FR2384354A1 - Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre - Google Patents
Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centreInfo
- Publication number
- FR2384354A1 FR2384354A1 FR7807516A FR7807516A FR2384354A1 FR 2384354 A1 FR2384354 A1 FR 2384354A1 FR 7807516 A FR7807516 A FR 7807516A FR 7807516 A FR7807516 A FR 7807516A FR 2384354 A1 FR2384354 A1 FR 2384354A1
- Authority
- FR
- France
- Prior art keywords
- heat sinks
- centre
- cavity
- electrically insulating
- disc shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Power Conversion In General (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Abstract
A semiconductor device is used which consists of a disc shaped semiconductor component mounted between the flat surfaces of two heat sinks. The device is for power function on e.g. traction vehicles, and is protected from environmental effects. This will also reduce the chances of leakage currents. The plate (44) made from an electrically insulating material is fitted between the two heat sinks (2, 3). The thickness of the plate is approximately equal to the thickness of the semiconductor component (1). The semiconductor component is mounted in a cavity (4a) in the centre of the insulating plate. The chamber containing the element has a gas tight seal.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2711711A DE2711711C3 (en) | 1977-03-17 | 1977-03-17 | Semiconductor arrangement with a disk-shaped semiconductor component clamped between heat sinks |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2384354A1 true FR2384354A1 (en) | 1978-10-13 |
FR2384354B1 FR2384354B1 (en) | 1980-06-13 |
Family
ID=6003911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7807516A Granted FR2384354A1 (en) | 1977-03-17 | 1978-03-15 | Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS53115180A (en) |
DE (1) | DE2711711C3 (en) |
FR (1) | FR2384354A1 (en) |
SE (1) | SE7801698L (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2558644A1 (en) * | 1984-01-23 | 1985-07-26 | Telemecanique Electrique | Mounting block for power semiconductor. |
WO1985003385A1 (en) * | 1984-01-23 | 1985-08-01 | La Telemecanique Electrique | Mounting and connection device for power semi-conductors |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3024001C2 (en) * | 1980-06-24 | 1986-09-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Air-cooled semiconductor arrangement with disk-shaped semiconductor components clamped between heat sinks |
DE3130896C2 (en) * | 1981-07-31 | 1986-08-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Arrangement for cooling semiconductors via heat sinks |
DE3327992A1 (en) * | 1983-08-03 | 1985-02-21 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Semiconductor device |
-
1977
- 1977-03-17 DE DE2711711A patent/DE2711711C3/en not_active Expired
-
1978
- 1978-02-14 SE SE7801698A patent/SE7801698L/en unknown
- 1978-03-15 FR FR7807516A patent/FR2384354A1/en active Granted
- 1978-03-17 JP JP3089778A patent/JPS53115180A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2558644A1 (en) * | 1984-01-23 | 1985-07-26 | Telemecanique Electrique | Mounting block for power semiconductor. |
WO1985003385A1 (en) * | 1984-01-23 | 1985-08-01 | La Telemecanique Electrique | Mounting and connection device for power semi-conductors |
Also Published As
Publication number | Publication date |
---|---|
FR2384354B1 (en) | 1980-06-13 |
JPS53115180A (en) | 1978-10-07 |
DE2711711A1 (en) | 1978-09-21 |
DE2711711C3 (en) | 1979-11-22 |
SE7801698L (en) | 1978-09-18 |
DE2711711B2 (en) | 1979-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |