DE69216502D1 - Elektrische Durchführungsstruktur und Herstellungsverfahren - Google Patents
Elektrische Durchführungsstruktur und HerstellungsverfahrenInfo
- Publication number
- DE69216502D1 DE69216502D1 DE69216502T DE69216502T DE69216502D1 DE 69216502 D1 DE69216502 D1 DE 69216502D1 DE 69216502 T DE69216502 T DE 69216502T DE 69216502 T DE69216502 T DE 69216502T DE 69216502 D1 DE69216502 D1 DE 69216502D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- electrical feedthrough
- feedthrough structure
- electrical
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/751,364 US5425816A (en) | 1991-08-19 | 1991-08-19 | Electrical feedthrough structure and fabrication method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69216502D1 true DE69216502D1 (de) | 1997-02-20 |
DE69216502T2 DE69216502T2 (de) | 1997-04-24 |
Family
ID=25021661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69216502T Expired - Fee Related DE69216502T2 (de) | 1991-08-19 | 1992-08-08 | Elektrische Durchführungsstruktur und Herstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US5425816A (de) |
EP (1) | EP0528311B1 (de) |
JP (1) | JPH05326991A (de) |
AU (1) | AU648921B2 (de) |
DE (1) | DE69216502T2 (de) |
ES (1) | ES2095991T3 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3578539B2 (ja) * | 1996-02-08 | 2004-10-20 | 三菱電機株式会社 | 太陽電池の製造方法および太陽電池構造 |
US5620904A (en) * | 1996-03-15 | 1997-04-15 | Evergreen Solar, Inc. | Methods for forming wraparound electrical contacts on solar cells |
US5986203A (en) * | 1996-06-27 | 1999-11-16 | Evergreen Solar, Inc. | Solar cell roof tile and method of forming same |
US5762720A (en) * | 1996-06-27 | 1998-06-09 | Evergreen Solar, Inc. | Solar cell modules with integral mounting structure and methods for forming same |
US6405431B1 (en) | 1996-06-27 | 2002-06-18 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing build-up multi-layer printed circuit board by using yag laser |
US5741370A (en) * | 1996-06-27 | 1998-04-21 | Evergreen Solar, Inc. | Solar cell modules with improved backskin and methods for forming same |
US6278053B1 (en) * | 1997-03-25 | 2001-08-21 | Evergreen Solar, Inc. | Decals and methods for providing an antireflective coating and metallization on a solar cell |
US6114046A (en) * | 1997-07-24 | 2000-09-05 | Evergreen Solar, Inc. | Encapsulant material for solar cell module and laminated glass applications |
US6187448B1 (en) | 1997-07-24 | 2001-02-13 | Evergreen Solar, Inc. | Encapsulant material for solar cell module and laminated glass applications |
US5970168A (en) * | 1997-08-05 | 1999-10-19 | Kla-Tencor Corporation | Fourier filtering mechanism for inspecting wafers |
US6320116B1 (en) | 1997-09-26 | 2001-11-20 | Evergreen Solar, Inc. | Methods for improving polymeric materials for use in solar cell applications |
US6077722A (en) * | 1998-07-14 | 2000-06-20 | Bp Solarex | Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts |
US6215130B1 (en) * | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
US6221769B1 (en) * | 1999-03-05 | 2001-04-24 | International Business Machines Corporation | Method for integrated circuit power and electrical connections via through-wafer interconnects |
US6935023B2 (en) | 2000-03-08 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Method of forming electrical connection for fluid ejection device |
AU2001273596A1 (en) * | 2000-06-19 | 2002-01-02 | Robinson Nugent, Inc. | Printed circuit board having inductive vias |
US6833615B2 (en) * | 2000-12-29 | 2004-12-21 | Intel Corporation | Via-in-pad with off-center geometry |
US6659592B2 (en) | 2001-08-16 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Multiple redundant through hole electrical interconnects and method for forming the same |
US6531653B1 (en) * | 2001-09-11 | 2003-03-11 | The Boeing Company | Low cost high solar flux photovoltaic concentrator receiver |
US6716737B2 (en) | 2002-07-29 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
US6902872B2 (en) | 2002-07-29 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
US6790775B2 (en) * | 2002-10-31 | 2004-09-14 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
US7335835B2 (en) * | 2002-11-08 | 2008-02-26 | The Boeing Company | Solar cell structure with by-pass diode and wrapped front-side diode interconnection |
US7170001B2 (en) * | 2003-06-26 | 2007-01-30 | Advent Solar, Inc. | Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias |
US7649141B2 (en) * | 2003-06-30 | 2010-01-19 | Advent Solar, Inc. | Emitter wrap-through back contact solar cells on thin silicon wafers |
US20050172996A1 (en) * | 2004-02-05 | 2005-08-11 | Advent Solar, Inc. | Contact fabrication of emitter wrap-through back contact silicon solar cells |
US20060060238A1 (en) * | 2004-02-05 | 2006-03-23 | Advent Solar, Inc. | Process and fabrication methods for emitter wrap through back contact solar cells |
US7335555B2 (en) * | 2004-02-05 | 2008-02-26 | Advent Solar, Inc. | Buried-contact solar cells with self-doping contacts |
US7144751B2 (en) * | 2004-02-05 | 2006-12-05 | Advent Solar, Inc. | Back-contact solar cells and methods for fabrication |
US20050275057A1 (en) * | 2004-06-15 | 2005-12-15 | Breen Marc L | Schottky diode with dielectric isolation |
US7331163B2 (en) * | 2004-10-29 | 2008-02-19 | Hau Joseph A | Refrigerator with integral vacuum sealer |
CA2568136C (en) * | 2006-11-30 | 2008-07-29 | Tenxc Wireless Inc. | Butler matrix implementation |
WO2008076879A1 (en) * | 2006-12-15 | 2008-06-26 | Evergreen Solar, Inc. | Plug-together photovoltaic modules |
WO2008080160A1 (en) * | 2006-12-22 | 2008-07-03 | Advent Solar, Inc. | Interconnect technologies for back contact solar cells and modules |
US20080185038A1 (en) * | 2007-02-02 | 2008-08-07 | Emcore Corporation | Inverted metamorphic solar cell with via for backside contacts |
JP2008294080A (ja) * | 2007-05-22 | 2008-12-04 | Sanyo Electric Co Ltd | 太陽電池セル及び太陽電池セルの製造方法 |
US8034702B2 (en) | 2007-08-16 | 2011-10-11 | Micron Technology, Inc. | Methods of forming through substrate interconnects |
WO2009064870A2 (en) * | 2007-11-13 | 2009-05-22 | Advent Solar, Inc. | Selective emitter and texture processes for back contact solar cells |
JP2009135338A (ja) * | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | 太陽電池及び太陽電池の製造方法 |
EP2068369A1 (de) * | 2007-12-03 | 2009-06-10 | Interuniversitair Microelektronica Centrum (IMEC) | Photovoltaikzellen mit Metal-Wrap-Through und verbesserter Passivierung |
JP5259197B2 (ja) * | 2008-01-09 | 2013-08-07 | ソニー株式会社 | 半導体装置及びその製造方法 |
WO2009134939A2 (en) * | 2008-04-29 | 2009-11-05 | Advent Solar, Inc. | Photovoltaic modules manufactured using monolithic module assembly techniques |
US20090277503A1 (en) * | 2008-05-10 | 2009-11-12 | Solfocus, Inc. | Solar Cell with Current Blocking Layer |
