FI901083A0 - Epoksidihartsiseoksia - Google Patents
EpoksidihartsiseoksiaInfo
- Publication number
- FI901083A0 FI901083A0 FI901083A FI901083A FI901083A0 FI 901083 A0 FI901083 A0 FI 901083A0 FI 901083 A FI901083 A FI 901083A FI 901083 A FI901083 A FI 901083A FI 901083 A0 FI901083 A0 FI 901083A0
- Authority
- FI
- Finland
- Prior art keywords
- epoxy resin
- aromatic
- materials
- prepregs
- epoxide
- Prior art date
Links
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000004844 aliphatic epoxy resin Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- -1 phosphorus compound Chemical class 0.000 abstract 1
- 229920000768 polyamine Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Disintegrating Or Milling (AREA)
- Biological Depolymerization Polymers (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP89103802 | 1989-03-03 | ||
EP89103802A EP0384940B1 (de) | 1989-03-03 | 1989-03-03 | Epoxidharzmischungen |
Publications (3)
Publication Number | Publication Date |
---|---|
FI901083A0 true FI901083A0 (fi) | 1990-03-02 |
FI96034B FI96034B (fi) | 1996-01-15 |
FI96034C FI96034C (fi) | 1996-04-25 |
Family
ID=8201040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI901083A FI96034C (fi) | 1989-03-03 | 1990-03-02 | Epoksidihartsiseoksia |
Country Status (8)
Country | Link |
---|---|
US (1) | US5376453A (fi) |
EP (1) | EP0384940B1 (fi) |
JP (1) | JP2797254B2 (fi) |
KR (1) | KR0176963B1 (fi) |
AT (1) | ATE107677T1 (fi) |
DE (1) | DE58907953D1 (fi) |
FI (1) | FI96034C (fi) |
HK (1) | HK64096A (fi) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0428863B1 (de) * | 1989-10-24 | 1995-09-27 | Siemens Aktiengesellschaft | Epoxidharzmischungen |
DE69211566T2 (de) * | 1991-11-27 | 1997-01-16 | Akzo Nobel Nv | Phosphor enthaltende Harz |
DE4340834A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie ihre Verwendung |
DE4308187A1 (de) * | 1993-03-15 | 1994-09-22 | Siemens Ag | Epoxidharzmischungen |
TW294693B (fi) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
TW294694B (fi) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
TW297034B (fi) * | 1994-09-09 | 1997-02-01 | Siemens Ag | |
DE19548026A1 (de) * | 1995-12-21 | 1997-06-26 | Bayer Ag | Polyaminvernetzer-Zubereitung und ihre Herstellung |
US6201074B1 (en) | 1996-09-26 | 2001-03-13 | Siemens Aktiengesellschaft | Mixture of epoxy resin, epoxide group-containing P compound, P-modified epoxy resin and polyamine |
US6353080B1 (en) | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
DE19747553A1 (de) * | 1997-10-28 | 1999-04-29 | Siemens Ag | Epoxidharzmischung, daraus hergestellte Verbundwerkstoffe und deren Verwendung |
US6207595B1 (en) | 1998-03-02 | 2001-03-27 | International Business Machines Corporation | Laminate and method of manufacture thereof |
JP4535559B2 (ja) * | 2000-04-04 | 2010-09-01 | イビデン株式会社 | 多層プリント配線板 |
DE60045173D1 (de) | 1999-08-12 | 2010-12-09 | Ibiden Co Ltd | Mehrschichtige Leiterplatte mit einer Lötstoppzusammensetzung |
US6432539B1 (en) | 1999-11-01 | 2002-08-13 | Chang Chun Plastics Co. Ltd. | Phosphorus-containing polymer having phenolic units and uses thereof |
TW476771B (en) * | 1999-11-05 | 2002-02-21 | Chang Chun Plastics Co Ltd | Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener |
CN1423678B (zh) | 1999-12-13 | 2010-11-10 | 陶氏环球技术公司 | 含磷元素阻燃剂环氧树脂组合物 |
US6403220B1 (en) | 1999-12-13 | 2002-06-11 | The Dow Chemical Company | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
JP4530469B2 (ja) * | 2000-04-04 | 2010-08-25 | イビデン株式会社 | 多層プリント配線板および多層プリント配線板の製造方法 |
TW498084B (en) * | 2000-07-19 | 2002-08-11 | Chang Chun Plastics Co Ltd | Flame-retardant resin and flame retardant composition containing the same |
