FR1510752A - Dispositif à semi-conducteurs - Google Patents
Dispositif à semi-conducteursInfo
- Publication number
- FR1510752A FR1510752A FR94440A FR94440A FR1510752A FR 1510752 A FR1510752 A FR 1510752A FR 94440 A FR94440 A FR 94440A FR 94440 A FR94440 A FR 94440A FR 1510752 A FR1510752 A FR 1510752A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH355866A CH438497A (de) | 1966-03-11 | 1966-03-11 | Halbleiteranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1510752A true FR1510752A (fr) | 1968-01-19 |
Family
ID=4258568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR94440A Expired FR1510752A (fr) | 1966-03-11 | 1967-02-10 | Dispositif à semi-conducteurs |
Country Status (7)
Country | Link |
---|---|
US (1) | US3480842A (fr) |
CH (1) | CH438497A (fr) |
DE (1) | DE1539638B2 (fr) |
FR (1) | FR1510752A (fr) |
GB (1) | GB1161367A (fr) |
NL (1) | NL154066B (fr) |
SE (1) | SE323749B (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2556469C3 (de) * | 1975-12-15 | 1978-09-07 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterbauelement mit Druckkontakt |
JPS5550646A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Integrated circuit device |
US4295151A (en) * | 1980-01-14 | 1981-10-13 | Rca Corporation | Method of bonding two parts together and article produced thereby |
CA1316303C (fr) * | 1988-12-23 | 1993-04-20 | Thijs Eerkes | Structure composite |
US5069978A (en) * | 1990-10-04 | 1991-12-03 | Gte Products Corporation | Brazed composite having interlayer of expanded metal |
DE102014114093B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114095B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Sintervorrichtung |
DE102014114097B4 (de) | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
DE102014114096A1 (de) * | 2014-09-29 | 2016-03-31 | Danfoss Silicon Power Gmbh | Sinterwerkzeug für den Unterstempel einer Sintervorrichtung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE621965A (fr) * | 1961-09-02 | 1900-01-01 | ||
BE626623A (fr) * | 1961-12-30 | 1900-01-01 | ||
US3249829A (en) * | 1962-05-18 | 1966-05-03 | Transitron Electronic Corp | Encapsulated diode assembly |
-
1966
- 1966-03-11 CH CH355866A patent/CH438497A/de unknown
- 1966-04-06 DE DE19661539638 patent/DE1539638B2/de not_active Withdrawn
-
1967
- 1967-01-24 US US611332A patent/US3480842A/en not_active Expired - Lifetime
- 1967-02-10 FR FR94440A patent/FR1510752A/fr not_active Expired
- 1967-02-23 NL NL676702744A patent/NL154066B/xx unknown
- 1967-03-09 SE SE8271/67*A patent/SE323749B/xx unknown
- 1967-03-09 GB GB11234/67A patent/GB1161367A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1539638B2 (de) | 1971-08-19 |
NL154066B (nl) | 1977-07-15 |
NL6702744A (fr) | 1967-09-12 |
SE323749B (fr) | 1970-05-11 |
US3480842A (en) | 1969-11-25 |
CH438497A (de) | 1967-06-30 |
GB1161367A (en) | 1969-08-13 |
DE1539638A1 (de) | 1970-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR1516424A (fr) | Dispositif semi-conducteur | |
FR1475436A (fr) | Dispositif semi-conducteur | |
FR1473738A (fr) | Dispositif à semi-conducteurs | |
FR1510752A (fr) | Dispositif à semi-conducteurs | |
FR1486215A (fr) | Dispositif à semi-conducteur | |
FR1508763A (fr) | Dispositif à poulie | |
FR1489272A (fr) | Dispositif semi-conducteur | |
FR1515458A (fr) | Dispositif redresseur à semi-conducteurs en parallèle | |
FR1546423A (fr) | Dispositif à semi-conducteur | |
FR1498176A (fr) | Dispositif optoélectronique à semi-conducteurs | |
FR1541894A (fr) | Dispositif à semi-conducteurs | |
FR1518374A (fr) | Dispositif semi-conducteur | |
FR1546644A (fr) | Dispositif semi-conducteur | |
FR1529195A (fr) | Dispositif à semi-conducteur | |
FR1531714A (fr) | Dispositif semi-conducteur du type à disques | |
FR1471729A (fr) | Dispositif semi-conducteur | |
FR1470898A (fr) | Dispositif semi-conducteur | |
FR1467614A (fr) | Dispositif à semi-conducteurs | |
FR1485222A (fr) | Dispositif à semi-conducteurs | |
FR1530347A (fr) | Dispositif semiconducteur | |
FR1512146A (fr) | Dispositif à semi-conducteurs | |
FR1460267A (fr) | Dispositif à semi-conducteur | |
FR1433200A (fr) | Dispositif à semi-conducteur | |
FR1472985A (fr) | Dispositif à semi-conducteur | |
FR1475243A (fr) | Dispositif semiconducteur |