FI20045235A - Förfarande för att behandla ett elektriskt ledande mönster - Google Patents
Förfarande för att behandla ett elektriskt ledande mönster Download PDFInfo
- Publication number
- FI20045235A FI20045235A FI20045235A FI20045235A FI20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A
- Authority
- FI
- Finland
- Prior art keywords
- treating
- procedure
- electrically conductive
- conductive pattern
- pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045235A FI20045235A (sv) | 2004-06-22 | 2004-06-22 | Förfarande för att behandla ett elektriskt ledande mönster |
PCT/FI2005/000293 WO2005125290A1 (en) | 2004-06-22 | 2005-06-21 | A method for processing an electrically conductive pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045235A FI20045235A (sv) | 2004-06-22 | 2004-06-22 | Förfarande för att behandla ett elektriskt ledande mönster |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20045235A0 FI20045235A0 (sv) | 2004-06-22 |
FI20045235A true FI20045235A (sv) | 2005-12-23 |
Family
ID=32524609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20045235A FI20045235A (sv) | 2004-06-22 | 2004-06-22 | Förfarande för att behandla ett elektriskt ledande mönster |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI20045235A (sv) |
WO (1) | WO2005125290A1 (sv) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20055515A (sv) * | 2005-09-28 | 2007-07-06 | Selmic Oy | Fastsättning av en ledarkonstruktion på ett objekt |
ES2586726T3 (es) | 2006-12-05 | 2016-10-18 | Maricare Oy | Una banda de sensores eléctricos, sistema y un método para su fabricación |
DE102010015659A1 (de) | 2010-04-20 | 2011-10-20 | Giesecke & Devrient Gmbh | Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3589224A (en) * | 1968-10-14 | 1971-06-29 | Buckee Mears Co | Die punching printed circuit |
DE3031751A1 (de) * | 1980-08-22 | 1982-04-15 | Wilhelm Ruf KG, 8000 München | Verfahren zur herstellung elektrotechnischer bauteile und nach diesem verfahren hergestellter schiebe- oder drehwiderstand |
JPH077866B2 (ja) * | 1992-08-03 | 1995-01-30 | 株式会社名機製作所 | プリント回路基板の製造方法 |
JP3387557B2 (ja) * | 1993-06-16 | 2003-03-17 | 三菱電線工業株式会社 | 打抜残材の除去方法 |
DE19840825A1 (de) * | 1998-09-07 | 2000-03-30 | Siemens Ag | Verfahren zum Herstellen einer Schaltungsträgerplatte sowie Schaltungsträgerplatte |
US6921869B2 (en) * | 2001-09-26 | 2005-07-26 | Fujikura Ltd. | Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof |
CN1751546A (zh) * | 2003-03-05 | 2006-03-22 | 英滕电路公司 | 制备导电图案的方法 |
-
2004
- 2004-06-22 FI FI20045235A patent/FI20045235A/sv unknown
-
2005
- 2005-06-21 WO PCT/FI2005/000293 patent/WO2005125290A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FI20045235A0 (sv) | 2004-06-22 |
WO2005125290A1 (en) | 2005-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: INTUNE CIRCUITS OY Free format text: INTUNE CIRCUITS OY |