FI20125389L - Piirikorttijärjestely - Google Patents
Piirikorttijärjestely Download PDFInfo
- Publication number
- FI20125389L FI20125389L FI20125389A FI20125389A FI20125389L FI 20125389 L FI20125389 L FI 20125389L FI 20125389 A FI20125389 A FI 20125389A FI 20125389 A FI20125389 A FI 20125389A FI 20125389 L FI20125389 L FI 20125389L
- Authority
- FI
- Finland
- Prior art keywords
- circuit board
- board system
- circuit
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125389A FI20125389L (fi) | 2012-04-05 | 2012-04-05 | Piirikorttijärjestely |
US13/856,474 US20130265731A1 (en) | 2012-04-05 | 2013-04-04 | Circuit board system |
EP13162244.1A EP2648491A3 (en) | 2012-04-05 | 2013-04-04 | A circuit board system |
CN2013101176764A CN103369828A (zh) | 2012-04-05 | 2013-04-07 | 电路板*** |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125389A FI20125389L (fi) | 2012-04-05 | 2012-04-05 | Piirikorttijärjestely |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20125389L true FI20125389L (fi) | 2013-10-06 |
Family
ID=48040087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20125389A FI20125389L (fi) | 2012-04-05 | 2012-04-05 | Piirikorttijärjestely |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130265731A1 (fi) |
EP (1) | EP2648491A3 (fi) |
CN (1) | CN103369828A (fi) |
FI (1) | FI20125389L (fi) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10887993B2 (en) * | 2015-12-31 | 2021-01-05 | Texas Instruments Incorporated | Standoff connector for electrical devices |
CN107732488A (zh) * | 2016-08-10 | 2018-02-23 | 泰科电子(上海)有限公司 | 连接件 |
CN107770960B (zh) * | 2016-08-15 | 2020-01-03 | 台达电子工业股份有限公司 | 电子元件及电路板的连接结构 |
US11107962B2 (en) * | 2018-12-18 | 2021-08-31 | Soulnano Limited | UV LED array with power interconnect and heat sink |
US11755158B2 (en) * | 2020-03-11 | 2023-09-12 | Cfa Properties, Inc. | Capacitive touch surface |
CN111743211B (zh) * | 2020-06-24 | 2024-02-20 | 深圳市吉迩科技有限公司 | 电路板结构及气溶胶产生装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2933845B2 (ja) * | 1995-02-17 | 1999-08-16 | 三菱電機株式会社 | 印刷回路基板取付装置 |
US6923691B2 (en) * | 2002-10-04 | 2005-08-02 | Sanmina-Sci Corporation | Circuit board standoff |
JP4196901B2 (ja) * | 2004-08-11 | 2008-12-17 | ソニー株式会社 | 電子回路装置 |
JP2006237507A (ja) * | 2005-02-28 | 2006-09-07 | Mitsubishi Heavy Ind Ltd | 半田付けを用いた構造物 |
JP2007115846A (ja) * | 2005-10-19 | 2007-05-10 | Nidec Shibaura Corp | 回路基板支持用スペーサおよびそれを用いた回路基板ユニット |
DE102007035794A1 (de) | 2007-07-31 | 2009-02-05 | Robert Bosch Gmbh | Leiterplattenverbund sowie Verfahren zum Herstellen eines Leiterplattenverbundes |
TWI332812B (en) * | 2007-11-28 | 2010-11-01 | Delta Electronics Inc | Circuit board module with surface mount conductive pin and circuit boards assembly having same |
JP5240844B2 (ja) * | 2008-11-26 | 2013-07-17 | エヌイーシーコンピュータテクノ株式会社 | 構造体、これを用いた基板装置及びその実装方法 |
DE102009053998A1 (de) * | 2009-11-19 | 2011-05-26 | Still Gmbh | Umrichter, insbesondere mehrphasiger Drehstromumrichter |
-
2012
- 2012-04-05 FI FI20125389A patent/FI20125389L/fi not_active IP Right Cessation
-
2013
- 2013-04-04 EP EP13162244.1A patent/EP2648491A3/en not_active Withdrawn
- 2013-04-04 US US13/856,474 patent/US20130265731A1/en not_active Abandoned
- 2013-04-07 CN CN2013101176764A patent/CN103369828A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN103369828A (zh) | 2013-10-23 |
EP2648491A2 (en) | 2013-10-09 |
US20130265731A1 (en) | 2013-10-10 |
EP2648491A3 (en) | 2014-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |