FR1420044A - Procédé de fabrication des circuits imprimés - Google Patents

Procédé de fabrication des circuits imprimés

Info

Publication number
FR1420044A
FR1420044A FR999914A FR999914A FR1420044A FR 1420044 A FR1420044 A FR 1420044A FR 999914 A FR999914 A FR 999914A FR 999914 A FR999914 A FR 999914A FR 1420044 A FR1420044 A FR 1420044A
Authority
FR
France
Prior art keywords
manufacturing process
printed circuits
printed
circuits
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR999914A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6203164A external-priority patent/JPS4813790B1/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to FR999914A priority Critical patent/FR1420044A/fr
Application granted granted Critical
Publication of FR1420044A publication Critical patent/FR1420044A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR999914A 1963-12-26 1964-12-24 Procédé de fabrication des circuits imprimés Expired FR1420044A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR999914A FR1420044A (fr) 1963-12-26 1964-12-24 Procédé de fabrication des circuits imprimés

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP7154063 1963-12-26
JP1683564 1964-03-25
JP2467664 1964-04-28
JP6203164A JPS4813790B1 (fr) 1964-10-30 1964-10-30
FR999914A FR1420044A (fr) 1963-12-26 1964-12-24 Procédé de fabrication des circuits imprimés

Publications (1)

Publication Number Publication Date
FR1420044A true FR1420044A (fr) 1965-12-03

Family

ID=27515314

Family Applications (1)

Application Number Title Priority Date Filing Date
FR999914A Expired FR1420044A (fr) 1963-12-26 1964-12-24 Procédé de fabrication des circuits imprimés

Country Status (1)

Country Link
FR (1) FR1420044A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2375796A1 (fr) * 1976-12-22 1978-07-21 Du Pont Procede pour la production d'elements a circuits imprimes en utilisant une feuille photosensible auto-supportee
EP0003364A1 (fr) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Réalisation de circuits imprimés par un procédé rendant jointives les particules d'images de poudres métalliques
EP0003801A1 (fr) * 1978-02-17 1979-09-05 E.I. Du Pont De Nemours And Company Utilisation d'un support photosensible pour la réalisation de connexions de passage dans des panneaux à circuits imprimés
FR2458202A1 (fr) * 1976-07-21 1980-12-26 Shipley Co Procede, matiere et appareil de fabrication de circuits imprimes
EP0414362A2 (fr) * 1989-08-22 1991-02-27 Hewlett-Packard Company Procédé pour la formation des traces conductives sur un substrat

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2458202A1 (fr) * 1976-07-21 1980-12-26 Shipley Co Procede, matiere et appareil de fabrication de circuits imprimes
FR2375796A1 (fr) * 1976-12-22 1978-07-21 Du Pont Procede pour la production d'elements a circuits imprimes en utilisant une feuille photosensible auto-supportee
EP0003364A1 (fr) * 1978-02-01 1979-08-08 E.I. Du Pont De Nemours And Company Réalisation de circuits imprimés par un procédé rendant jointives les particules d'images de poudres métalliques
EP0003801A1 (fr) * 1978-02-17 1979-09-05 E.I. Du Pont De Nemours And Company Utilisation d'un support photosensible pour la réalisation de connexions de passage dans des panneaux à circuits imprimés
EP0414362A2 (fr) * 1989-08-22 1991-02-27 Hewlett-Packard Company Procédé pour la formation des traces conductives sur un substrat
EP0414362A3 (en) * 1989-08-22 1991-07-17 Hewlett-Packard Company Method for forming conductive traces on a substrate

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