DE102009028194B3 (de) * | 2009-08-03 | 2011-03-24 | Robert Bosch Gmbh | Sensorelement mit Durchkontaktierloch |
KR101823709B1 (ko) | 2010-05-11 | 2018-02-01 | 쉬티흐틴크 에네르지온데르조크 센트룸 네델란드 | 태양전지 및 그 태양전지의 제조방법 |
NL2004698C2 (en) * | 2010-05-11 | 2011-11-15 | Stichting Energie | Solar cell and method of manufacturing such a solar cell. |
US8852994B2 (en) | 2010-05-24 | 2014-10-07 | Masimo Semiconductor, Inc. | Method of fabricating bifacial tandem solar cells |
NL2005261C2 (en) * | 2010-08-24 | 2012-02-27 | Solland Solar Cells B V | Back contacted photovoltaic cell with an improved shunt resistance. |
US8525343B2 (en) * | 2010-09-28 | 2013-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device with through-silicon via (TSV) and method of forming the same |
DE102010060303A1 (de) | 2010-11-02 | 2012-05-03 | Solarworld Innovations Gmbh | Verfahren zum Herstellen einer Solarzelle |
US8894868B2 (en) | 2011-10-06 | 2014-11-25 | Electro Scientific Industries, Inc. | Substrate containing aperture and methods of forming the same |
FR2983346B1 (fr) * | 2011-11-25 | 2016-12-09 | Soitec Silicon On Insulator | Procede de prevention d'une panne electrique dans un empilement de couches semi-conductrices, cellule photovoltaïque a concentration a substrat mince, et assemblage de cellule solaire |
TWI505490B (zh) * | 2013-05-24 | 2015-10-21 | Reflective solar cells with high thermal conductivity | |
US9680035B1 (en) * | 2016-05-27 | 2017-06-13 | Solar Junction Corporation | Surface mount solar cell with integrated coverglass |
DE102019006093A1 (de) | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Schutzverfahren für Durchgangsöffnungen einer Halbleiterscheibe |
DE102019006096A1 (de) * | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Stapelförmige Mehrfachsolarzelle mit einem dielektrischen lsolationsschichtsystem |
DE102019006097A1 (de) * | 2019-08-29 | 2021-03-04 | Azur Space Solar Power Gmbh | Passivierungsverfahren für ein Durchgangsloch einer Halbleiterscheibe |
DE102019006091B4 (de) | 2019-08-29 | 2022-03-17 | Azur Space Solar Power Gmbh | Mehrfachsolarzelle mit rückseitenkontaktierter Vorderseite |
DE102021001116A1 (de) * | 2021-03-02 | 2022-09-08 | Azur Space Solar Power Gmbh | Verfahren zum Durchkontaktieren |
EP4053920A1 (de) * | 2021-03-02 | 2022-09-07 | AZUR SPACE Solar Power GmbH | Solarzellenkontaktanordnung |
US20240074054A1 (en) * | 2022-08-25 | 2024-02-29 | The Phoenix Company Of Chicago, Inc. | Impedance matched via connections in a printed circuit board |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4892879A (de) * | 1972-03-09 | 1973-12-01 | ||
DE2453788A1 (de) * | 1973-11-21 | 1975-05-22 | Litton Industries Inc | Verfahren zur herstellung von schaltplatten mit gedruckten schaltungen |
US3903427A (en) * | 1973-12-28 | 1975-09-02 | Hughes Aircraft Co | Solar cell connections |
JPS5412376A (en) * | 1977-06-25 | 1979-01-30 | Yoshitomi Pharmaceut Ind Ltd | Antibacterial derivative of pseudomonic acid |
JPS5567182A (en) * | 1978-11-15 | 1980-05-21 | Nippon Electric Co | Heat transmitting printed circuit board |
JPS60236280A (ja) * | 1984-05-10 | 1985-11-25 | 松下電工株式会社 | 配線用板 |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
JPS61248496A (ja) * | 1985-04-25 | 1986-11-05 | オ−ケ−プリント配線株式会社 | フレキシブル基板装置 |
JPS61292379A (ja) * | 1985-06-19 | 1986-12-23 | Sharp Corp | ラツパラウンドコンタクトセル |
US4791248A (en) * | 1987-01-22 | 1988-12-13 | The Boeing Company | Printed wire circuit board and its method of manufacture |
JPS63211773A (ja) * | 1987-02-27 | 1988-09-02 | Mitsubishi Electric Corp | 化合物半導体太陽電池 |
JPS6482570A (en) * | 1987-09-24 | 1989-03-28 | Mitsubishi Electric Corp | Manufacture of photoelectric conversion device |
JPH0691303B2 (ja) * | 1987-11-30 | 1994-11-14 | イビデン株式会社 | 電子部品搭載プリント配線板装置 |
WO1989005521A1 (en) * | 1987-12-03 | 1989-06-15 | Spectrolab, Inc. | Solar cell panel |
US4981525A (en) * | 1988-02-19 | 1991-01-01 | Sanyo Electric Co., Ltd. | Photovoltaic device |
JPH0298974A (ja) * | 1988-10-05 | 1990-04-11 | Sanyo Electric Co Ltd | 光起電力装置の製造方法 |
JP2773366B2 (ja) * | 1990-03-19 | 1998-07-09 | 富士通株式会社 | 多層配線基板の形成方法 |
-
1991
- 1991-08-19 US US07/751,364 patent/US5425816A/en not_active Expired - Lifetime
-
1992
- 1992-08-07 AU AU20907/92A patent/AU648921B2/en not_active Ceased
- 1992-08-08 DE DE69216502T patent/DE69216502T2/de not_active Expired - Fee Related
- 1992-08-08 ES ES92113566T patent/ES2095991T3/es not_active Expired - Lifetime
- 1992-08-08 EP EP92113566A patent/EP0528311B1/de not_active Expired - Lifetime
- 1992-08-18 JP JP4218055A patent/JPH05326991A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US5425816A (en) | 1995-06-20 |
EP0528311B1 (de) | 1997-01-08 |
ES2095991T3 (es) | 1997-03-01 |
EP0528311A2 (de) | 1993-02-24 |
DE69216502T2 (de) | 1997-04-24 |
AU648921B2 (en) | 1994-05-05 |
JPH05326991A (ja) | 1993-12-10 |
EP0528311A3 (en) | 1993-03-03 |
AU2090792A (en) | 1993-02-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69216502D1 (de) | Elektrische Durchführungsstruktur und Herstellungsverfahren | |
DE69333336D1 (de) | Isolatorstruktur und zugehöriges Herstellungsverfahren | |
DE69118808D1 (de) | Elektrischer Steckverbinder und dessen Herstellungsverfahren | |
EP0454384A3 (en) | Electrical via structure and method of forming the same | |
DE69322807D1 (de) | Zahnprothese und Herstellungsverfahren | |
IL99028A0 (en) | Electrical cable and method of manufacturing same | |
EP0468136A3 (en) | Contact structures for semiconductor devices and method for their manufacture | |
DE59108448D1 (de) | Elektrische Sicherung | |
DE69233684D1 (de) | Elektrischer Verbindungskörper und Herstellungsverfahren dafür | |
GB2222485B (en) | Pressure-sensitive electrical conductor and method of manufacturing the same | |
DE69233088D1 (de) | Elektrisches Verbindungsteil und sein Herstellungsverfahren | |
DE69120620D1 (de) | Elektrischer Steckverbinder mit Bauelementen und Herstellungsverfahren dafür | |
EP0342681A3 (en) | Electric device and manufacturing method of the same | |
EP0507276A3 (en) | Conductive glass and manufacturing method thereof | |
EP0473912A3 (en) | Electric circuit and method to manufacture the same | |
DE69208251D1 (de) | Elektrische Verbinder | |
DE69116758D1 (de) | Elektrischer Anschlusskontakt und Herstellungsverfahren | |
DE69309306D1 (de) | Elektrische Verbindungsstrukturen | |
DE59304286D1 (de) | Elektrische Baugruppe | |
EP0480580A3 (en) | Electrode structure of semiconductor device and method for manufacturing the same | |
DE69400980D1 (de) | Elektrische Anschlussvorrichtung und zugehöriges Herstellungsverfahren | |
DE69232606D1 (de) | Elektrischer Verbindungskörper und Herstellungsverfahren dafür | |
DE69230313D1 (de) | Elektrische verbinder | |
DE69118182D1 (de) | Elektrische schutzeinrichtungen | |
DE69315533D1 (de) | Elektrische Verbinder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |