FR2779255B1 - Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre - Google Patents
Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integreInfo
- Publication number
- FR2779255B1 FR2779255B1 FR9806684A FR9806684A FR2779255B1 FR 2779255 B1 FR2779255 B1 FR 2779255B1 FR 9806684 A FR9806684 A FR 9806684A FR 9806684 A FR9806684 A FR 9806684A FR 2779255 B1 FR2779255 B1 FR 2779255B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- electronic device
- integrated circuit
- portable electronic
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9806684A FR2779255B1 (fr) | 1998-05-27 | 1998-05-27 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
BR9910718-0A BR9910718A (pt) | 1998-05-27 | 1999-05-26 | Processo de fabricação de um dispositivo eletrônico portátil que comporta pelo menos um microchip de circuito integrado |
JP2000551358A JP2002517047A (ja) | 1998-05-27 | 1999-05-26 | 少なくとも1つの集積回路チップを有する携帯電子装置の製造方法 |
PCT/FR1999/001232 WO1999062028A1 (fr) | 1998-05-27 | 1999-05-26 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
AU38322/99A AU3832299A (en) | 1998-05-27 | 1999-05-26 | Method for making a portable electronic device comprising at least an integratedcircuit chip |
EP99920924A EP1084481A1 (fr) | 1998-05-27 | 1999-05-26 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
CA002333431A CA2333431A1 (fr) | 1998-05-27 | 1999-05-26 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
CN99806621A CN1309796A (zh) | 1998-05-27 | 1999-05-26 | 制造包括至少一个集成电路芯片的便携式电子装置的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9806684A FR2779255B1 (fr) | 1998-05-27 | 1998-05-27 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2779255A1 FR2779255A1 (fr) | 1999-12-03 |
FR2779255B1 true FR2779255B1 (fr) | 2001-10-12 |
Family
ID=9526770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9806684A Expired - Fee Related FR2779255B1 (fr) | 1998-05-27 | 1998-05-27 | Procede de fabrication d'un dispositif electronique portable comportant au moins une puce de circuit integre |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1084481A1 (fr) |
JP (1) | JP2002517047A (fr) |
CN (1) | CN1309796A (fr) |
AU (1) | AU3832299A (fr) |
BR (1) | BR9910718A (fr) |
CA (1) | CA2333431A1 (fr) |
FR (1) | FR2779255B1 (fr) |
WO (1) | WO1999062028A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2875995B1 (fr) * | 2004-09-24 | 2014-10-24 | Oberthur Card Syst Sa | Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport |
JP2006318217A (ja) | 2005-05-12 | 2006-11-24 | Matsushita Electric Works Ltd | メモリカード用アダプタ |
JP4500214B2 (ja) * | 2005-05-30 | 2010-07-14 | 株式会社日立製作所 | 無線icタグ、及び無線icタグの製造方法 |
CN101025796B (zh) * | 2006-02-17 | 2010-05-12 | 上海英内电子标签有限公司 | 一种电子标签的倒封装工艺 |
JP4950627B2 (ja) * | 2006-11-10 | 2012-06-13 | 株式会社日立製作所 | Rficタグとその使用方法 |
FR3009411A1 (fr) * | 2013-08-02 | 2015-02-06 | Ask Sa | Couverture de livret d'identite muni d'un dispositif radiofrequence et son procede de fabrication |
FR3027433A1 (fr) | 2014-10-16 | 2016-04-22 | Ask Sa | Procede de fabrication d'un support de dispositif radiofrequence constitue d'une seule couche |
CN106299623A (zh) * | 2016-09-27 | 2017-01-04 | 北京小米移动软件有限公司 | 无线保真WiFi天线及制造方法 |
CN106897766A (zh) * | 2017-03-31 | 2017-06-27 | 金邦达有限公司 | 带ic芯片的智能卡及智能卡的制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2684471B1 (fr) * | 1991-12-02 | 1994-03-04 | Solaic | Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue. |
EP0688050A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue |
US6329213B1 (en) * | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
-
1998
- 1998-05-27 FR FR9806684A patent/FR2779255B1/fr not_active Expired - Fee Related
-
1999
- 1999-05-26 AU AU38322/99A patent/AU3832299A/en not_active Abandoned
- 1999-05-26 EP EP99920924A patent/EP1084481A1/fr not_active Withdrawn
- 1999-05-26 BR BR9910718-0A patent/BR9910718A/pt not_active Application Discontinuation
- 1999-05-26 CN CN99806621A patent/CN1309796A/zh active Pending
- 1999-05-26 JP JP2000551358A patent/JP2002517047A/ja active Pending
- 1999-05-26 WO PCT/FR1999/001232 patent/WO1999062028A1/fr not_active Application Discontinuation
- 1999-05-26 CA CA002333431A patent/CA2333431A1/fr not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU3832299A (en) | 1999-12-13 |
CA2333431A1 (fr) | 1999-12-02 |
FR2779255A1 (fr) | 1999-12-03 |
CN1309796A (zh) | 2001-08-22 |
JP2002517047A (ja) | 2002-06-11 |
EP1084481A1 (fr) | 2001-03-21 |
BR9910718A (pt) | 2001-01-09 |
WO1999062028A1 (fr) | 1999-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100129 |