FR2317380A1 - Procede de depot electrolytique de cuivre sur un support d'aluminium - Google Patents
Procede de depot electrolytique de cuivre sur un support d'aluminiumInfo
- Publication number
- FR2317380A1 FR2317380A1 FR7620640A FR7620640A FR2317380A1 FR 2317380 A1 FR2317380 A1 FR 2317380A1 FR 7620640 A FR7620640 A FR 7620640A FR 7620640 A FR7620640 A FR 7620640A FR 2317380 A1 FR2317380 A1 FR 2317380A1
- Authority
- FR
- France
- Prior art keywords
- aluminum support
- deposit process
- copper electrolytic
- electrolytic deposit
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/593,894 US3969199A (en) | 1975-07-07 | 1975-07-07 | Coating aluminum with a strippable copper deposit |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2317380A1 true FR2317380A1 (fr) | 1977-02-04 |
FR2317380B1 FR2317380B1 (fr) | 1979-08-31 |
Family
ID=24376647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7620640A Granted FR2317380A1 (fr) | 1975-07-07 | 1976-07-06 | Procede de depot electrolytique de cuivre sur un support d'aluminium |
Country Status (11)
Country | Link |
---|---|
US (1) | US3969199A (fr) |
JP (1) | JPS5932553B2 (fr) |
BR (1) | BR7604424A (fr) |
CA (1) | CA1054969A (fr) |
DE (1) | DE2630151A1 (fr) |
FR (1) | FR2317380A1 (fr) |
GB (1) | GB1496458A (fr) |
IT (1) | IT1062229B (fr) |
LU (1) | LU75303A1 (fr) |
NL (1) | NL184482C (fr) |
SE (1) | SE434758B (fr) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4013492A (en) * | 1975-10-21 | 1977-03-22 | Edgar Avinell Raeger | Method of simultaneously plating dissimilar metals |
US4169018A (en) * | 1978-01-16 | 1979-09-25 | Gould Inc. | Process for electroforming copper foil |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
GB2091634B (en) * | 1981-01-22 | 1984-12-05 | Gen Electric | Transfer lamination of vapour deposited copper thin sheets and films |
US4431710A (en) * | 1981-01-22 | 1984-02-14 | General Electric Company | Laminate product of ultra thin copper film on a flexible aluminum carrier |
US4427716A (en) | 1983-01-21 | 1984-01-24 | General Electric Company | Method for predetermining peel strength at copper/aluminum interface |
US4452664A (en) * | 1983-08-01 | 1984-06-05 | General Electric Company | Method for predetermining peel strength at copper/aluminum interface |
JPS6138115A (ja) * | 1984-07-30 | 1986-02-24 | Honda Motor Co Ltd | 船外機 |
JPH0665847B2 (ja) * | 1985-06-08 | 1994-08-24 | 三信工業株式会社 | 船舶推進機の排気浄化装置 |
JPH0759896B2 (ja) * | 1986-07-29 | 1995-06-28 | 三信工業株式会社 | 船舶推進機の排気浄化装置 |
US4912020A (en) * | 1986-10-21 | 1990-03-27 | Westinghouse Electric Corp. | Printed circuit boards and method for manufacturing printed circuit boards |
JP2852385B2 (ja) * | 1990-06-05 | 1999-02-03 | 三信工業株式会社 | 船外機の排気ガス浄化装置 |
DE69226974T2 (de) * | 1991-02-18 | 1999-05-12 | Sumitomo Light Metal Industries Ltd., Tokio/Tokyo | Verwendung von plattiertem Aluminiumblech mit verbesserter Punktschweissbarkeit |
US5356723A (en) * | 1991-12-18 | 1994-10-18 | Sumitomo Metal Industries, Ltd. | Multilayer plated aluminum sheets |
JP3251338B2 (ja) | 1992-07-10 | 2002-01-28 | 三信工業株式会社 | 舶用エンジンの排気浄化装置 |
US5322975A (en) * | 1992-09-18 | 1994-06-21 | Gould Electronics Inc. | Universal carrier supported thin copper line |
GB2272001A (en) * | 1992-10-27 | 1994-05-04 | Zinex Corp | Low toxicity preparation bath for electroplating |
JPH06159073A (ja) * | 1992-11-26 | 1994-06-07 | Sanshin Ind Co Ltd | 船外機の排気装置 |
JP3284227B2 (ja) * | 1992-11-27 | 2002-05-20 | グリコ‐メタル‐ウエルケ・グリコ・ベー・ファウ・ウント・コンパニー・コマンディトゲゼルシャフト | 軸受滑り要素およびそれの製造方法 |
JP3089576B2 (ja) * | 1992-11-27 | 2000-09-18 | 三信工業株式会社 | 船外機の排気装置 |
JPH06185353A (ja) * | 1992-12-14 | 1994-07-05 | Sanshin Ind Co Ltd | 船舶推進機の排気装置 |
JP3370187B2 (ja) * | 1994-07-28 | 2003-01-27 | 三信工業株式会社 | 船外機の触媒洗浄構造 |
JP3534260B2 (ja) * | 1994-07-28 | 2004-06-07 | ヤマハマリン株式会社 | 船外機の触媒取付構造 |
JP3470915B2 (ja) * | 1994-07-28 | 2003-11-25 | ヤマハマリン株式会社 | 船外機の冷却構造 |
