FR2175911B1 - - Google Patents
Info
- Publication number
- FR2175911B1 FR2175911B1 FR7308692A FR7308692A FR2175911B1 FR 2175911 B1 FR2175911 B1 FR 2175911B1 FR 7308692 A FR7308692 A FR 7308692A FR 7308692 A FR7308692 A FR 7308692A FR 2175911 B1 FR2175911 B1 FR 2175911B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/04—Dopants, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/041—Doping control in crystal growth
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/067—Graded energy gap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/145—Shaped junctions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/151—Simultaneous diffusion
Landscapes
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23402172A | 1972-03-13 | 1972-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2175911A1 FR2175911A1 (fr) | 1973-10-26 |
| FR2175911B1 true FR2175911B1 (fr) | 1978-02-10 |
Family
ID=22879545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7308692A Expired FR2175911B1 (fr) | 1972-03-13 | 1973-03-12 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3756861A (fr) |
| JP (1) | JPS493581A (fr) |
| BE (1) | BE796460A (fr) |
| CA (1) | CA963980A (fr) |
| DE (1) | DE2312061B2 (fr) |
| FR (1) | FR2175911B1 (fr) |
| GB (1) | GB1421222A (fr) |
| IT (1) | IT980547B (fr) |
| NL (1) | NL155983B (fr) |
| SE (1) | SE386309B (fr) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3862930A (en) * | 1972-08-22 | 1975-01-28 | Us Navy | Radiation-hardened cmos devices and circuits |
| FR2209217B1 (fr) * | 1972-11-10 | 1977-12-16 | Lignes Telegraph Telephon | |
| JPS5633864B2 (fr) * | 1972-12-06 | 1981-08-06 | ||
| US3887994A (en) * | 1973-06-29 | 1975-06-10 | Ibm | Method of manufacturing a semiconductor device |
| US3928081A (en) * | 1973-10-26 | 1975-12-23 | Signetics Corp | Method for fabricating semiconductor devices using composite mask and ion implantation |
| US3880676A (en) * | 1973-10-29 | 1975-04-29 | Rca Corp | Method of making a semiconductor device |
| US4033788A (en) * | 1973-12-10 | 1977-07-05 | Hughes Aircraft Company | Ion implanted gallium arsenide semiconductor devices fabricated in semi-insulating gallium arsenide substrates |
| US3928082A (en) * | 1973-12-28 | 1975-12-23 | Texas Instruments Inc | Self-aligned transistor process |
| US3902926A (en) * | 1974-02-21 | 1975-09-02 | Signetics Corp | Method of making an ion implanted resistor |
| US3925105A (en) * | 1974-07-02 | 1975-12-09 | Texas Instruments Inc | Process for fabricating integrated circuits utilizing ion implantation |
| US3933528A (en) * | 1974-07-02 | 1976-01-20 | Texas Instruments Incorporated | Process for fabricating integrated circuits utilizing ion implantation |
| GB1492447A (en) * | 1974-07-25 | 1977-11-16 | Siemens Ag | Semiconductor devices |
| JPS5431872B2 (fr) * | 1974-09-06 | 1979-10-09 | ||
| US3920483A (en) * | 1974-11-25 | 1975-11-18 | Ibm | Method of ion implantation through a photoresist mask |
| US3950188A (en) * | 1975-05-12 | 1976-04-13 | Trw Inc. | Method of patterning polysilicon |
| US4045250A (en) * | 1975-08-04 | 1977-08-30 | Rca Corporation | Method of making a semiconductor device |
| US4025364A (en) * | 1975-08-11 | 1977-05-24 | Fairchild Camera And Instrument Corporation | Process for simultaneously fabricating epitaxial resistors, base resistors, and vertical transistor bases |
| US4033787A (en) * | 1975-10-06 | 1977-07-05 | Honeywell Inc. | Fabrication of semiconductor devices utilizing ion implantation |
| US4030942A (en) * | 1975-10-28 | 1977-06-21 | International Business Machines Corporation | Semiconductor masking for device fabrication utilizing ion implantation and other methods |
| US4001050A (en) * | 1975-11-10 | 1977-01-04 | Ncr Corporation | Method of fabricating an isolated p-n junction |
| US4062699A (en) * | 1976-02-20 | 1977-12-13 | Western Digital Corporation | Method for fabricating diffusion self-aligned short channel MOS device |
| US4052229A (en) * | 1976-06-25 | 1977-10-04 | Intel Corporation | Process for preparing a substrate for mos devices of different thresholds |
| US4069068A (en) * | 1976-07-02 | 1978-01-17 | International Business Machines Corporation | Semiconductor fabrication method for improved device yield by minimizing pipes between common conductivity type regions |
| US4140547A (en) * | 1976-09-09 | 1979-02-20 | Tokyo Shibaura Electric Co., Ltd. | Method for manufacturing MOSFET devices by ion-implantation |
| EP0062725B1 (fr) * | 1981-04-14 | 1984-09-12 | Deutsche ITT Industries GmbH | Procédé pour la fabrication d'un transistor planaire intégré |
| US4694566A (en) * | 1982-04-12 | 1987-09-22 | Signetics Corporation | Method for manufacturing programmable read-only memory containing cells formed with opposing diodes |
| JPS6119520A (ja) * | 1984-07-06 | 1986-01-28 | Nippon Denso Co Ltd | 搬送装置 |
| JPH0784251B2 (ja) * | 1986-01-16 | 1995-09-13 | 日本電装株式会社 | 整列装填装置 |
| JPH0699038B2 (ja) * | 1986-02-27 | 1994-12-07 | 日本電装株式会社 | 連続波状フィンの搬送装置 |
| KR900005871B1 (ko) * | 1987-09-21 | 1990-08-13 | 삼성전자 주식회사 | 반도체 메모리소자의 제조방법 |
| US5244821A (en) * | 1991-06-07 | 1993-09-14 | At&T Bell Laboratories | Bipolar fabrication method |
| DE602008006579D1 (de) * | 2008-12-12 | 2011-06-09 | Abb Technology Ag | Herstellungsverfahren eines Leistungshalbleiterbauelements |
-
1972
- 1972-03-13 US US00234021A patent/US3756861A/en not_active Expired - Lifetime
- 1972-09-19 CA CA152,079A patent/CA963980A/en not_active Expired
-
1973
- 1973-03-06 SE SE7303123A patent/SE386309B/xx unknown
- 1973-03-07 GB GB1105573A patent/GB1421222A/en not_active Expired
- 1973-03-08 BE BE128527A patent/BE796460A/fr not_active IP Right Cessation
- 1973-03-09 IT IT67671/73A patent/IT980547B/it active
- 1973-03-09 NL NL7303358.A patent/NL155983B/xx not_active IP Right Cessation
- 1973-03-10 DE DE19732312061 patent/DE2312061B2/de not_active Ceased
- 1973-03-12 FR FR7308692A patent/FR2175911B1/fr not_active Expired
- 1973-03-13 JP JP48028651A patent/JPS493581A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS493581A (fr) | 1974-01-12 |
| DE2312061A1 (de) | 1973-10-18 |
| DE2312061B2 (de) | 1977-04-14 |
| SE386309B (sv) | 1976-08-02 |
| IT980547B (it) | 1974-10-10 |
| BE796460A (fr) | 1973-07-02 |
| NL155983B (nl) | 1978-02-15 |
| US3756861A (en) | 1973-09-04 |
| FR2175911A1 (fr) | 1973-10-26 |
| NL7303358A (fr) | 1973-09-17 |
| CA963980A (en) | 1975-03-04 |
| GB1421222A (en) | 1976-01-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |