ES8706990A1 - Procedimiento para fabricar una tarjeta de memoria electronica. - Google Patents
Procedimiento para fabricar una tarjeta de memoria electronica.Info
- Publication number
- ES8706990A1 ES8706990A1 ES553359A ES553359A ES8706990A1 ES 8706990 A1 ES8706990 A1 ES 8706990A1 ES 553359 A ES553359 A ES 553359A ES 553359 A ES553359 A ES 553359A ES 8706990 A1 ES8706990 A1 ES 8706990A1
- Authority
- ES
- Spain
- Prior art keywords
- bumps
- boards
- electronic module
- manufacturing electronic
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Photoreceptors In Electrophotography (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Holo Graphy (AREA)
Abstract
PROCEDIMIENTO PARA LA FABRICACION DE UNA TARJETA DE MEMORIA ELECTRONICA. COMPRENDE LAS OPERACIONES CONSISTENTES EN REALIZAR EN EL CUERPO DE LA TARJETA UNA CAVIDAD QUE COMPRENDE UN PRIMER VACIADO, QUE DESEMBOCA EN UNA PRIMERA CARA PRINCIPAL DEL CITADO CUERPO, Y UN SEGUNDO VACIADO QUE DESEMBOCA EN EL FONDO DEL PRIMER VACIADO; EN COLOCAR EL MODULO EN LA CAVIDAD, DE TAL MODO QUE LA PASTILLA DEL MODULO PENETRE PARCIALMENTE EN EL SEGUNDO VACIADO Y QUE EL SOPORTE DEL MODULO PENETRE PARCIALMENTE EN EL PRIMER VACIADO; EN LLEVAR LAS ASPEREZAS PREVISTAS EN EL FONDO DE LA CAVIDAD, A SU TEMPERATURA DE REBLANDECIMIENTO, Y SE APLICA CON PRESION AL CITADO MODULO ELECTRONICO APLASTANDO EL EXTREMO DE LAS CITADAS ASPEREZAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504658A FR2579799B1 (fr) | 1985-03-28 | 1985-03-28 | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8706990A1 true ES8706990A1 (es) | 1987-06-16 |
ES553359A0 ES553359A0 (es) | 1987-06-16 |
Family
ID=9317687
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES553359A Expired ES8706990A1 (es) | 1985-03-28 | 1986-03-25 | Procedimiento para fabricar una tarjeta de memoria electronica. |
ES1987297137U Expired ES297137Y (es) | 1985-03-28 | 1987-03-16 | Tarjeta de memoria electronica |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1987297137U Expired ES297137Y (es) | 1985-03-28 | 1987-03-16 | Tarjeta de memoria electronica |
Country Status (8)
Country | Link |
---|---|
US (1) | US4737620A (es) |
EP (1) | EP0197847B1 (es) |
JP (1) | JPS61227094A (es) |
AT (1) | ATE48484T1 (es) |
CA (1) | CA1255388A (es) |
DE (1) | DE3667345D1 (es) |
ES (2) | ES8706990A1 (es) |
FR (1) | FR2579799B1 (es) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2502511B2 (ja) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | 半導体装置の製造方法 |
US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
FR2605144B1 (fr) * | 1986-10-14 | 1989-02-24 | Flonic Sa | Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede |
FR2613510A1 (fr) * | 1987-03-31 | 1988-10-07 | Flonic Sa | Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues |
CH672285A5 (es) * | 1987-04-14 | 1989-11-15 | Landis & Gyr Ag | |
JP2562476B2 (ja) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | 1cカードの製造方法 |
FR2617666B1 (fr) * | 1987-07-02 | 1989-10-27 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
FR2636453B1 (fr) * | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | Procede d'encapsulation de circuits-integres notamment pour cartes a puces |
JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
US5282113A (en) * | 1990-03-05 | 1994-01-25 | Hitachi Maxell, Ltd. | Memory card with a plurality of contact spaces |
FR2664076A1 (fr) * | 1990-03-28 | 1992-01-03 | Schlumberger Ind Sa | Procede de fabrication d'une carte a memoire electronique. |
EP0472768A1 (de) * | 1990-08-30 | 1992-03-04 | Siemens Aktiengesellschaft | Verfahren zum Befestigen eines Chipmoduls auf einer Chipkarte |
FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
JP3290986B2 (ja) * | 1991-05-10 | 2002-06-10 | ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング | 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置 |
FR2677785A1 (fr) * | 1991-06-17 | 1992-12-18 | Philips Composants | Procede de fabrication d'une carte a microcircuit. |
DE4126874C2 (de) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Datenträger mit integriertem Schaltkreis |
DE9110057U1 (de) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme GmbH, 6072 Dreieich | Datenträgerkarte mit eingeklebtem Schaltkreisträger |
DE4140529C2 (de) * | 1991-12-09 | 1997-07-31 | Gao Ges Automation Org | Verfahren zum Bedrucken von Karten mit sacklochförmiger Aussparung und Vorrichtung zur Ausführung des Verfahrens |
DE4142409A1 (de) * | 1991-12-20 | 1993-07-01 | Gao Ges Automation Org | Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens |
FR2695854B1 (fr) | 1992-09-22 | 1994-12-09 | Leroux Ets Gilles | Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités. |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
CH688696A5 (fr) * | 1993-03-17 | 1998-01-15 | François Droz | Procédé de fabrication d'une carte comprenant au moins un élément électronique. |
WO1995033246A1 (fr) * | 1994-05-27 | 1995-12-07 | Ake Gustafson | Procede de realisation d'un module electronique et module electronique obtenu selon ce procede |
US5837992A (en) * | 1994-07-15 | 1998-11-17 | Shinko Nameplate Co., Ltd. | Memory card and its manufacturing method |
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
FR2727542B1 (fr) * | 1994-11-25 | 1997-01-03 | Droz Francois | Carte incorporant au moins un element electronique |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
DE19502398A1 (de) * | 1995-01-26 | 1996-08-01 | Giesecke & Devrient Gmbh | Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper |
EP0806019B1 (en) * | 1995-01-27 | 1998-11-25 | Interprint Formularios Ltda. | Memory card and method of producing same |
DE19601389A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chipkartenkörper |
CA2262481A1 (fr) * | 1996-08-05 | 1998-02-12 | Vincent Permingeat | Perfectionnement a un procede de realisation de cartes a memoire et cartes ainsi obtenues |
DE19701165C1 (de) * | 1997-01-15 | 1998-04-09 | Siemens Ag | Chipkartenmodul |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
KR100255108B1 (en) * | 1997-06-18 | 2000-05-01 | Samsung Electronics Co Ltd | Chip card |
DE19749243C1 (de) * | 1997-11-07 | 1998-11-19 | Richard Herbst | Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse |
FR2774198B1 (fr) * | 1998-01-27 | 2001-08-31 | Solaic Sa | Procede de fixation d'un module electronique dans une cavite d'un corps d'objet portable, notamment corps de carte, par ultrasons |
DE19816066A1 (de) * | 1998-04-09 | 1999-10-14 | Philips Patentverwaltung | Folie als Träger von integrierten Schaltungen |
FR2803434A1 (fr) * | 1999-12-30 | 2001-07-06 | Schlumberger Systems & Service | Procede de protection d'un circuit integre dispose dans une cavite d'un corps de carte et outil correspondant |
FR2805067B1 (fr) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | Jeton a puce electronique et procedes de fabrication d'un tel jeton |
DE10006515C5 (de) * | 2000-02-15 | 2004-09-16 | Datacard Corp., Minnetonka | Verfahren zum Einbau von Chips in Kartenkörper |
JP4516179B2 (ja) * | 2000-05-22 | 2010-08-04 | 大日本印刷株式会社 | 接触・非接触共用icカードの製造方法及び製造装置 |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
US20090091424A1 (en) * | 2007-10-05 | 2009-04-09 | Manfred Rietzler | Transponder inlay for a personal document and method of manufacturing same |
ITRM20090236A1 (it) * | 2009-05-12 | 2010-11-13 | Gep S P A | Sistema di collocazione stabile del modulo del chip di silicio nella cava generata sull inlay tramite deposito di materiale collante sintetico |
FR2968432B1 (fr) * | 2010-12-06 | 2012-12-28 | Oberthur Technologies | Procédé d'encartage d'un module dans une carte a microcircuit |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11267172B2 (en) * | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3679523B1 (en) | 2017-09-07 | 2023-02-01 | Composecure LLC | Transaction card with embedded electronic components and process for manufacture |
CN118364848A (zh) | 2017-10-18 | 2024-07-19 | 安全创造有限责任公司 | 具有窗或窗图案和可选背光的金属、陶瓷或陶瓷涂层的交易卡 |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
FR2538930B1 (fr) * | 1983-01-05 | 1989-05-19 | Seiichiro Aigo | Carte d'information |
EP0128822B1 (fr) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
-
1985
- 1985-03-28 FR FR8504658A patent/FR2579799B1/fr not_active Expired - Lifetime
-
1986
- 1986-03-25 US US06/844,039 patent/US4737620A/en not_active Expired - Lifetime
- 1986-03-25 ES ES553359A patent/ES8706990A1/es not_active Expired
- 1986-03-26 JP JP61068246A patent/JPS61227094A/ja active Pending
- 1986-03-27 CA CA000505281A patent/CA1255388A/en not_active Expired
- 1986-03-27 AT AT86400670T patent/ATE48484T1/de not_active IP Right Cessation
- 1986-03-27 DE DE8686400670T patent/DE3667345D1/de not_active Expired - Lifetime
- 1986-03-27 EP EP86400670A patent/EP0197847B1/fr not_active Expired
-
1987
- 1987-03-16 ES ES1987297137U patent/ES297137Y/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0197847A1 (fr) | 1986-10-15 |
ES297137Y (es) | 1989-10-16 |
FR2579799A1 (fr) | 1986-10-03 |
JPS61227094A (ja) | 1986-10-09 |
US4737620A (en) | 1988-04-12 |
ES297137U (es) | 1989-04-01 |
DE3667345D1 (de) | 1990-01-11 |
ES553359A0 (es) | 1987-06-16 |
EP0197847B1 (fr) | 1989-12-06 |
ATE48484T1 (de) | 1989-12-15 |
CA1255388A (en) | 1989-06-06 |
FR2579799B1 (fr) | 1990-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 20070414 |