JPH08283959A (ja) * | 1995-04-07 | 1996-10-29 | Shinko Alcoa Yuso Kizai Kk | Al−Mg−Si系合金のジンケート処理材及びその製造方法 |
US6372364B1 (en) | 1999-08-18 | 2002-04-16 | Microcoating Technologies, Inc. | Nanostructure coatings |
US6656606B1 (en) | 2000-08-17 | 2003-12-02 | The Westaim Corporation | Electroplated aluminum parts and process of production |
US6447929B1 (en) | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
JP4160518B2 (ja) * | 2004-02-06 | 2008-10-01 | Dowaホールディングス株式会社 | 金属−セラミックス接合部材およびその製造方法 |
US7704936B2 (en) * | 2005-07-15 | 2010-04-27 | Kobe Steel Ltd. | Methods and removers for removing anodized films |
US8531024B2 (en) * | 2008-03-25 | 2013-09-10 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace |
US8232576B1 (en) | 2008-03-25 | 2012-07-31 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and ceramic block in post |
US20110163348A1 (en) | 2008-03-25 | 2011-07-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump |
US8212279B2 (en) * | 2008-03-25 | 2012-07-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader, signal post and cavity |
US8525214B2 (en) | 2008-03-25 | 2013-09-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with thermal via |
US8207553B2 (en) * | 2008-03-25 | 2012-06-26 | Bridge Semiconductor Corporation | Semiconductor chip assembly with base heat spreader and cavity in base |
US8110446B2 (en) * | 2008-03-25 | 2012-02-07 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace |
US20100052005A1 (en) * | 2008-03-25 | 2010-03-04 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader and conductive trace |
US20100072511A1 (en) * | 2008-03-25 | 2010-03-25 | Lin Charles W C | Semiconductor chip assembly with copper/aluminum post/base heat spreader |
US8354688B2 (en) | 2008-03-25 | 2013-01-15 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump |
US8288792B2 (en) | 2008-03-25 | 2012-10-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/post heat spreader |
US20110278638A1 (en) | 2008-03-25 | 2011-11-17 | Lin Charles W C | Semiconductor chip assembly with post/dielectric/post heat spreader |
US8203167B2 (en) * | 2008-03-25 | 2012-06-19 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal |
US8329510B2 (en) * | 2008-03-25 | 2012-12-11 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer |
US8067784B2 (en) | 2008-03-25 | 2011-11-29 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and substrate |
US8324723B2 (en) * | 2008-03-25 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump |
US8378372B2 (en) * | 2008-03-25 | 2013-02-19 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and horizontal signal routing |
US8129742B2 (en) * | 2008-03-25 | 2012-03-06 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and plated through-hole |
US8310043B2 (en) * | 2008-03-25 | 2012-11-13 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with ESD protection layer |
US8415703B2 (en) | 2008-03-25 | 2013-04-09 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
US20110156090A1 (en) * | 2008-03-25 | 2011-06-30 | Lin Charles W C | Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts |
US8269336B2 (en) * | 2008-03-25 | 2012-09-18 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and signal post |
US9018667B2 (en) * | 2008-03-25 | 2015-04-28 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and dual adhesives |
US7948076B2 (en) * | 2008-03-25 | 2011-05-24 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and vertical signal routing |
US8148747B2 (en) * | 2008-03-25 | 2012-04-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/cap heat spreader |
US20100181594A1 (en) * | 2008-03-25 | 2010-07-22 | Lin Charles W C | Semiconductor chip assembly with post/base heat spreader and cavity over post |
US8314438B2 (en) * | 2008-03-25 | 2012-11-20 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and cavity in bump |
US8193556B2 (en) * | 2008-03-25 | 2012-06-05 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and cavity in post |
