FR2384354A1 - Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre - Google Patents

Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre

Info

Publication number
FR2384354A1
FR2384354A1 FR7807516A FR7807516A FR2384354A1 FR 2384354 A1 FR2384354 A1 FR 2384354A1 FR 7807516 A FR7807516 A FR 7807516A FR 7807516 A FR7807516 A FR 7807516A FR 2384354 A1 FR2384354 A1 FR 2384354A1
Authority
FR
France
Prior art keywords
heat sinks
centre
cavity
electrically insulating
disc shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7807516A
Other languages
French (fr)
Other versions
FR2384354B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2384354A1 publication Critical patent/FR2384354A1/en
Application granted granted Critical
Publication of FR2384354B1 publication Critical patent/FR2384354B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Power Conversion In General (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

A semiconductor device is used which consists of a disc shaped semiconductor component mounted between the flat surfaces of two heat sinks. The device is for power function on e.g. traction vehicles, and is protected from environmental effects. This will also reduce the chances of leakage currents. The plate (44) made from an electrically insulating material is fitted between the two heat sinks (2, 3). The thickness of the plate is approximately equal to the thickness of the semiconductor component (1). The semiconductor component is mounted in a cavity (4a) in the centre of the insulating plate. The chamber containing the element has a gas tight seal.
FR7807516A 1977-03-17 1978-03-15 Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre Granted FR2384354A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2711711A DE2711711C3 (en) 1977-03-17 1977-03-17 Semiconductor arrangement with a disk-shaped semiconductor component clamped between heat sinks

Publications (2)

Publication Number Publication Date
FR2384354A1 true FR2384354A1 (en) 1978-10-13
FR2384354B1 FR2384354B1 (en) 1980-06-13

Family

ID=6003911

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7807516A Granted FR2384354A1 (en) 1977-03-17 1978-03-15 Power semiconductor disc shaped component between flat heat sinks - has electrically insulating plate as thick as device with cavity at centre

Country Status (4)

Country Link
JP (1) JPS53115180A (en)
DE (1) DE2711711C3 (en)
FR (1) FR2384354A1 (en)
SE (1) SE7801698L (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558644A1 (en) * 1984-01-23 1985-07-26 Telemecanique Electrique Mounting block for power semiconductor.
WO1985003385A1 (en) * 1984-01-23 1985-08-01 La Telemecanique Electrique Mounting and connection device for power semi-conductors

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3024001C2 (en) * 1980-06-24 1986-09-04 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Air-cooled semiconductor arrangement with disk-shaped semiconductor components clamped between heat sinks
DE3130896C2 (en) * 1981-07-31 1986-08-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Arrangement for cooling semiconductors via heat sinks
DE3327992A1 (en) * 1983-08-03 1985-02-21 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558644A1 (en) * 1984-01-23 1985-07-26 Telemecanique Electrique Mounting block for power semiconductor.
WO1985003385A1 (en) * 1984-01-23 1985-08-01 La Telemecanique Electrique Mounting and connection device for power semi-conductors

Also Published As

Publication number Publication date
FR2384354B1 (en) 1980-06-13
JPS53115180A (en) 1978-10-07
DE2711711A1 (en) 1978-09-21
DE2711711C3 (en) 1979-11-22
SE7801698L (en) 1978-09-18
DE2711711B2 (en) 1979-03-08

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Legal Events

Date Code Title Description
ST Notification of lapse