FR1418731A - Procédé de fabrication de circuits imprimés - Google Patents

Procédé de fabrication de circuits imprimés

Info

Publication number
FR1418731A
FR1418731A FR25A FR25A FR1418731A FR 1418731 A FR1418731 A FR 1418731A FR 25 A FR25 A FR 25A FR 25 A FR25 A FR 25A FR 1418731 A FR1418731 A FR 1418731A
Authority
FR
France
Prior art keywords
printed circuit
manufacturing process
circuit manufacturing
printed
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR25A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1418731A publication Critical patent/FR1418731A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
FR25A 1963-12-30 1964-12-28 Procédé de fabrication de circuits imprimés Expired FR1418731A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA757597T
US334623A US3305416A (en) 1963-12-30 1963-12-30 Method for making printed circuits

Publications (1)

Publication Number Publication Date
FR1418731A true FR1418731A (fr) 1965-11-19

Family

ID=73264268

Family Applications (1)

Application Number Title Priority Date Filing Date
FR25A Expired FR1418731A (fr) 1963-12-30 1964-12-28 Procédé de fabrication de circuits imprimés

Country Status (5)

Country Link
US (1) US3305416A (fr)
CA (1) CA757597A (fr)
DE (1) DE1465746A1 (fr)
FR (1) FR1418731A (fr)
GB (1) GB1022809A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2077597A1 (fr) * 1970-01-14 1971-10-29 Bereday Sigmund
FR2557497A1 (fr) * 1983-12-29 1985-07-05 Demeure Loic Support metallise a base de polypropylene et procede de fabrication de ce support

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3437522A (en) * 1965-02-19 1969-04-08 Schjeldahl Co G T Process for removing adhesives from polyolefin film by immersion in sulfuric acid
US3514308A (en) * 1966-05-16 1970-05-26 Phillips Petroleum Co Bonding polyolefins to metallic substrates
US3532570A (en) * 1966-06-08 1970-10-06 Du Pont Dimensionally stable electrical circuit laminates
US3508983A (en) * 1967-04-24 1970-04-28 Schjeldahl Co G T Use of a silane coating to bond copper to plastic in making a printed circuit
US3793106A (en) * 1969-12-31 1974-02-19 Macdermid Inc Process for forming plastic parts having surfaces receptive to adherent coatings
US3645772A (en) * 1970-06-30 1972-02-29 Du Pont Process for improving bonding of a photoresist to copper
US3841905A (en) * 1970-11-19 1974-10-15 Rbp Chem Corp Method of preparing printed circuit boards with terminal tabs
US3960635A (en) * 1971-06-07 1976-06-01 N.V. Hollandse Signaalapparaten Method for the fabrication of printed circuits
DE2544553C2 (de) * 1974-10-08 1983-08-04 E.I. du Pont de Nemours and Co., 19898 Wilmington, Del. Verfahren zum Aufbringen einer photopolymerisierbaren festen Resistschicht auf ein Substrat
JPS593740B2 (ja) * 1975-07-30 1984-01-25 日立化成工業株式会社 凹凸表面に感光層の形成された固体板の製造法
US4125661A (en) * 1976-03-19 1978-11-14 Mona Industries, Inc. Laminated plates for chemical milling
US4110147A (en) * 1976-03-24 1978-08-29 Macdermid Incorporated Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
NZ198031A (en) * 1980-08-21 1988-11-29 Dennison Mfg Co Electrostatic printer: charged particles extracted from glow discharge
US4587199A (en) * 1983-07-11 1986-05-06 E. I. Du Pont De Nemours And Company Controlled roughening of a photosensitive composition
DE3840704A1 (de) * 1987-12-02 1989-07-06 Mitsubishi Gas Chemical Co Verfahren zur erzeugung eines kupferplattierten schichtstoffs
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
US5180625A (en) * 1989-05-03 1993-01-19 Trw Inc. Ceramic aluminum laminate and thermally conductive adhesive therefor
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US5976391A (en) * 1998-01-13 1999-11-02 Ford Motor Company Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932599A (en) * 1955-05-09 1960-04-12 Sanders Associates Inc Method of preparation of thermoplastic resin coated printed circuit
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2077597A1 (fr) * 1970-01-14 1971-10-29 Bereday Sigmund
FR2557497A1 (fr) * 1983-12-29 1985-07-05 Demeure Loic Support metallise a base de polypropylene et procede de fabrication de ce support
EP0149394A2 (fr) * 1983-12-29 1985-07-24 Loic Demeure Procédé de réalisation d'un support à base de polypropylène comportant plusieurs couches métalliques et support obtenu par ce procédé
EP0149394A3 (en) * 1983-12-29 1985-09-11 Loic Demeure Process for making a panel made of polypropylene as basic component, which has several metallic layers, and panel made according to this process

Also Published As

Publication number Publication date
DE1465746A1 (de) 1969-01-09
GB1022809A (en) 1966-03-16
CA757597A (en) 1967-04-25
US3305416A (en) 1967-02-21

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