US8324653B1 (en) | 2009-08-06 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with ceramic/metal substrate |
WO2014130453A1 (fr) * | 2013-02-19 | 2014-08-28 | Alumiplate, Inc. | Procédés pour améliorer l'adhérence de films d'aluminium |
US9758889B2 (en) * | 2014-05-08 | 2017-09-12 | Ymt Co., Ltd. | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby |
US10131998B2 (en) | 2015-10-02 | 2018-11-20 | Global Solar Energy, Inc. | Metalization of flexible polymer sheets |
US10040271B1 (en) | 2015-10-02 | 2018-08-07 | Global Solar Energy, Inc. | Metalization of flexible polymer sheets |
CN108018419A (zh) * | 2016-11-02 | 2018-05-11 | 洛阳铜金属材料发展有限公司 | 一种铜铝复合材料的分离方法 |
CN107447239B (zh) * | 2017-08-21 | 2018-08-28 | 安徽省含山县兴建铸造厂 | 一种耐腐蚀防振锤的制备方法 |
DE102020110646A1 (de) | 2020-04-20 | 2021-10-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zum Aufbringen von Leiterbahnen auf einem Substrat |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR977446A (fr) | 1942-07-03 | 1951-04-02 | Feuille de cuivre et son procédé de fabrication |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1144000A (en) * | 1914-01-19 | 1915-06-22 | Aluminum Francais Soc D | Treament of surfaces of aluminum or alloys of aluminum in order to prepare them for receiving a metallic deposit. |
DE633091C (de) * | 1932-10-25 | 1936-07-18 | Wilhelm Sailer | Verfahren zur Vorbehandlung von Aluminium und Aluminiumlegierungen zwecks Aufbringung von galvanischen Niederschlaegen |
US2676916A (en) * | 1949-09-23 | 1954-04-27 | Aluminum Co Of America | Electroplating on aluminum |
US2662831A (en) * | 1950-07-19 | 1953-12-15 | Anderson Brass Works | Method of bonding copper to aluminum or aluminum alloys |
US2650886A (en) * | 1951-01-19 | 1953-09-01 | Aluminum Co Of America | Procedure and bath for plating on aluminum |
US2874085A (en) * | 1953-10-27 | 1959-02-17 | Northern Engraving & Mfg Co | Method of making printed circuits |
US2995814A (en) * | 1957-10-11 | 1961-08-15 | Harold A Chamness | Method for soldering aluminum |
GB938236A (en) * | 1961-08-24 | 1963-10-02 | Clevite Corp | Improvements in and relating to methods of making copper foil and apparatus therefor |
GB1007252A (en) * | 1961-09-12 | 1965-10-13 | Canning And Company Ltd W | Electroplating on aluminium and its alloys |
-
1975
- 1975-07-07 US US05/593,894 patent/US3969199A/en not_active Expired - Lifetime
-
1976
- 1976-05-31 CA CA253,771A patent/CA1054969A/fr not_active Expired
- 1976-06-02 SE SE7606209A patent/SE434758B/xx not_active IP Right Cessation
- 1976-06-22 NL NLAANVRAGE7606783,A patent/NL184482C/xx not_active IP Right Cessation
- 1976-06-22 GB GB25970/76A patent/GB1496458A/en not_active Expired
- 1976-06-25 IT IT50146/76A patent/IT1062229B/it active
- 1976-07-05 DE DE19762630151 patent/DE2630151A1/de active Granted
- 1976-07-06 BR BR4424/76A patent/BR7604424A/pt unknown
- 1976-07-06 LU LU75303A patent/LU75303A1/xx unknown
- 1976-07-06 FR FR7620640A patent/FR2317380A1/fr active Granted
- 1976-07-07 JP JP51080038A patent/JPS5932553B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR977446A (fr) | 1942-07-03 | 1951-04-02 | Feuille de cuivre et son procédé de fabrication |
Non-Patent Citations (1)
Title |
---|
NEANT * |
Also Published As
Publication number | Publication date |
---|---|
GB1496458A (en) | 1977-12-30 |
DE2630151A1 (de) | 1977-01-27 |
JPS5932553B2 (ja) | 1984-08-09 |
FR2317380B1 (fr) | 1979-08-31 |
SE434758B (sv) | 1984-08-13 |
BR7604424A (pt) | 1978-01-31 |
IT1062229B (it) | 1983-09-20 |
NL184482C (nl) | 1989-08-01 |
JPS528932A (en) | 1977-01-24 |
US3969199A (en) | 1976-07-13 |
NL184482B (nl) | 1989-03-01 |
DE2630151C2 (fr) | 1989-08-10 |
LU75303A1 (fr) | 1977-02-23 |
CA1054969A (fr) | 1979-05-22 |
NL7606783A (nl) | 1977-01-11 |
SE7606209L (sv) | 1977-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
ST | Notification of lapse |