 (en) 2018-04-30 2018-06-13 Quintanar Felix Clarence Power source charging for negative pressure wound therapy apparatus
GB201808438D0 (en) 2018-05-23 2018-07-11 Smith & Nephew Systems and methods for determining blockages in a negative pressure wound therapy system
CN108933114B (zh) * 2018-07-18 2020-01-07 江苏森德邦信息科技有限公司 一种用于交流电的小型电器元件的散热装置
US11710678B2 (en) 2018-08-10 2023-07-25 Frore Systems Inc. Combined architecture for cooling devices
US11464140B2 (en) 2019-12-06 2022-10-04 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
TWI688742B (zh) * 2019-01-24 2020-03-21 新加坡商雲網科技新加坡有限公司 散熱裝置
CN111477596B (zh) 2019-01-24 2022-05-31 南宁富联富桂精密工业有限公司 散热装置
WO2021086873A1 (en) * 2019-10-30 2021-05-06 Frore System Inc. Mems-based airflow system
US11510341B2 (en) 2019-12-06 2022-11-22 Frore Systems Inc. Engineered actuators usable in MEMs active cooling devices
US11796262B2 (en) 2019-12-06 2023-10-24 Frore Systems Inc. Top chamber cavities for center-pinned actuators
US11533823B2 (en) 2019-12-16 2022-12-20 Frore Systems Inc. Mobile device case including an active cooling system
CN111255667B (zh) * 2020-01-15 2021-11-02 东方红卫星移动通信有限公司 一种低轨卫星微流控***的压电致动微驱动器
US11765863B2 (en) 2020-10-02 2023-09-19 Frore Systems Inc. Active heat sink
US11692776B2 (en) * 2021-03-02 2023-07-04 Frore Systems Inc. Mounting and use of piezoelectric cooling systems in devices

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JPH02213200A (ja) * 1989-02-14 1990-08-24 Victor Co Of Japan Ltd 熱交換器
JPH03116961A (ja) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd 放熱装置
JP3256348B2 (ja) * 1993-08-09 2002-02-12 ダイヤモンド電機株式会社 ヒートシンク
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Also Published As

Publication number Publication date
JP2000223871A (ja) 2000-08-11
EP1020911A3 (de) 2003-02-19
EP1020911A2 (de) 2000-07-19
EP1020911B1 (de) 2010-10-27
KR20000050679A (ko) 2000-08-05
US6232680B1 (en) 2001-05-15

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