TW572964B (en) * | 2000-09-21 | 2004-01-21 | Chang Chun Plastics Co Ltd | Flame retarded epoxy resin composition |
JP4311938B2 (ja) * | 2001-02-15 | 2009-08-12 | グレート・レークス・ケミカル・コーポレーション | 新規のヒドロキシアリールホスフィンオキシド、グリシジルエーテル、並びにそれらから誘導されるエポキシ組成物、複合材料、及び積層物 |
US20060099458A1 (en) * | 2001-02-15 | 2006-05-11 | Hanson Mark V | 1, 4-Hydroquinone functionalized phosphinates and phosphonates |
US6887950B2 (en) * | 2001-02-15 | 2005-05-03 | Pabu Services, Inc. | Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
JP2003003134A (ja) * | 2001-06-20 | 2003-01-08 | Japan Gore Tex Inc | Icチップ接着用シートおよびicパッケージ |
WO2003099900A1 (en) | 2002-05-29 | 2003-12-04 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same |
CN1659217A (zh) * | 2002-05-30 | 2005-08-24 | 陶氏环球技术公司 | 无卤阻燃热塑性树脂组合物 |
US6863982B2 (en) * | 2002-10-11 | 2005-03-08 | Ppg Industries Ohio, Inc. | Curable film-forming composition exhibiting improved yellowing resistance |
TW575633B (en) * | 2002-10-21 | 2004-02-11 | Chang Chun Plastics Co Ltd | Flame retardant epoxy resin composition and phosphorus containing compound |
US6887574B2 (en) * | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
US20050075024A1 (en) * | 2003-10-01 | 2005-04-07 | Ranken Paul F. | Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
US7270845B2 (en) * | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
US7145221B2 (en) * | 2004-03-31 | 2006-12-05 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US7078816B2 (en) * | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
KR101151943B1 (ko) | 2004-05-28 | 2012-06-01 | 다우 글로벌 테크놀로지스 엘엘씨 | 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유 화합물 |
FR2888255B1 (fr) * | 2005-07-06 | 2007-11-16 | Saint Gobain Vetrotex | Fils de renforcement et composites ayant une tenue au feu amelioree |
JP2008083684A (ja) * | 2006-08-30 | 2008-04-10 | Nitto Denko Corp | フレキシブル配線回路基板用感光性樹脂組成物およびそれを用いて得られるフレキシブル配線回路基板 |
US20120083564A1 (en) * | 2009-06-22 | 2012-04-05 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
US20110065870A1 (en) * | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins |
US20110065838A1 (en) * | 2009-09-11 | 2011-03-17 | Chemtura Corporation | Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins |
US8937145B2 (en) | 2009-12-02 | 2015-01-20 | Dow Global Technologies Llc | Epoxy resin compositions |
WO2011068645A1 (en) | 2009-12-02 | 2011-06-09 | Dow Global Technologies Inc. | Coating compositions |
CN102666638B (zh) | 2009-12-02 | 2015-01-14 | 陶氏环球技术有限责任公司 | 复合材料组合物 |
WO2012064703A1 (en) | 2010-11-12 | 2012-05-18 | Albemarle Corporation | Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions |
US9145488B2 (en) | 2011-05-19 | 2015-09-29 | Chemtura Corporation | Aluminum phosphorus acid salts as epoxy resin cure inhibitors |
CN103382242B (zh) | 2013-06-25 | 2015-06-24 | 江苏雅克科技股份有限公司 | 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物 |
CN107266639B (zh) | 2014-08-15 | 2019-08-27 | 江苏雅克科技股份有限公司 | 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物 |
CN107033343B (zh) | 2014-11-06 | 2019-01-08 | 江苏雅克科技股份有限公司 | 含磷官能化聚(亚芳基醚)及包含含磷官能化聚(亚芳基醚)的可固化组合物 |
CN106750226B (zh) | 2014-11-11 | 2019-01-08 | 江苏雅克科技股份有限公司 | 含磷聚酯化合物组成及含磷阻燃环氧树脂固化物的制备方法 |
US9534108B2 (en) | 2015-03-13 | 2017-01-03 | Chemtura Corporation | Flame retardant epoxy resins comprising phosphorus containing flame retardants |
WO2016166226A1 (de) | 2015-04-17 | 2016-10-20 | Alzchem Ag | Härter und härtungsbeschleuniger mit flammschutzwirkung zur härtung von epoxidharzen |
JP6579309B2 (ja) * | 2015-05-01 | 2019-09-25 | 味の素株式会社 | 硬化性組成物 |
WO2018164833A1 (en) | 2017-03-07 | 2018-09-13 | Icl-Ip America Inc. | Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2856369A (en) * | 1953-05-08 | 1958-10-14 | Shell Dev | Epoxy-substituted esters of phosphoruscontaining acid and their polymers |
