FI901083A0 - Epoksidihartsiseoksia - Google Patents

Epoksidihartsiseoksia

Info

Publication number
FI901083A0
FI901083A0 FI901083A FI901083A FI901083A0 FI 901083 A0 FI901083 A0 FI 901083A0 FI 901083 A FI901083 A FI 901083A FI 901083 A FI901083 A FI 901083A FI 901083 A0 FI901083 A0 FI 901083A0
Authority
FI
Finland
Prior art keywords
epoxy resin
aromatic
materials
prepregs
epoxide
Prior art date
Application number
FI901083A
Other languages
English (en)
Swedish (sv)
Other versions
FI96034B (fi
FI96034C (fi
Inventor
Gentzkow Wolfgang Von
Jurgen Huber
Wolfgang Rogler
Dieter Wilhelm
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI901083A0 publication Critical patent/FI901083A0/fi
Publication of FI96034B publication Critical patent/FI96034B/fi
Application granted granted Critical
Publication of FI96034C publication Critical patent/FI96034C/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Disintegrating Or Milling (AREA)
  • Biological Depolymerization Polymers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
FI901083A 1989-03-03 1990-03-02 Epoksidihartsiseoksia FI96034C (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP89103802 1989-03-03
EP89103802A EP0384940B1 (de) 1989-03-03 1989-03-03 Epoxidharzmischungen

Publications (3)

Publication Number Publication Date
FI901083A0 true FI901083A0 (fi) 1990-03-02
FI96034B FI96034B (fi) 1996-01-15
FI96034C FI96034C (fi) 1996-04-25

Family

ID=8201040

Family Applications (1)

Application Number Title Priority Date Filing Date
FI901083A FI96034C (fi) 1989-03-03 1990-03-02 Epoksidihartsiseoksia

Country Status (8)

Country Link
US (1) US5376453A (fi)
EP (1) EP0384940B1 (fi)
JP (1) JP2797254B2 (fi)
KR (1) KR0176963B1 (fi)
AT (1) ATE107677T1 (fi)
DE (1) DE58907953D1 (fi)
FI (1) FI96034C (fi)
HK (1) HK64096A (fi)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428863B1 (de) * 1989-10-24 1995-09-27 Siemens Aktiengesellschaft Epoxidharzmischungen
DE69211566T2 (de) * 1991-11-27 1997-01-16 Akzo Nobel Nv Phosphor enthaltende Harz
DE4340834A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung sowie ihre Verwendung
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW294693B (fi) * 1994-09-09 1997-01-01 Siemens Ag
TW294694B (fi) * 1994-09-09 1997-01-01 Siemens Ag
TW297034B (fi) * 1994-09-09 1997-02-01 Siemens Ag
DE19548026A1 (de) * 1995-12-21 1997-06-26 Bayer Ag Polyaminvernetzer-Zubereitung und ihre Herstellung
US6201074B1 (en) 1996-09-26 2001-03-13 Siemens Aktiengesellschaft Mixture of epoxy resin, epoxide group-containing P compound, P-modified epoxy resin and polyamine
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
DE19747553A1 (de) * 1997-10-28 1999-04-29 Siemens Ag Epoxidharzmischung, daraus hergestellte Verbundwerkstoffe und deren Verwendung
US6207595B1 (en) 1998-03-02 2001-03-27 International Business Machines Corporation Laminate and method of manufacture thereof
JP4535559B2 (ja) * 2000-04-04 2010-09-01 イビデン株式会社 多層プリント配線板
DE60045173D1 (de) 1999-08-12 2010-12-09 Ibiden Co Ltd Mehrschichtige Leiterplatte mit einer Lötstoppzusammensetzung
US6432539B1 (en) 1999-11-01 2002-08-13 Chang Chun Plastics Co. Ltd. Phosphorus-containing polymer having phenolic units and uses thereof
TW476771B (en) * 1999-11-05 2002-02-21 Chang Chun Plastics Co Ltd Nitrogen-containing and phosphorus-containing resin hardener and flame resistant resin composition containing the hardener
CN1423678B (zh) 1999-12-13 2010-11-10 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
US6403220B1 (en) 1999-12-13 2002-06-11 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
JP4530469B2 (ja) * 2000-04-04 2010-08-25 イビデン株式会社 多層プリント配線板および多層プリント配線板の製造方法
TW498084B (en) * 2000-07-19 2002-08-11 Chang Chun Plastics Co Ltd Flame-retardant resin and flame retardant composition containing the same
TW572964B (en) * 2000-09-21 2004-01-21 Chang Chun Plastics Co Ltd Flame retarded epoxy resin composition
JP4311938B2 (ja) * 2001-02-15 2009-08-12 グレート・レークス・ケミカル・コーポレーション 新規のヒドロキシアリールホスフィンオキシド、グリシジルエーテル、並びにそれらから誘導されるエポキシ組成物、複合材料、及び積層物
US20060099458A1 (en) * 2001-02-15 2006-05-11 Hanson Mark V 1, 4-Hydroquinone functionalized phosphinates and phosphonates
US6887950B2 (en) * 2001-02-15 2005-05-03 Pabu Services, Inc. Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
JP2003003134A (ja) * 2001-06-20 2003-01-08 Japan Gore Tex Inc Ｉｃチップ接着用シートおよびｉｃパッケージ
WO2003099900A1 (en) 2002-05-29 2003-12-04 Nippon Chemical Industrial Co., Ltd. Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same
CN1659217A (zh) * 2002-05-30 2005-08-24 陶氏环球技术公司 无卤阻燃热塑性树脂组合物
US6863982B2 (en) * 2002-10-11 2005-03-08 Ppg Industries Ohio, Inc. Curable film-forming composition exhibiting improved yellowing resistance
TW575633B (en) * 2002-10-21 2004-02-11 Chang Chun Plastics Co Ltd Flame retardant epoxy resin composition and phosphorus containing compound
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
US7270845B2 (en) * 2004-03-31 2007-09-18 Endicott Interconnect Technologies, Inc. Dielectric composition for forming dielectric layer for use in circuitized substrates
US7145221B2 (en) * 2004-03-31 2006-12-05 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
KR101151943B1 (ko) 2004-05-28 2012-06-01 다우 글로벌 테크놀로지스 엘엘씨 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유 화합물
FR2888255B1 (fr) * 2005-07-06 2007-11-16 Saint Gobain Vetrotex Fils de renforcement et composites ayant une tenue au feu amelioree
JP2008083684A (ja) * 2006-08-30 2008-04-10 Nitto Denko Corp フレキシブル配線回路基板用感光性樹脂組成物およびそれを用いて得られるフレキシブル配線回路基板
US20120083564A1 (en) * 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
US20110065870A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
US20110065838A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US8937145B2 (en) 2009-12-02 2015-01-20 Dow Global Technologies Llc Epoxy resin compositions
WO2011068645A1 (en) 2009-12-02 2011-06-09 Dow Global Technologies Inc. Coating compositions
CN102666638B (zh) 2009-12-02 2015-01-14 陶氏环球技术有限责任公司 复合材料组合物
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
US9145488B2 (en) 2011-05-19 2015-09-29 Chemtura Corporation Aluminum phosphorus acid salts as epoxy resin cure inhibitors
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN107033343B (zh) 2014-11-06 2019-01-08 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及包含含磷官能化聚(亚芳基醚)的可固化组合物
CN106750226B (zh) 2014-11-11 2019-01-08 江苏雅克科技股份有限公司 含磷聚酯化合物组成及含磷阻燃环氧树脂固化物的制备方法
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
WO2016166226A1 (de) 2015-04-17 2016-10-20 Alzchem Ag Härter und härtungsbeschleuniger mit flammschutzwirkung zur härtung von epoxidharzen
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards

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US2856369A (en) * 1953-05-08 1958-10-14 Shell Dev Epoxy-substituted esters of phosphoruscontaining acid and their polymers
DE2538675A1 (de) * 1975-08-30 1977-03-03 Hoechst Ag Verfahren zur herstellung von phosphorhaltigen epoxidharzen und ihre verwendung zur flammfestausruestung
DE2743680C2 (de) * 1977-09-28 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Selbstverlöschende Verbundwerkstoffe
US4632973A (en) * 1985-10-18 1986-12-30 The Dow Chemical Company Method of improving flame resistance of epoxy resins and resulting compositions
EP0271772A3 (de) * 1986-12-15 1988-12-14 Siemens Aktiengesellschaft Epoxidharz-Formmassen
DE3776642D1 (de) * 1986-12-15 1992-03-19 Siemens Nixdorf Inf Syst Verfahren zur herstellung von prepregs und deren verwendung.

Also Published As

Publication number Publication date
FI96034B (fi) 1996-01-15
FI96034C (fi) 1996-04-25
HK64096A (en) 1996-04-19
DE58907953D1 (de) 1994-07-28
JPH02269730A (ja) 1990-11-05
EP0384940B1 (de) 1994-06-22
JP2797254B2 (ja) 1998-09-17
KR900014508A (ko) 1990-10-24
ATE107677T1 (de) 1994-07-15
US5376453A (en) 1994-12-27
EP0384940A1 (de) 1990-09-05
KR0176963B1 (ko) 1999-05-15

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Owner name: SIEMENS AKTIENGESELLSCHAFT