ES440185A1 - Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES440185A1
ES440185A1 ES440185A ES440185A ES440185A1 ES 440185 A1 ES440185 A1 ES 440185A1 ES 440185 A ES440185 A ES 440185A ES 440185 A ES440185 A ES 440185A ES 440185 A1 ES440185 A1 ES 440185A1
Authority
ES
Spain
Prior art keywords
semiconductor device
cable member
brazing alloy
percent
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES440185A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Arris Technology Inc
General Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arris Technology Inc, General Instrument Corp filed Critical Arris Technology Inc
Priority to ES440185A priority Critical patent/ES440185A1/en
Publication of ES440185A1 publication Critical patent/ES440185A1/en
Expired legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)

Abstract

Procedure for fixing a cable member in a semiconductor device, characterized by the steps of: A) providing a cable member formed virtually of a thermally conductive and electrically conductive metal and ending at one end in a joining surface; and a semiconductor device consisting of a semiconductor body and a contact member formed of a refractory metal that extends outwardly from the body and terminates at a joint surface separated from the body; b) placing the bonding surfaces of the members in contact with the brazing alloy consisting of a weight basis of about 80 to 89 percent copper, about 5 to 15 percent silver, and about 4 percent 6 percent phosphorus; c) heating the brazing alloy at least up to its wetting temperature for a period of time sufficient to melt the brazing alloy; and d) allowing the molten brazing alloy to cool and solidify in contact with the joining surfaces of the members, in order to thereby join the contact member and the cable member in a unitary structure. (Machine-translation by Google Translate, not legally binding)
ES440185A 1975-08-12 1975-08-12 Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding) Expired ES440185A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES440185A ES440185A1 (en) 1975-08-12 1975-08-12 Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES440185A ES440185A1 (en) 1975-08-12 1975-08-12 Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)

Publications (1)

Publication Number Publication Date
ES440185A1 true ES440185A1 (en) 1977-03-01

Family

ID=8469855

Family Applications (1)

Application Number Title Priority Date Filing Date
ES440185A Expired ES440185A1 (en) 1975-08-12 1975-08-12 Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)

Country Status (1)

Country Link
ES (1) ES440185A1 (en)

Similar Documents

Publication Publication Date Title
GB1089878A (en) Method of connecting electrical devices to printed wiring
EP0055383A3 (en) Base material for firing in order to prepare an intermediate layer between a high melting dental alloy and a tooth porcelain
US3470611A (en) Semiconductor device assembly method
ES474830A1 (en) Tinned copper braid for solder removing and method of manufacturing the same.
FR2321193B1 (en)
JPS5464049A (en) Bonding of metals or alloys
ZA852547B (en) Process and apparatus for thermally bonding metal surfaces
JPS54124678A (en) Lead frame
ES440185A1 (en) Procedure for fixing a cable member in a semiconductor device. (Machine-translation by Google Translate, not legally binding)
GB1033412A (en) Brazing platinum and alloys thereof
JPS54155158A (en) Manufacture of metallic composite rod
US3055099A (en) Method of contacting semi-conductor devices
JPS6437077A (en) Reflow soldering
MX3349E (en) IMPROVEMENTS IN PROCESS FOR THE ELABORATION OF A WELDED LEAD ELECTRODE AND RESULTING PRODUCT
JPS579698B2 (en)
JPS6023998Y2 (en) Heating crimp
FR2114283A5 (en) Multi metal joints - formed by casting one metal onto another to produce complex joints for electrical conductors
GB846808A (en) Improvements in or relating to brazing processes
GB1170828A (en) Diffusion-Soldering Process
JPS6417349A (en) Temperature fuse mechanism
SU118120A1 (en) Heat resistant cadmium solder
SU118460A1 (en) Heat resistant solder
JPS57192057A (en) Semiconductor device
JPS5526651A (en) Bonding method of semiconductor substrate
JPS54146251A (en) Formed brazing filler metal