DE2538675A1 (de) * | 1975-08-30 | 1977-03-03 | Hoechst Ag | Verfahren zur herstellung von phosphorhaltigen epoxidharzen und ihre verwendung zur flammfestausruestung |
DE2743680C2 (de) * | 1977-09-28 | 1985-04-11 | Siemens AG, 1000 Berlin und 8000 München | Selbstverlöschende Verbundwerkstoffe |
US4632973A (en) * | 1985-10-18 | 1986-12-30 | The Dow Chemical Company | Method of improving flame resistance of epoxy resins and resulting compositions |
EP0271772A3 (de) * | 1986-12-15 | 1988-12-14 | Siemens Aktiengesellschaft | Epoxidharz-Formmassen |
DE3776642D1 (de) * | 1986-12-15 | 1992-03-19 | Siemens Nixdorf Inf Syst | Verfahren zur herstellung von prepregs und deren verwendung. |
-
1989
- 1989-03-03 EP EP89103802A patent/EP0384940B1/de not_active Expired - Lifetime
- 1989-03-03 DE DE58907953T patent/DE58907953D1/de not_active Expired - Fee Related
- 1989-03-03 AT AT89103802T patent/ATE107677T1/de not_active IP Right Cessation
-
1990
- 1990-03-02 JP JP2051606A patent/JP2797254B2/ja not_active Expired - Fee Related
- 1990-03-02 FI FI901083A patent/FI96034C/fi not_active IP Right Cessation
- 1990-03-03 KR KR1019900002887A patent/KR0176963B1/ko not_active IP Right Cessation
-
1993
- 1993-03-19 US US08/033,985 patent/US5376453A/en not_active Expired - Fee Related
-
1996
- 1996-04-11 HK HK64096A patent/HK64096A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FI96034B (fi) | 1996-01-15 |
FI96034C (fi) | 1996-04-25 |
HK64096A (en) | 1996-04-19 |
DE58907953D1 (de) | 1994-07-28 |
JPH02269730A (ja) | 1990-11-05 |
EP0384940B1 (de) | 1994-06-22 |
JP2797254B2 (ja) | 1998-09-17 |
KR900014508A (ko) | 1990-10-24 |
ATE107677T1 (de) | 1994-07-15 |
US5376453A (en) | 1994-12-27 |
EP0384940A1 (de) | 1990-09-05 |
KR0176963B1 (ko) | 1999-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE58907953D1 (de) | Epoxidharzmischungen. | |
FI901084A0 (fi) | Epoksidihartsimuovausmassoja | |
ATE166660T1 (de) | Epoxidharzmischungen | |
ATE297426T1 (de) | Schnellhärtendes kohlenstofffaserverstärktes epoxydharz | |
BR8400531A (pt) | Composicoes de epoxido com um endurecedor de diamina,material de reforco pre-impregnado com a resina sintetica(prepreg),e aglomerado | |
DE59403119D1 (de) | Epoxidharzmischungen | |
GB8912952D0 (en) | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones | |
DE59008799D1 (de) | Härtbare Epoxidharz-Stoffgemische enthaltend einen latenten Härter, ein Amin und ein Thiol. | |
NO881546L (no) | Herdningskomponenter for kunstharpikser og deres anvendelse. | |
ES2061449T3 (es) | Aminotriacinas beta-hidroxialquilcarbamilmetiladas y composiciones endurecibles que las contienen. | |
DE3853816D1 (de) | Epoxydharzzusammensetzung. | |
DE69130769D1 (de) | Epoxydharze auf basis von diaminobisimidverbindungen | |
DE59502777D1 (de) | Epoxidharzmischungen für prepregs und verbundwerkstoffe | |
ATE28654T1 (de) | Epoxidharzzusammensetzungen mit oligomeren diaminen als haertungsmitteln und verbundstoffen mit hoher festigkeit. | |
ATE72450T1 (de) | Verfahren zur herstellung von prepregs und deren verwendung. | |
ATE128473T1 (de) | Epoxidharzmischungen. | |
EP0249263A3 (en) | Thermoplastic polymer composition having thermosetting processing characteristics | |
SE8802700D0 (sv) | Herdbara epoxihartsblandningar | |
SE8802699D0 (sv) | Herdbara epoxihartsblandningar | |
ATE152471T1 (de) | Epoxyharz und epoxyharzzusammensetzung | |
Gentzkow et al. | Epoxy Resin Compositions | |
EP0491045A4 (en) | Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB | Publication of examined application | ||
MM | Patent lapsed |
Owner name: SIEMENS AKTIENGESELLSCHAFT |