FR2096574A1 - - Google Patents
Info
- Publication number
- FR2096574A1 FR2096574A1 FR7123773A FR7123773A FR2096574A1 FR 2096574 A1 FR2096574 A1 FR 2096574A1 FR 7123773 A FR7123773 A FR 7123773A FR 7123773 A FR7123773 A FR 7123773A FR 2096574 A1 FR2096574 A1 FR 2096574A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5099670A | 1970-06-29 | 1970-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2096574A1 true FR2096574A1 (fr) | 1972-02-18 |
Family
ID=21968742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7123773A Withdrawn FR2096574A1 (fr) | 1970-06-29 | 1971-06-29 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3649350A (fr) |
DE (1) | DE2132003A1 (fr) |
FR (1) | FR2096574A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2489848A1 (fr) * | 1980-09-05 | 1982-03-12 | Philips Nv | Procede pour la realisation de couches et de configurations en alliages de cuivre, produits ainsi obtenus et solution pour la mise en oeuvre de ce procede |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4002786A (en) * | 1967-10-16 | 1977-01-11 | Matsushita Electric Industrial Co., Ltd. | Method for electroless copper plating |
US3770464A (en) * | 1971-10-12 | 1973-11-06 | Shipley Co | Dry replenishment of electroless copper solutions |
DE2224304A1 (de) * | 1972-05-18 | 1973-11-29 | Bayer Ag | Salze der 3-hydroxy-2-hydroxymethylpropan-sulfonsaeure-1 |
NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
US6277180B1 (en) * | 1999-07-12 | 2001-08-21 | Oliver Sales Company | Method of replacing evaporation losses from colloidal catalyst baths |
JP2001107258A (ja) * | 1999-10-06 | 2001-04-17 | Hitachi Ltd | 無電解銅めっき方法とめっき装置および多層配線基板 |
JP2003013247A (ja) * | 2001-04-24 | 2003-01-15 | Murata Mfg Co Ltd | 無電解銅めっき浴及び高周波用電子部品 |
US9611550B2 (en) * | 2012-12-26 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Formaldehyde free electroless copper plating compositions and methods |
US10731258B2 (en) * | 2014-10-27 | 2020-08-04 | Surface Technology, Inc. | Plating bath solutions |
US10006126B2 (en) * | 2014-10-27 | 2018-06-26 | Surface Technology, Inc. | Plating bath solutions |
US10294569B2 (en) * | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
US10655227B2 (en) * | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE962489C (de) * | 1954-02-10 | 1957-04-25 | Dehydag Gmbh | Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln |
US3222195A (en) * | 1962-02-23 | 1965-12-07 | Pearlstein Fred | Stabilized electroless copper solution |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
DE1287885B (fr) * | 1964-05-27 | |||
DE1266099B (de) * | 1965-02-20 | 1968-04-11 | Schering Ag | Bad fuer die reduktive Kupferabscheidung |
GB1089317A (en) * | 1965-06-19 | 1967-11-01 | Asahi Dow Ltd | An electroless copper plating bath |
US3420680A (en) * | 1966-04-08 | 1969-01-07 | Shipley Co | Compositions and processes for electroless nickel plating |
US3453123A (en) * | 1966-12-05 | 1969-07-01 | Lumer Research Corp | Electroless copper plating solutions |
US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
GB1184123A (en) * | 1968-04-22 | 1970-03-11 | Elektrogeraetewerk Gornsdorf V | Process for Currentless Deposition of Copper Coatings |
-
1970
- 1970-06-29 US US50996A patent/US3649350A/en not_active Expired - Lifetime
-
1971
- 1971-06-28 DE DE19712132003 patent/DE2132003A1/de active Pending
- 1971-06-29 FR FR7123773A patent/FR2096574A1/fr not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2489848A1 (fr) * | 1980-09-05 | 1982-03-12 | Philips Nv | Procede pour la realisation de couches et de configurations en alliages de cuivre, produits ainsi obtenus et solution pour la mise en oeuvre de ce procede |
Also Published As
Publication number | Publication date |
---|---|
US3649350A (en) | 1972-03-14 |
DE2132003A1 (de) | 1972-01-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |