FR2096574A1 - - Google Patents

Info

Publication number
FR2096574A1
FR2096574A1 FR7123773A FR7123773A FR2096574A1 FR 2096574 A1 FR2096574 A1 FR 2096574A1 FR 7123773 A FR7123773 A FR 7123773A FR 7123773 A FR7123773 A FR 7123773A FR 2096574 A1 FR2096574 A1 FR 2096574A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7123773A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2096574A1 publication Critical patent/FR2096574A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR7123773A 1970-06-29 1971-06-29 Withdrawn FR2096574A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5099670A 1970-06-29 1970-06-29

Publications (1)

Publication Number Publication Date
FR2096574A1 true FR2096574A1 (en) 1972-02-18

Family

ID=21968742

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7123773A Withdrawn FR2096574A1 (en) 1970-06-29 1971-06-29

Country Status (3)

Country Link
US (1) US3649350A (en)
DE (1) DE2132003A1 (en)
FR (1) FR2096574A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2489848A1 (en) * 1980-09-05 1982-03-12 Philips Nv PROCESS FOR PRODUCING COPPER ALLOY LAYERS AND CONFIGURATIONS, PRODUCTS THEREFORE OBTAINED AND SOLUTION FOR CARRYING OUT SAID METHOD

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002786A (en) * 1967-10-16 1977-01-11 Matsushita Electric Industrial Co., Ltd. Method for electroless copper plating
US3770464A (en) * 1971-10-12 1973-11-06 Shipley Co Dry replenishment of electroless copper solutions
DE2224304A1 (en) * 1972-05-18 1973-11-29 Bayer Ag SALT OF 3-HYDROXY-2-HYDROXYMETHYLPROPANE SULPHONIC ACID-1
NL164906C (en) * 1975-08-19 1981-02-16 Philips Nv PROCESS FOR PREPARING AN AQUEOUS ALKALINE SELLER BATH.
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
JP2001107258A (en) * 1999-10-06 2001-04-17 Hitachi Ltd Electroless copper plating method, plating device and multilayer wiring board
JP2003013247A (en) * 2001-04-24 2003-01-15 Murata Mfg Co Ltd Electroless copper plating bath and electronic component for high frequency
US9611550B2 (en) * 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
US10731258B2 (en) * 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10006126B2 (en) * 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
US10294569B2 (en) * 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE962489C (en) * 1954-02-10 1957-04-25 Dehydag Gmbh Saver pickling agent to protect metals when treated with acidic agents
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
DE1287885B (en) * 1964-05-27
DE1266099B (en) * 1965-02-20 1968-04-11 Schering Ag Bath for the reductive copper deposition
GB1089317A (en) * 1965-06-19 1967-11-01 Asahi Dow Ltd An electroless copper plating bath
US3420680A (en) * 1966-04-08 1969-01-07 Shipley Co Compositions and processes for electroless nickel plating
US3453123A (en) * 1966-12-05 1969-07-01 Lumer Research Corp Electroless copper plating solutions
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating
GB1184123A (en) * 1968-04-22 1970-03-11 Elektrogeraetewerk Gornsdorf V Process for Currentless Deposition of Copper Coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2489848A1 (en) * 1980-09-05 1982-03-12 Philips Nv PROCESS FOR PRODUCING COPPER ALLOY LAYERS AND CONFIGURATIONS, PRODUCTS THEREFORE OBTAINED AND SOLUTION FOR CARRYING OUT SAID METHOD

Also Published As

Publication number Publication date
US3649350A (en) 1972-03-14
DE2132003A1 (en) 1972-01-13

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Legal Events

Date Code Title Description
ST Notification of lapse