GB2564893B - Distribution system for chemical and/or electrolytic surface treatment - Google Patents

Distribution system for chemical and/or electrolytic surface treatment Download PDF

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Publication number
GB2564893B
GB2564893B GB1712064.3A GB201712064A GB2564893B GB 2564893 B GB2564893 B GB 2564893B GB 201712064 A GB201712064 A GB 201712064A GB 2564893 B GB2564893 B GB 2564893B
Authority
GB
United Kingdom
Prior art keywords
chemical
surface treatment
distribution system
electrolytic surface
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1712064.3A
Other versions
GB201712064D0 (en
GB2564893A (en
Inventor
Ötzlinger Herbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semsysco GmbH
Original Assignee
Semsysco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semsysco GmbH filed Critical Semsysco GmbH
Priority to GB1712064.3A priority Critical patent/GB2564893B/en
Publication of GB201712064D0 publication Critical patent/GB201712064D0/en
Priority to JP2018139053A priority patent/JP6539390B2/en
Priority to TW111115385A priority patent/TWI800356B/en
Priority to TW107125883A priority patent/TWI759514B/en
Priority to CN201810845817.7A priority patent/CN109306474A/en
Publication of GB2564893A publication Critical patent/GB2564893A/en
Priority to JP2019105194A priority patent/JP7161445B2/en
Application granted granted Critical
Publication of GB2564893B publication Critical patent/GB2564893B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
GB1712064.3A 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment Active GB2564893B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment
JP2018139053A JP6539390B2 (en) 2017-07-27 2018-07-25 Distribution system for surface treatment of at least one of chemistry and electrolysis
TW111115385A TWI800356B (en) 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment
TW107125883A TWI759514B (en) 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment
CN201810845817.7A CN109306474A (en) 2017-07-27 2018-07-27 For chemistry and/or the distribution system of electrolytic surface processing
JP2019105194A JP7161445B2 (en) 2017-07-27 2019-06-05 Distribution system for chemical and/or electrolytic surface treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment

Publications (3)

Publication Number Publication Date
GB201712064D0 GB201712064D0 (en) 2017-09-13
GB2564893A GB2564893A (en) 2019-01-30
GB2564893B true GB2564893B (en) 2020-12-16

Family

ID=59778879

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1712064.3A Active GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment

Country Status (4)

Country Link
JP (2) JP6539390B2 (en)
CN (1) CN109306474A (en)
GB (1) GB2564893B (en)
TW (2) TWI759514B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3825445A1 (en) * 2019-11-22 2021-05-26 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3828316B1 (en) * 2019-11-26 2023-09-13 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
US20020050458A1 (en) * 2000-06-30 2002-05-02 Masanori Matsukawa Production of gas separators for use in fuel cells and equipment used therefor
JP2006111976A (en) * 2006-01-19 2006-04-27 Ebara Udylite Kk Acid copper plating method and acid copper plating device
US20090072644A1 (en) * 2007-09-14 2009-03-19 Seoul National University Industry Foundation Thrust magnetic bearing system
CN104862767A (en) * 2015-05-29 2015-08-26 东莞市开美电路板设备有限公司 Copper plating tank

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (en) * 1983-05-11 1984-11-26 Hitachi Ltd Plating method of noble metal
JPS6393897A (en) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd Plating liquid injection type plating device
WO2002079548A1 (en) * 2001-03-28 2002-10-10 Fujitsu Limited Electrolytic plating tank
KR20100052577A (en) * 2002-07-18 2010-05-19 가부시키가이샤 에바라 세이사꾸쇼 Plating apparatus
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly
CN101369533B (en) * 2003-03-11 2010-06-02 株式会社荏原制作所 Plating apparatus
JP4624738B2 (en) * 2003-08-21 2011-02-02 株式会社荏原製作所 Plating equipment
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (en) * 2015-01-30 2016-08-15 Acrom S A Ecological procedure for continuous chrome plating of bars and relative equipment.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
US20020050458A1 (en) * 2000-06-30 2002-05-02 Masanori Matsukawa Production of gas separators for use in fuel cells and equipment used therefor
JP2006111976A (en) * 2006-01-19 2006-04-27 Ebara Udylite Kk Acid copper plating method and acid copper plating device
US20090072644A1 (en) * 2007-09-14 2009-03-19 Seoul National University Industry Foundation Thrust magnetic bearing system
CN104862767A (en) * 2015-05-29 2015-08-26 东莞市开美电路板设备有限公司 Copper plating tank

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPS6393897 A (UEMURA KOGYO KK) Figures 1 and 2, abstract WPI AN: JP-23682586-A *

Also Published As

Publication number Publication date
GB201712064D0 (en) 2017-09-13
TW202230507A (en) 2022-08-01
JP7161445B2 (en) 2022-10-26
JP2019049046A (en) 2019-03-28
TWI800356B (en) 2023-04-21
CN109306474A (en) 2019-02-05
GB2564893A (en) 2019-01-30
TW201911408A (en) 2019-03-16
JP2019167628A (en) 2019-10-03
JP6539390B2 (en) 2019-07-03
TWI759514B (en) 2022-04-01

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