FR2379912A1 - Cooling of power semiconductor rectifier elements - which are immersed in boiling liquid in chamber in vessel partly filled with primary coolant - Google Patents

Cooling of power semiconductor rectifier elements - which are immersed in boiling liquid in chamber in vessel partly filled with primary coolant

Info

Publication number
FR2379912A1
FR2379912A1 FR7802952A FR7802952A FR2379912A1 FR 2379912 A1 FR2379912 A1 FR 2379912A1 FR 7802952 A FR7802952 A FR 7802952A FR 7802952 A FR7802952 A FR 7802952A FR 2379912 A1 FR2379912 A1 FR 2379912A1
Authority
FR
France
Prior art keywords
power semiconductor
partly filled
immersed
chamber
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7802952A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2379912A1 publication Critical patent/FR2379912A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)

Abstract

The rectifier is intended esp. for use as a medium voltage power switch, assembled of power semiconductor rectifiers with control and protective elements. The rectifiers are cooled by a primary cooling insulating liquid with low boiling point and sufficient breakdown strength. It is boiling at least at the nominal load of the rectifier element, and is cooled. The semiconductor rectifying elements (3) or the rectifier as a whole is placed together with the cooling liquid in a closed chamber (4) inside a vessel (1) partly filled with the primary cooling liquid.
FR7802952A 1977-02-02 1978-02-02 Cooling of power semiconductor rectifier elements - which are immersed in boiling liquid in chamber in vessel partly filled with primary coolant Withdrawn FR2379912A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772704781 DE2704781A1 (en) 1977-02-02 1977-02-02 COOLING OF SEMICONDUCTOR RECTIFIER ELEMENTS

Publications (1)

Publication Number Publication Date
FR2379912A1 true FR2379912A1 (en) 1978-09-01

Family

ID=6000401

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7802952A Withdrawn FR2379912A1 (en) 1977-02-02 1978-02-02 Cooling of power semiconductor rectifier elements - which are immersed in boiling liquid in chamber in vessel partly filled with primary coolant

Country Status (3)

Country Link
DE (1) DE2704781A1 (en)
FR (1) FR2379912A1 (en)
SE (1) SE7800998L (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2599131A1 (en) * 1982-03-22 1987-11-27 Grumman Aerospace Corp PANEL AND THERMAL TRANSFER SYSTEM WITH CAPILLARITY PUMPING
EP2590211A3 (en) * 2011-11-02 2018-01-17 General Electric Company System and method for operating an electric power converter

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR860000253B1 (en) * 1981-04-07 1986-03-21 카다야마 히도하지로 Boiling cooling apparatus
JPS5929985A (en) * 1982-08-11 1984-02-17 Hitachi Ltd Constant pressure type boiling and cooling device
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
DE19826733A1 (en) * 1998-06-16 1999-12-23 Isad Electronic Sys Gmbh & Co Cooling system for power electronics for operating at least one electrical unit of a motor vehicle
DK2996449T3 (en) 2014-09-11 2018-01-29 Siemens Ag Converter device with a multi-phase converter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2599131A1 (en) * 1982-03-22 1987-11-27 Grumman Aerospace Corp PANEL AND THERMAL TRANSFER SYSTEM WITH CAPILLARITY PUMPING
EP2590211A3 (en) * 2011-11-02 2018-01-17 General Electric Company System and method for operating an electric power converter

Also Published As

Publication number Publication date
DE2704781A1 (en) 1978-08-03
SE7800998L (en) 1978-08-03

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Legal Events

Date Code Title Description
ST Notification of lapse