ES2114319T3 - Dispositivo para el tratamiento de placas de circuitos impresos. - Google Patents

Dispositivo para el tratamiento de placas de circuitos impresos.

Info

Publication number
ES2114319T3
ES2114319T3 ES95919443T ES95919443T ES2114319T3 ES 2114319 T3 ES2114319 T3 ES 2114319T3 ES 95919443 T ES95919443 T ES 95919443T ES 95919443 T ES95919443 T ES 95919443T ES 2114319 T3 ES2114319 T3 ES 2114319T3
Authority
ES
Spain
Prior art keywords
treatment
printed circuit
adjacent
plates
general
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95919443T
Other languages
English (en)
Inventor
Marcel Heermann
Daniel Hosten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SIEMENS SA
Original Assignee
SIEMENS SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SIEMENS SA filed Critical SIEMENS SA
Application granted granted Critical
Publication of ES2114319T3 publication Critical patent/ES2114319T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

LAS PLACAS CON CIRCUITO IMPRESO (LP) SE LLEVAN EN POSICION VERTICAL SOBRE AL MENOS DOS VIAS DE TRANSPORTE QUE CORREN PARALELAS (TW1 A TW4) A TRAVES DE BAÑOS DE TRATAMIENTO (BB1 A BB3), QUE ESTAN COLOCADOS EN CELULAS DE TRATAMIENTO SUCESIVAS Y ADYACENTES (BZ10 A BZ13, BZ20 A BZ23, BZ30 A BZ33). LAS PAREDES FRONTALES DE LAS CELULAS DE TRATAMIENTO LLEVAN RANURAS VERTICALES (S) Y JUNTAS (D) PARA PERMITIR QUE PASEN LAS PLACAS CON CIRCUITO IMPRESO. EL FLUIDO DEL BAÑO DE LAS CELULAS ADYACENTES DE TRATAMIENTO SE RECOGEN EN BANDEJAS GENERALES (AW1 A AW3) Y SE RECICLAN A LAS CELULAS DE TRATAMIENTO CON AYUDA DE BOMBAS (P). TAMBIEN SE PUEDE TENER UNA BANDEJA GENERAL CON UNA CELULA GENERAL DE TRATAMIENTO CON ZONAS DE TRATAMIENTO QUE ESTAN ADYACENTES. EL TRANSPORTE DE LAS PLACAS CON CIRCUITO IMPRESO SOBRE LAS VIAS DE TRANSPORTE ADYACENTES SE REALIZA PREFERENTEMENTE CON UN DISPOSITIVO CONJUNTO DE TRANSPORTE. MEDIANTE EL TRATAMIENTO EN DOS O EN VARIAS VIAS SE OBTIENE DE MANERA ECONOMICA UNA DUPLICACION O MULTIPLICACION DE LA PRODUCCION DEL MODELO DE PLACA CON CIRCUITO IMPRESO.
ES95919443T 1994-05-11 1995-05-11 Dispositivo para el tratamiento de placas de circuitos impresos. Expired - Lifetime ES2114319T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4416710 1994-05-11

Publications (1)

Publication Number Publication Date
ES2114319T3 true ES2114319T3 (es) 1998-05-16

Family

ID=6517922

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95919443T Expired - Lifetime ES2114319T3 (es) 1994-05-11 1995-05-11 Dispositivo para el tratamiento de placas de circuitos impresos.

Country Status (9)

Country Link
US (1) US5833816A (es)
EP (1) EP0759100B1 (es)
JP (1) JP2749453B2 (es)
CN (1) CN1116449C (es)
DE (1) DE59501606D1 (es)
DK (1) DK0759100T3 (es)
ES (1) ES2114319T3 (es)
HK (1) HK1008434A1 (es)
WO (1) WO1995031590A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19541316C1 (de) * 1995-11-06 1997-02-20 Siemens Nv Vorrichtung zur Behandlung von bandförmigem Material
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
DE10043814C1 (de) * 2000-09-06 2002-04-11 Egon Huebel Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut
DE10154884C5 (de) * 2001-11-05 2009-11-19 Gebr. Schmid Gmbh & Co. Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten
SG116446A1 (en) * 2002-04-17 2005-11-28 Cem Machinery Pte Ltd Metal finishing treatment equipment.
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method
DE102004039632A1 (de) * 2004-08-11 2006-02-23 Atotech Deutschland Gmbh Behälter für eine galvanotechnische Vertikal-Behandlungsanlage und dessen Herstellverfahren
EP1933391A1 (de) * 2006-12-11 2008-06-18 Applied Materials, Inc. Verfahren zur Herstellung einer SiN:H-Schicht auf einem Substrat
JP5457010B2 (ja) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 連続めっき処理装置
DE102012012990B4 (de) * 2011-06-30 2014-09-04 Almex Pe Inc. Oberflächenbehandlungssystem und Werkstückhaltestütze
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 表面処理装置
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 表面処理装置
CN106319606B (zh) * 2016-07-18 2018-08-14 北京纽堡科技有限公司 矩阵式电镀生产线
CN108342756A (zh) * 2017-01-24 2018-07-31 廖智良 多层基板上水平电镀电着及无电电镀方法
JP6342538B2 (ja) * 2017-03-23 2018-06-13 アルメックスＰｅ株式会社 表面処理装置
GB2564893B (en) * 2017-07-27 2020-12-16 Semsysco Gmbh Distribution system for chemical and/or electrolytic surface treatment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4394241A (en) * 1981-06-25 1983-07-19 Napco, Inc. High speed plating of flat planar workpieces
US4372825A (en) * 1981-11-06 1983-02-08 Micro-Plate, Inc. Plating sparger and method
DE3345050A1 (de) * 1983-12-13 1985-06-20 Walter 7758 Meersburg Holzer Verfahren zum umweltfreundlichen aetzen von leiterplatten und vorrichtung zur ausuebung des arbeitsverfahrens
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
IT1256443B (it) * 1992-11-23 1995-12-05 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Also Published As

Publication number Publication date
JP2749453B2 (ja) 1998-05-13
WO1995031590A1 (de) 1995-11-23
DK0759100T3 (da) 1998-09-28
DE59501606D1 (de) 1998-04-16
US5833816A (en) 1998-11-10
HK1008434A1 (en) 1999-05-07
JPH09505639A (ja) 1997-06-03
CN1116449C (zh) 2003-07-30
EP0759100B1 (de) 1998-03-11
EP0759100A1 (de) 1997-02-26
CN1147838A (zh) 1997-04-16

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