FI20045235A - Procedure for treating an electrically conductive pattern - Google Patents

Procedure for treating an electrically conductive pattern Download PDF

Info

Publication number
FI20045235A
FI20045235A FI20045235A FI20045235A FI20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A FI 20045235 A FI20045235 A FI 20045235A
Authority
FI
Finland
Prior art keywords
treating
procedure
electrically conductive
conductive pattern
pattern
Prior art date
Application number
FI20045235A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20045235A0 (en
Inventor
Lauri Huhtasalo
Juha-Pekka Alho
Original Assignee
Intune Circuits Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intune Circuits Oy filed Critical Intune Circuits Oy
Priority to FI20045235A priority Critical patent/FI20045235A/en
Publication of FI20045235A0 publication Critical patent/FI20045235A0/en
Priority to PCT/FI2005/000293 priority patent/WO2005125290A1/en
Publication of FI20045235A publication Critical patent/FI20045235A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
FI20045235A 2004-06-22 2004-06-22 Procedure for treating an electrically conductive pattern FI20045235A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20045235A FI20045235A (en) 2004-06-22 2004-06-22 Procedure for treating an electrically conductive pattern
PCT/FI2005/000293 WO2005125290A1 (en) 2004-06-22 2005-06-21 A method for processing an electrically conductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20045235A FI20045235A (en) 2004-06-22 2004-06-22 Procedure for treating an electrically conductive pattern

Publications (2)

Publication Number Publication Date
FI20045235A0 FI20045235A0 (en) 2004-06-22
FI20045235A true FI20045235A (en) 2005-12-23

Family

ID=32524609

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045235A FI20045235A (en) 2004-06-22 2004-06-22 Procedure for treating an electrically conductive pattern

Country Status (2)

Country Link
FI (1) FI20045235A (en)
WO (1) WO2005125290A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20055515A (en) * 2005-09-28 2007-07-06 Selmic Oy Attaching a leader structure to an object
ES2586726T3 (en) * 2006-12-05 2016-10-18 Maricare Oy A band of electrical sensors, system and a method for its manufacture
DE102010015659A1 (en) 2010-04-20 2011-10-20 Giesecke & Devrient Gmbh Transfer method for the production of conductor structures by means of nanoinks

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589224A (en) * 1968-10-14 1971-06-29 Buckee Mears Co Die punching printed circuit
DE3031751A1 (en) * 1980-08-22 1982-04-15 Wilhelm Ruf KG, 8000 München METHOD FOR PRODUCING ELECTROTECHNICAL COMPONENTS AND SLIDING OR TURNING RESISTANCE PRODUCED BY THIS METHOD
JPH077866B2 (en) * 1992-08-03 1995-01-30 株式会社名機製作所 Method of manufacturing printed circuit board
JP3387557B2 (en) * 1993-06-16 2003-03-17 三菱電線工業株式会社 How to remove blanks
DE19840825A1 (en) * 1998-09-07 2000-03-30 Siemens Ag Printed circuit board manufacturing method for vehicle air bag control device
US6921869B2 (en) * 2001-09-26 2005-07-26 Fujikura Ltd. Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof
CN1751546A (en) * 2003-03-05 2006-03-22 英滕电路公司 Method for manufacturing an electrically conductive pattern

Also Published As

Publication number Publication date
FI20045235A0 (en) 2004-06-22
WO2005125290A1 (en) 2005-12-29

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Legal Events

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PC Transfer of assignment of patent

Owner name: INTUNE CIRCUITS OY

Free format text: INTUNE CIRCUITS OY