FR1235596A - Procédé de fabrication de circuits électriques - Google Patents

Procédé de fabrication de circuits électriques

Info

Publication number
FR1235596A
FR1235596A FR797503A FR797503A FR1235596A FR 1235596 A FR1235596 A FR 1235596A FR 797503 A FR797503 A FR 797503A FR 797503 A FR797503 A FR 797503A FR 1235596 A FR1235596 A FR 1235596A
Authority
FR
France
Prior art keywords
manufacturing process
electric circuit
circuit manufacturing
electric
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR797503A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1235596A publication Critical patent/FR1235596A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR797503A 1958-06-23 1959-06-15 Procédé de fabrication de circuits électriques Expired FR1235596A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US743682A US3059320A (en) 1958-06-23 1958-06-23 Method of making electrical circuit

Publications (1)

Publication Number Publication Date
FR1235596A true FR1235596A (fr) 1960-07-08

Family

ID=24989747

Family Applications (1)

Application Number Title Priority Date Filing Date
FR797503A Expired FR1235596A (fr) 1958-06-23 1959-06-15 Procédé de fabrication de circuits électriques

Country Status (3)

Country Link
US (1) US3059320A (fr)
FR (1) FR1235596A (fr)
GB (1) GB883872A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158927A (en) * 1961-06-05 1964-12-01 Burroughs Corp Method of fabricating sub-miniature semiconductor matrix apparatus
EP0074065A2 (fr) * 1981-09-03 1983-03-16 GTE Products Corporation Procédé de laminage à durcissement rapide pour flash multiple
FR2550410A1 (fr) * 1983-08-01 1985-02-08 Gen Electric Procede de fabrication de stratifies revetus de cuivre

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256587A (en) * 1962-03-23 1966-06-21 Solid State Products Inc Method of making vertically and horizontally integrated microcircuitry
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
FR1344911A (fr) * 1962-07-18 1963-12-06 Bull Sa Machines Perfectionnements aux blocs modulaires de composants électriques
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
ATE83883T1 (de) * 1985-09-04 1993-01-15 Ufe Inc Herstellung von gedruckten schaltungen.
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
FR2616995A1 (fr) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
US5470644A (en) * 1994-04-21 1995-11-28 Durant; David Apparatus and method for fabrication of printed circuit boards
US5587890A (en) 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
DE10103193B4 (de) * 2001-01-24 2008-10-30 W.C. Heraeus Gmbh Verfahren zur Herstellung von Leiterbahnstrukturen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2623592A (en) * 1952-12-30 Card reproducing machine
US1794831A (en) * 1929-01-19 1931-03-03 Lionel Corp Multiple conductor strip and method of making the same
US2120461A (en) * 1938-02-28 1938-06-14 Copeman Lab Co Method of protecting and forming prefinished metal
US2613252A (en) * 1947-09-23 1952-10-07 Erie Resistor Corp Electric circuit and component
US2694249A (en) * 1948-04-16 1954-11-16 Kapp Robert Manufacturing method for complex electrical and wireless apparatus
US2724674A (en) * 1952-11-26 1955-11-22 Pritikin Nathan Printed circuit and method for producing the same
US2972003A (en) * 1956-02-21 1961-02-14 Rogers Corp Printed circuits and methods of making the same
US2929965A (en) * 1956-07-02 1960-03-22 Alonzo F Oden Mounting structures for electrical assemblies and methods of forming same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158927A (en) * 1961-06-05 1964-12-01 Burroughs Corp Method of fabricating sub-miniature semiconductor matrix apparatus
EP0074065A2 (fr) * 1981-09-03 1983-03-16 GTE Products Corporation Procédé de laminage à durcissement rapide pour flash multiple
EP0074065A3 (fr) * 1981-09-03 1984-02-22 GTE Products Corporation Procédé de laminage à durcissement rapide pour flash multiple
FR2550410A1 (fr) * 1983-08-01 1985-02-08 Gen Electric Procede de fabrication de stratifies revetus de cuivre

Also Published As

Publication number Publication date
GB883872A (en) 1961-12-06
US3059320A (en) 1962-10-23

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