FR2622352B3 - Procede et dispositif pour l'enlevement d'un revetement photosensible - Google Patents
Procede et dispositif pour l'enlevement d'un revetement photosensibleInfo
- Publication number
- FR2622352B3 FR2622352B3 FR888813794A FR8813794A FR2622352B3 FR 2622352 B3 FR2622352 B3 FR 2622352B3 FR 888813794 A FR888813794 A FR 888813794A FR 8813794 A FR8813794 A FR 8813794A FR 2622352 B3 FR2622352 B3 FR 2622352B3
- Authority
- FR
- France
- Prior art keywords
- photosensitive coating
- photosensitive
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/003—Cyclically moving conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
- B23Q7/041—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers step by step
- B23Q7/042—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers step by step for the axial transport of long workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL84255A IL84255A (en) | 1987-10-23 | 1987-10-23 | Process for removal of post- baked photoresist layer |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2622352A1 FR2622352A1 (fr) | 1989-04-28 |
FR2622352B3 true FR2622352B3 (fr) | 1990-02-02 |
Family
ID=11058263
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR888813794A Expired - Lifetime FR2622352B3 (fr) | 1987-10-23 | 1988-10-21 | Procede et dispositif pour l'enlevement d'un revetement photosensible |
FR8813936A Expired - Lifetime FR2622134B1 (fr) | 1987-10-23 | 1988-10-25 | Ensemble de machine d'usinage et de transporteur de pieces a usiner |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8813936A Expired - Lifetime FR2622134B1 (fr) | 1987-10-23 | 1988-10-25 | Ensemble de machine d'usinage et de transporteur de pieces a usiner |
Country Status (6)
Country | Link |
---|---|
US (1) | US5114834A (fr) |
DE (1) | DE3835636A1 (fr) |
FR (2) | FR2622352B3 (fr) |
GB (1) | GB2211629B (fr) |
IL (1) | IL84255A (fr) |
NL (1) | NL194997C (fr) |
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JPS614640A (ja) * | 1984-06-14 | 1986-01-10 | Hitachi Seiki Co Ltd | ワ−ク搬送装置 |
US4671848A (en) * | 1984-12-17 | 1987-06-09 | General Laser, Inc. | Method for laser-induced removal of a surface coating |
US4643799A (en) * | 1984-12-26 | 1987-02-17 | Hitachi, Ltd. | Method of dry etching |
US4615765A (en) * | 1985-02-01 | 1986-10-07 | General Electric Company | Self-registered, thermal processing technique using a pulsed heat source |
JPS61290724A (ja) * | 1985-06-19 | 1986-12-20 | Hitachi Ltd | ウエハ処理方法および装置 |
GB8516984D0 (en) * | 1985-07-04 | 1985-08-07 | British Telecomm | Etching method |
US4786358A (en) * | 1986-08-08 | 1988-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a pattern of a film on a substrate with a laser beam |
US4731158A (en) * | 1986-09-12 | 1988-03-15 | International Business Machines Corporation | High rate laser etching technique |
US4718974A (en) * | 1987-01-09 | 1988-01-12 | Ultraphase Equipment, Inc. | Photoresist stripping apparatus using microwave pumped ultraviolet lamp |
NL8701176A (nl) * | 1987-05-15 | 1988-12-01 | Stork Screens Bv | Dessineerdeklaag voor een metalen zeefdruksjabloon; zeefdruksjabloon voorzien van een dessineerdeklaag en werkwijze voor het aanbrengen van een dessineerpatroon in een deklaag welke aanwezig is op een metalen zeefdruksjabloon. |
US5007983A (en) * | 1988-01-29 | 1991-04-16 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | Etching method for photoresists or polymers |
US4877644A (en) * | 1988-04-12 | 1989-10-31 | Amp Incorporated | Selective plating by laser ablation |
-
1987
- 1987-10-23 IL IL84255A patent/IL84255A/xx not_active IP Right Cessation
-
1988
- 1988-10-19 DE DE3835636A patent/DE3835636A1/de not_active Withdrawn
- 1988-10-20 NL NL8802587A patent/NL194997C/nl not_active IP Right Cessation
- 1988-10-20 GB GB8824547A patent/GB2211629B/en not_active Expired - Fee Related
- 1988-10-21 FR FR888813794A patent/FR2622352B3/fr not_active Expired - Lifetime
- 1988-10-25 FR FR8813936A patent/FR2622134B1/fr not_active Expired - Lifetime
-
1989
- 1989-09-14 US US07/407,141 patent/US5114834A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
IL84255A0 (en) | 1988-03-31 |
FR2622134A1 (fr) | 1989-04-28 |
FR2622134B1 (fr) | 1994-04-08 |
GB2211629A (en) | 1989-07-05 |
FR2622352A1 (fr) | 1989-04-28 |
NL194997C (nl) | 2003-04-24 |
GB2211629B (en) | 1992-02-19 |
US5114834A (en) | 1992-05-19 |
DE3835636A1 (de) | 1989-05-03 |
GB8824547D0 (en) | 1988-11-23 |
NL8802587A (nl) | 1989-05-16 |
IL84255A (en) | 1993-02-21 |
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