FR2436497A1 - Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique - Google Patents
Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermiqueInfo
- Publication number
- FR2436497A1 FR2436497A1 FR7922966A FR7922966A FR2436497A1 FR 2436497 A1 FR2436497 A1 FR 2436497A1 FR 7922966 A FR7922966 A FR 7922966A FR 7922966 A FR7922966 A FR 7922966A FR 2436497 A1 FR2436497 A1 FR 2436497A1
- Authority
- FR
- France
- Prior art keywords
- metal flat
- flat case
- thermal transfer
- excellent thermal
- transfer characteristics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract 2
- 239000010935 stainless steel Substances 0.000 abstract 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Laminated Bodies (AREA)
Abstract
L'invention concerne un boîtier plat entièrement métallique pour des micro-circuits et son procédé de fabrication. Le boîtier comporte un cadre d'acier inoxydable dans lequel sont scellés au verre les conducteurs électriques, un fond de cuivre brasé sur le cadre d'acier inoxydable et sur lequel est soudé un substrat d'oxyde de beryllium, et un couvercle d'acier inoxydable. L'invention s'applique notamment à des micro-circuits qui développent la chaleur.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/942,329 US4266089A (en) | 1978-09-14 | 1978-09-14 | All metal flat package having excellent heat transfer characteristics |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2436497A1 true FR2436497A1 (fr) | 1980-04-11 |
FR2436497B1 FR2436497B1 (fr) | 1985-06-28 |
Family
ID=25477931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7922966A Expired FR2436497B1 (fr) | 1978-09-14 | 1979-09-14 | Boitier plat entierement metallique possedant d'excellentes caracteristiques de transfert thermique |
Country Status (5)
Country | Link |
---|---|
US (1) | US4266089A (fr) |
CA (1) | CA1114485A (fr) |
DE (1) | DE2937051A1 (fr) |
FR (1) | FR2436497B1 (fr) |
GB (1) | GB2032188B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2526585A1 (fr) * | 1982-05-07 | 1983-11-10 | Thomson Csf | Boitier d'encapsulation de circuit microelectronique a haute dissipation thermique et son procede de fabrication |
FR2539249A1 (fr) * | 1983-01-07 | 1984-07-13 | Europ Composants Electron | Boitier a dissipation thermique elevee notamment pour microelectronique |
EP0233824A2 (fr) * | 1986-02-19 | 1987-08-26 | Isotronics, Inc. | Boîtiers pour micro-circuits |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4451540A (en) * | 1982-08-30 | 1984-05-29 | Isotronics, Inc. | System for packaging of electronic circuits |
US4506108A (en) * | 1983-04-01 | 1985-03-19 | Sperry Corporation | Copper body power hybrid package and method of manufacture |
US4547624A (en) * | 1983-12-02 | 1985-10-15 | Isotronics, Inc. | Method and apparatus for reducing package height for microcircuit packages |
US4716082A (en) * | 1986-10-28 | 1987-12-29 | Isotronics, Inc. | Duplex glass preforms for hermetic glass-to-metal sealing |
US4950503A (en) * | 1989-01-23 | 1990-08-21 | Olin Corporation | Process for the coating of a molybdenum base |
US5001299A (en) * | 1989-04-17 | 1991-03-19 | Explosive Fabricators, Inc. | Explosively formed electronic packages |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
US5051869A (en) * | 1990-05-10 | 1991-09-24 | Rockwell International Corporation | Advanced co-fired multichip/hybrid package |
US5093989A (en) * | 1990-11-13 | 1992-03-10 | Frenchtown Ceramics Co. | Method of making heat-resistant hermetic packages for electronic components |
US6061374A (en) * | 1997-02-07 | 2000-05-09 | Coherent, Inc. | Laser diode integrating enclosure and detector |
US6027256A (en) * | 1997-02-07 | 2000-02-22 | Coherent, Inc. | Composite laser diode enclosure and method for making the same |
JP2003115565A (ja) * | 2001-10-05 | 2003-04-18 | Nec Yamagata Ltd | 半導体パッケージ及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2880383A (en) * | 1956-10-05 | 1959-03-31 | Motorola Inc | High frequency transistor package |
FR2098405A1 (fr) * | 1970-07-15 | 1972-03-10 | Trw Inc | |
FR2121454A1 (fr) * | 1971-01-14 | 1972-08-25 | Materiel Telephonique | |
US3733691A (en) * | 1968-10-07 | 1973-05-22 | Kabel Metallwerke Ghh | Process for making semiconductor devices |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3381080A (en) * | 1962-07-02 | 1968-04-30 | Westinghouse Electric Corp | Hermetically sealed semiconductor device |
US3190952A (en) * | 1963-02-21 | 1965-06-22 | Bitko Sheldon | Welded hermetic seal |
GB1207728A (en) * | 1968-11-27 | 1970-10-07 | Standard Telephones Cables Ltd | Housing assembly for an electric circuit |
US3646405A (en) * | 1969-01-08 | 1972-02-29 | Mallory & Co Inc P R | Hermetic seal |
GB1259804A (en) * | 1969-02-28 | 1972-01-12 | Hawker Siddeley Dynamics Ltd | Improvements in or relating to the manufacture of electrical circuit assemblies |
BE760031A (fr) * | 1969-12-11 | 1971-05-17 | Rca Corp | Boitier pour module de puissance hybride a semiconducteurs |
DE2158188A1 (de) * | 1971-11-24 | 1973-06-07 | Jenaer Glaswerk Schott & Gen | Kaltpresschweissbare und kaltpressloetbare druckglasdurchfuehrungen |
US3936846A (en) * | 1973-04-09 | 1976-02-03 | Asahi Kogaku Kogyo Kabushiki Kaisha | Battery magazine in single lens reflex camera |
US4063348A (en) * | 1975-02-27 | 1977-12-20 | The Bendix Corporation | Unique packaging method for use on large semiconductor devices |
-
1978
- 1978-09-14 US US05/942,329 patent/US4266089A/en not_active Expired - Lifetime
-
1979
- 1979-09-12 GB GB7931620A patent/GB2032188B/en not_active Expired
- 1979-09-13 DE DE19792937051 patent/DE2937051A1/de active Granted
- 1979-09-13 CA CA335,599A patent/CA1114485A/fr not_active Expired
- 1979-09-14 FR FR7922966A patent/FR2436497B1/fr not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2880383A (en) * | 1956-10-05 | 1959-03-31 | Motorola Inc | High frequency transistor package |
US3733691A (en) * | 1968-10-07 | 1973-05-22 | Kabel Metallwerke Ghh | Process for making semiconductor devices |
FR2098405A1 (fr) * | 1970-07-15 | 1972-03-10 | Trw Inc | |
FR2121454A1 (fr) * | 1971-01-14 | 1972-08-25 | Materiel Telephonique |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2526585A1 (fr) * | 1982-05-07 | 1983-11-10 | Thomson Csf | Boitier d'encapsulation de circuit microelectronique a haute dissipation thermique et son procede de fabrication |
EP0094869A1 (fr) * | 1982-05-07 | 1983-11-23 | Thomson-Csf | Boîtier d'encapsulation de circuit microélectronique à haute dissipation thermique, et son procédé de fabrication |
FR2539249A1 (fr) * | 1983-01-07 | 1984-07-13 | Europ Composants Electron | Boitier a dissipation thermique elevee notamment pour microelectronique |
EP0114760A1 (fr) * | 1983-01-07 | 1984-08-01 | Xeram | Boîtier à dissipation thermique élevée, notamment pour microélectronique |
EP0233824A2 (fr) * | 1986-02-19 | 1987-08-26 | Isotronics, Inc. | Boîtiers pour micro-circuits |
EP0233824A3 (fr) * | 1986-02-19 | 1989-06-14 | Isotronics, Inc. | Boítiers pour micro-circuits |
Also Published As
Publication number | Publication date |
---|---|
GB2032188B (en) | 1983-02-09 |
DE2937051A1 (de) | 1980-03-27 |
US4266089A (en) | 1981-05-05 |
CA1114485A (fr) | 1981-12-15 |
GB2032188A (en) | 1980-04-30 |
FR2436497B1 (fr) | 1985-06-28 |
DE2937051C2 (fr) | 1988-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |