FR2643193B1 - Procede pour fabriquer des circuits integres a semi-conducteurs - Google Patents
Procede pour fabriquer des circuits integres a semi-conducteursInfo
- Publication number
- FR2643193B1 FR2643193B1 FR9001536A FR9001536A FR2643193B1 FR 2643193 B1 FR2643193 B1 FR 2643193B1 FR 9001536 A FR9001536 A FR 9001536A FR 9001536 A FR9001536 A FR 9001536A FR 2643193 B1 FR2643193 B1 FR 2643193B1
- Authority
- FR
- France
- Prior art keywords
- integrated semiconductor
- semiconductor circuits
- manufacturing integrated
- manufacturing
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Waveguides (AREA)
- Microwave Amplifiers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3749489 | 1989-02-16 | ||
| JP1245747A JP2675411B2 (ja) | 1989-02-16 | 1989-09-20 | 半導体集積回路の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2643193A1 FR2643193A1 (fr) | 1990-08-17 |
| FR2643193B1 true FR2643193B1 (fr) | 1997-06-13 |
Family
ID=26376621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9001536A Expired - Fee Related FR2643193B1 (fr) | 1989-02-16 | 1990-02-09 | Procede pour fabriquer des circuits integres a semi-conducteurs |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5051373A (fr) |
| JP (1) | JP2675411B2 (fr) |
| FR (1) | FR2643193B1 (fr) |
| GB (1) | GB2228619B (fr) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2283856B (en) * | 1990-04-05 | 1995-09-20 | Gen Electric | Microwave component having tailored operating characteristics and method of tailoring |
| GB2284095B (en) * | 1990-04-05 | 1995-09-20 | Gen Electric | Microwave component having tailored operating characteristics and method of tailoring |
| JP2844857B2 (ja) * | 1990-06-21 | 1999-01-13 | ソニー株式会社 | 混成集積回路の製造装置 |
| JP2672197B2 (ja) * | 1991-04-24 | 1997-11-05 | シャープ株式会社 | 金属配線膜の性能評価方法 |
| JP2898493B2 (ja) * | 1992-11-26 | 1999-06-02 | 三菱電機株式会社 | ミリ波またはマイクロ波ｉｃのレイアウト設計方法及びレイアウト設計装置 |
| US5457399A (en) * | 1992-12-14 | 1995-10-10 | Hughes Aircraft Company | Microwave monolithic integrated circuit fabrication, test method and test probes |
| FI19992361A (fi) * | 1999-11-01 | 2001-05-02 | Nokia Mobile Phones Ltd | Integroitujen piirien valmistusmenetelmä |
| US6711723B2 (en) * | 2000-04-28 | 2004-03-23 | Northrop Grumman Corporation | Hybrid semi-physical and data fitting HEMT modeling approach for large signal and non-linear microwave/millimeter wave circuit CAD |
| US6507248B2 (en) * | 2000-05-29 | 2003-01-14 | Citizen Watch Co., Ltd. | Voltage-controlled crystal oscillator |
| GB2366422A (en) * | 2001-03-02 | 2002-03-06 | Mitel Semiconductor Ltd | Design, test simulation and manufacture of a semiconductor device |
| US6806106B2 (en) * | 2001-03-20 | 2004-10-19 | Infineon Technologies Ag | Bond wire tuning of RF power transistors and amplifiers |
| JP2003016133A (ja) * | 2001-04-27 | 2003-01-17 | Tdk Corp | 高周波電子部品及びその設計方法 |
| US7792595B1 (en) | 2004-03-30 | 2010-09-07 | Synopsys, Inc. | Method and system for enhancing the yield in semiconductor manufacturing |
| US20060190229A1 (en) * | 2005-02-23 | 2006-08-24 | International Business Machines Corporation | Method of modeling a portion of an electrical circuit using a pole-zero approximation of an s-parameter transfer function of the circuit portion |
| US7956628B2 (en) * | 2006-11-03 | 2011-06-07 | International Business Machines Corporation | Chip-based prober for high frequency measurements and methods of measuring |
| JP5053965B2 (ja) * | 2008-09-16 | 2012-10-24 | 日本電信電話株式会社 | 回路特性解析方法、装置、およびプログラム |
| US8867226B2 (en) * | 2011-06-27 | 2014-10-21 | Raytheon Company | Monolithic microwave integrated circuits (MMICs) having conductor-backed coplanar waveguides and method of designing such MMICs |
| CN114975102B (zh) * | 2022-07-29 | 2022-10-28 | 泉州市三安集成电路有限公司 | 集成异质结双极晶体管及其制作方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1145991A (en) * | 1965-03-12 | 1969-03-19 | Mullard Ltd | Improvements in and relating to methods of manufacturing electrical circuit arrangements |
| US4284872A (en) * | 1978-01-13 | 1981-08-18 | Burr-Brown Research Corporation | Method for thermal testing and compensation of integrated circuits |
| JPS63199421A (ja) * | 1987-02-16 | 1988-08-17 | Toshiba Corp | 荷電ビ−ム描画方法 |
| US4789645A (en) * | 1987-04-20 | 1988-12-06 | Eaton Corporation | Method for fabrication of monolithic integrated circuits |
| JP2695160B2 (ja) * | 1987-04-30 | 1997-12-24 | 株式会社日立製作所 | 任意形状抵抗体の端子間抵抗計算方法 |
| JP2614884B2 (ja) * | 1988-02-04 | 1997-05-28 | 富士通株式会社 | 電子ビーム露光方法及びその装置 |
| US4933860A (en) * | 1988-05-20 | 1990-06-12 | Trw Inc. | Method for fabricating a radio frequency integrated circuit and product formed thereby |
-
1989
- 1989-09-20 JP JP1245747A patent/JP2675411B2/ja not_active Expired - Fee Related
-
1990
- 1990-01-05 US US07/461,356 patent/US5051373A/en not_active Expired - Lifetime
- 1990-02-09 FR FR9001536A patent/FR2643193B1/fr not_active Expired - Fee Related
- 1990-02-14 GB GB9003315A patent/GB2228619B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| GB2228619B (en) | 1993-05-05 |
| JP2675411B2 (ja) | 1997-11-12 |
| JPH02298103A (ja) | 1990-12-10 |
| GB9003315D0 (en) | 1990-04-11 |
| US5051373A (en) | 1991-09-24 |
| GB2228619A (en) | 1990-08-29 |
| FR2643193A1 (fr) | 1990-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |