FR2675946B1 - Procede de montage d'une puce a circuit integre sur un substrat de cablage. - Google Patents
Procede de montage d'une puce a circuit integre sur un substrat de cablage.Info
- Publication number
- FR2675946B1 FR2675946B1 FR9105368A FR9105368A FR2675946B1 FR 2675946 B1 FR2675946 B1 FR 2675946B1 FR 9105368 A FR9105368 A FR 9105368A FR 9105368 A FR9105368 A FR 9105368A FR 2675946 B1 FR2675946 B1 FR 2675946B1
- Authority
- FR
- France
- Prior art keywords
- chip
- mounting
- integrated circuit
- wiring substrate
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
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- H01L2924/151—Die mounting substrate
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- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9105368A FR2675946B1 (fr) | 1991-04-25 | 1991-04-25 | Procede de montage d'une puce a circuit integre sur un substrat de cablage. |
PCT/FR1992/000327 WO1992020101A1 (fr) | 1991-04-25 | 1992-04-14 | Procede de montage d'une puce a circuit integre sur un substrat de cablage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9105368A FR2675946B1 (fr) | 1991-04-25 | 1991-04-25 | Procede de montage d'une puce a circuit integre sur un substrat de cablage. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2675946A1 FR2675946A1 (fr) | 1992-10-30 |
FR2675946B1 true FR2675946B1 (fr) | 1993-08-20 |
Family
ID=9412437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9105368A Expired - Fee Related FR2675946B1 (fr) | 1991-04-25 | 1991-04-25 | Procede de montage d'une puce a circuit integre sur un substrat de cablage. |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2675946B1 (fr) |
WO (1) | WO1992020101A1 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133637A (ja) * | 1984-12-03 | 1986-06-20 | Nec Corp | 接続電極の形成方法 |
EP0191434B1 (fr) * | 1985-02-15 | 1991-01-16 | International Business Machines Corporation | Connexion à brasure entre une puce microélectronique et un substrat et son procédé de fabrication |
JPS62122258A (ja) * | 1985-11-22 | 1987-06-03 | Nec Corp | マルチチツプパツケ−ジ |
JPS62111457A (ja) * | 1985-11-11 | 1987-05-22 | Nec Corp | マルチチツプパツケ−ジ |
EP0376924A3 (fr) * | 1987-05-21 | 1990-08-22 | RAYCHEM CORPORATION (a Delaware corporation) | Liaison par compression à or |
US4926241A (en) * | 1988-02-19 | 1990-05-15 | Microelectronics And Computer Technology Corporation | Flip substrate for chip mount |
JPH0378290A (ja) * | 1989-08-21 | 1991-04-03 | Hitachi Ltd | 多層配線基板 |
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1991
- 1991-04-25 FR FR9105368A patent/FR2675946B1/fr not_active Expired - Fee Related
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1992
- 1992-04-14 WO PCT/FR1992/000327 patent/WO1992020101A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
FR2675946A1 (fr) | 1992-10-30 |
WO1992020101A1 (fr) | 1992-11-12 |
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Legal Events
Date | Code | Title | Description |
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CD | Change of name or company name | ||
ST | Notification of lapse |