ES8700538A1 - Procedimiento para la obtencion de circuitos impresos - Google Patents

Procedimiento para la obtencion de circuitos impresos

Info

Publication number
ES8700538A1
ES8700538A1 ES544533A ES544533A ES8700538A1 ES 8700538 A1 ES8700538 A1 ES 8700538A1 ES 544533 A ES544533 A ES 544533A ES 544533 A ES544533 A ES 544533A ES 8700538 A1 ES8700538 A1 ES 8700538A1
Authority
ES
Spain
Prior art keywords
baseboards
cyclohexene
activated
way
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES544533A
Other languages
English (en)
Spanish (es)
Other versions
ES544533A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of ES544533A0 publication Critical patent/ES544533A0/es
Publication of ES8700538A1 publication Critical patent/ES8700538A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Auxiliary Devices For Music (AREA)
  • Luminescent Compositions (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Paper (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Electric Motors In General (AREA)
  • Networks Using Active Elements (AREA)
  • Emergency Protection Circuit Devices (AREA)
ES544533A 1984-06-26 1985-06-25 Procedimiento para la obtencion de circuitos impresos Expired ES8700538A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843423457 DE3423457A1 (de) 1984-06-26 1984-06-26 Verfahren zur herstellung von leiterplatten

Publications (2)

Publication Number Publication Date
ES544533A0 ES544533A0 (es) 1986-10-16
ES8700538A1 true ES8700538A1 (es) 1986-10-16

Family

ID=6239138

Family Applications (1)

Application Number Title Priority Date Filing Date
ES544533A Expired ES8700538A1 (es) 1984-06-26 1985-06-25 Procedimiento para la obtencion de circuitos impresos

Country Status (6)

Country Link
EP (1) EP0166327B1 (de)
JP (1) JPS6118195A (de)
AT (1) ATE39367T1 (de)
DE (2) DE3423457A1 (de)
ES (1) ES8700538A1 (de)
FI (1) FI852488L (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA956294A (en) * 1973-03-14 1974-10-15 Stanley J. Whittaker Rotary valve
JPS5694690A (en) * 1979-12-27 1981-07-31 Asahi Chemical Ind Method of manufacturing thick film fine pattern
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3324767A1 (de) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung

Also Published As

Publication number Publication date
FI852488A0 (fi) 1985-06-24
DE3566905D1 (en) 1989-01-26
EP0166327B1 (de) 1988-12-21
EP0166327A3 (en) 1986-10-08
EP0166327A2 (de) 1986-01-02
FI852488L (fi) 1985-12-27
DE3423457A1 (de) 1986-01-02
ES544533A0 (es) 1986-10-16
ATE39367T1 (de) 1989-01-15
JPS6118195A (ja) 1986-01-27

Similar Documents

Publication Publication Date Title
AU574823B2 (en) Metallization of electronic interconnection boards
EP0266877A3 (de) Metallisierte Substrate und deren Herstellungsverfahren
GB1266000A (de)
GB1268317A (en) Improvements in or relating to the manufacture of conductor plates
GB1101299A (en) Method of manufacturing an electric circuit unit
DE59805020D1 (de) Verfahren zum metallisieren eines elektrisch nichtleitende oberflächenbereiche aufweisenden substrats
US3798060A (en) Methods for fabricating ceramic circuit boards with conductive through holes
ES8700538A1 (es) Procedimiento para la obtencion de circuitos impresos
GB1001634A (en) Electronic circuit boards
EP0248683A3 (de) Verfahren und Zusammenstellung zur Elektroplattierung von Leiterplatten ohne stromlose Plattierung
ATE73179T1 (de) Verfahren zur metallisierung nichtleitender substrate.
DE69316750D1 (de) Verfahren zur herstellung einer leiterplatte.
JPS55138864A (en) Method of fabricating semiconductor assembling substrate
DE3130159C2 (de)
GB1340441A (en) Manufacture of printed circuit boards
Duva et al. Electroless Plating Process
GB1164591A (en) mprovements in Metallization of Insulating Substrates
JPS6453592A (en) Conductive substrate for transfer of conductor circuit
JP3218698B2 (ja) 銅のメタライズ方法
JPS6422095A (en) Manufacture of printed wiring board
JPS6489585A (en) Multilayer wiring board
GR880100623A (el) Επενδυσις υποστρωματων δια σχεδιασματων κυκλωματων εκ παχεως μεταλλου
JPS6417450A (en) Formation of bump
Zsamboky Method of Metallizing Ceramic Substrates
JPH02260599A (ja) 多層基板の製造法

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970401