SE7800998L - COOLING OF SEMICONDUCTOR CONVERTER ELEMENTS - Google Patents
COOLING OF SEMICONDUCTOR CONVERTER ELEMENTSInfo
- Publication number
- SE7800998L SE7800998L SE7800998A SE7800998A SE7800998L SE 7800998 L SE7800998 L SE 7800998L SE 7800998 A SE7800998 A SE 7800998A SE 7800998 A SE7800998 A SE 7800998A SE 7800998 L SE7800998 L SE 7800998L
- Authority
- SE
- Sweden
- Prior art keywords
- cooling
- converter elements
- semiconductor converter
- semiconductor
- elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772704781 DE2704781A1 (en) | 1977-02-02 | 1977-02-02 | COOLING OF SEMICONDUCTOR RECTIFIER ELEMENTS |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7800998L true SE7800998L (en) | 1978-08-03 |
Family
ID=6000401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7800998A SE7800998L (en) | 1977-02-02 | 1978-01-26 | COOLING OF SEMICONDUCTOR CONVERTER ELEMENTS |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2704781A1 (en) |
FR (1) | FR2379912A1 (en) |
SE (1) | SE7800998L (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR860000253B1 (en) * | 1981-04-07 | 1986-03-21 | 카다야마 히도하지로 | Boiling cooling apparatus |
US4602679A (en) * | 1982-03-22 | 1986-07-29 | Grumman Aerospace Corporation | Capillary-pumped heat transfer panel and system |
JPS5929985A (en) * | 1982-08-11 | 1984-02-17 | Hitachi Ltd | Constant pressure type boiling and cooling device |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
DE19826733A1 (en) * | 1998-06-16 | 1999-12-23 | Isad Electronic Sys Gmbh & Co | Cooling system for power electronics for operating at least one electrical unit of a motor vehicle |
US8711565B2 (en) * | 2011-11-02 | 2014-04-29 | General Electric Company | System and method for operating an electric power converter |
DK2996449T3 (en) | 2014-09-11 | 2018-01-29 | Siemens Ag | Converter device with a multi-phase converter |
-
1977
- 1977-02-02 DE DE19772704781 patent/DE2704781A1/en active Pending
-
1978
- 1978-01-26 SE SE7800998A patent/SE7800998L/en unknown
- 1978-02-02 FR FR7802952A patent/FR2379912A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE2704781A1 (en) | 1978-08-03 |
FR2379912A1 (en) | 1978-09-01 |
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