ES2082432T3 - Procedimiento y dispositivo para el recubrimiento a ambos lados de articulos en forma de placa. - Google Patents

Procedimiento y dispositivo para el recubrimiento a ambos lados de articulos en forma de placa.

Info

Publication number
ES2082432T3
ES2082432T3 ES92810731T ES92810731T ES2082432T3 ES 2082432 T3 ES2082432 T3 ES 2082432T3 ES 92810731 T ES92810731 T ES 92810731T ES 92810731 T ES92810731 T ES 92810731T ES 2082432 T3 ES2082432 T3 ES 2082432T3
Authority
ES
Spain
Prior art keywords
circuit boards
coating
airing
station
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92810731T
Other languages
English (en)
Inventor
Kaspar Kuster
Anton Ruegge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2082432T3 publication Critical patent/ES2082432T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

SE DESCRIBE UN PROCEDIMIENTO Y UN DISPOSITIVO PARA EL RECUBRIMIENTO DE AMBOS LATERALES DE PIEZAS (2) DE MATERIAL EN FORMA DE PLACAS, PARTICULARMENTE PLACAS CONDUCTORAS, EN DONDE LAS PLACAS (2) CONDUCTORAS SE TRANSPORTAN A UNA INSTALACION (1) DE RECUBRIMIENTO A TRAVES DE VARIAS ETAPAS DE RECUBRIMIENTO SUCESIVAS. EN UNA PRIMERA ESTACION (4) DE RECUBRIMIENTO SE RECUBRE EN HUMEDO PRIMERAMENTE UN PRIMER LATERAL DE LA PLACA (2) CONDUCTORA CON UN MATERIAL SINTETICO ENDURECIBLE POR UV, LACA O SIMILARES. DESPUES DEL RECUBRIMIENTO DEL PRIMER LATERAL LAS PLACAS (2) CONDUCTORAS SE VENTILA Y SE SECA EN UNA PRIMERA ESTACION (5) DE AIREACION Y DE SECADO. LAS PLACAS CONDUCTORAS SE GIRAN Y EN UNA SEGUNDA ESTACION (6) DE RECUBRIMIENTO SE RECUBRE EN HUMEDO EL SEGUNDO LATERAL CON MATERIAL SINTETICO ENDURECIBLE POR UV, LACA O SIMILARES. LAS PLACAS (2) CONDUCTORAS RECUBIERTA EN AMBOS LATERALES SE CUBREN Y SE SECAN EN UNA SEGUNDA ESTACION (7) DE AIREACION Y DE SECADO Y FINALMENTE PARA LA POSTERIOR ELABORACION ENLA INSTALACION DE RECUBRIMIENTO SE SUMINISTRA A OTRO DISPOSITIVO DE ELABORACION. EL RECUBRIMIENTO DE CAPAS SE TRANSPORTA LAS PLACAS 82) CONDUCTORAS EN DIRECCIONES (X, Y) OPUESTAS A TRAVES DE AMBAS ESTACIONES (4, 6) DE RECUBRIMIENTO, QUE SE DISPONEN JUNTOS EN DOS LINEAS (A, B) DE APARATO CIRCULANDO PARALELAS ENTRE SI. EL GIRO DE LA PLACA CONDUCTORA SE EFECTUA EN LA PRIMERA ESTACION (5) DE VENTILACION Y SECADO. SE TRASPONE TAMBIEN LA PRIMERA (A) LINEA DEL APARATO EN LA SEGUNDA LINEA (B). LA PRIMERA ESTACION (5) DE AIREACION Y SECADO SE DISPONE ENTRE LA PRIMERA (4) Y SEGUNDA (6) ESTACION DE RECUBRIMIENTO YA QUE SE EXTIENDE LONGITUDINALMENTE DE FORMA TRANSVERSAL A LA DIRECCION (X, Y) DE LA PLACA CONDUCTORA (2) DE LAS ESTACIONES (4, 6) DE RECUBRIMIENTO. SOPORTE FIJADOR (11) PARA LAS PLACAS (2) CONDUCTORAS QUE SE FIJAN EN RAMALES (17) GUIADAS AGUAS ARRIBA DE UNAS LINEAS (16) DE TRANSPORTE, PREFERENTEMENTE UNAS CADENAS DE TRANSPORTE QUE SE EXTIENDEN TRANSVERSALMENTE A LA PRIMERA (A) LINEA DEL APARATO MIENTRAS LOS SOPORTES (11) QUE SE FIJAN EN RAMALES (18) AGUAS ABAJO DE LAS LINEAS DE TRANSPORTE CIRCULAN TRANSVERSALMENTE A LAS SEGUNDAS LINEAS (B) DEL APARATO.
ES92810731T 1992-09-28 1992-09-28 Procedimiento y dispositivo para el recubrimiento a ambos lados de articulos en forma de placa. Expired - Lifetime ES2082432T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92810731A EP0592745B1 (de) 1992-09-28 1992-09-28 Verfahren und Vorrichtung zur beidseitigen Beschichtung von plattenförmigem Stückgut

Publications (1)

Publication Number Publication Date
ES2082432T3 true ES2082432T3 (es) 1996-03-16

Family

ID=8211995

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92810731T Expired - Lifetime ES2082432T3 (es) 1992-09-28 1992-09-28 Procedimiento y dispositivo para el recubrimiento a ambos lados de articulos en forma de placa.

Country Status (8)

Country Link
US (1) US5637148A (es)
EP (1) EP0592745B1 (es)
JP (1) JPH06198244A (es)
KR (1) KR100275233B1 (es)
AT (1) ATE133531T1 (es)
DE (1) DE59205188D1 (es)
ES (1) ES2082432T3 (es)
HK (1) HK1005202A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI105315B (fi) * 1996-05-06 2000-07-14 Pmj Automec Oyj Laite piirilevyjen tai sen tapaisten levyjen valmistusvaiheiden automaattiseksi suorittamiseksi
DE29703356U1 (de) * 1997-02-25 1997-11-27 P.A.C. Circuiti Stampati S.R.L., Angiari Auftragsvorrichtung
TW416261B (en) * 1997-04-24 2000-12-21 Ciba Sc Holding Ag Process and apparatus for the treatment of coated printed circuit boards
IT1310555B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronici
US6073748A (en) * 1999-06-23 2000-06-13 Simplimatic Engineering Company Multiple lane inverter
JP3660626B2 (ja) * 2002-01-15 2005-06-15 株式会社野田スクリーン 真空印刷装置
US20030159906A1 (en) * 2002-02-22 2003-08-28 Rinks William Aubrey Width adjustment for stackers and unstackers used with bakery product baskets and trays
ES2322420B1 (es) * 2006-10-06 2010-03-16 Jose Antonio Martin Torres Sistema de volteo y retorno semiautomatico.
KR100938818B1 (ko) * 2008-05-08 2010-01-26 아이케이 주식회사 난연성보드 제조장치 및 제조방법
US20110106293A1 (en) * 2009-10-29 2011-05-05 Steven Joseph Croghan Book processing line inversion systems and methods
US20150128856A1 (en) * 2013-11-14 2015-05-14 Illinois Tool Works Inc. Dispensing apparatus having transport system and method for transporting a substrate within the dispensing apparatus
CN105188277B (zh) * 2015-09-21 2017-12-08 迅得机械（东莞）有限公司 一种板件自动翻转插框装置
CN106696475B (zh) * 2015-11-13 2019-06-18 富泰华工业（深圳）有限公司 打印机及利用打印机打印电路板的方法
KR20170056986A (ko) * 2015-11-16 2017-05-24 (주)쎄미시스코 연기 제거 광 소결장치
CN108557428A (zh) * 2018-05-22 2018-09-21 麦格纳电子（张家港）有限公司 电路板双面涂覆用的翻板装置
CN108882532B (zh) * 2018-07-25 2021-03-05 于浩 一种电路板加工用旋转装置
US11732360B2 (en) * 2019-02-28 2023-08-22 Toshiba Mitsubishi-Electric Industrial Systems Corporation Film forming apparatus
CN113414051B (zh) * 2021-04-11 2023-01-24 太原科技大学 棒材端部刷漆机器人
CN114585164B (zh) * 2022-02-15 2024-05-24 深圳市华尔博思科技有限公司 一种用于手机集成主板的加工设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2005492A (en) * 1930-07-24 1935-06-18 Us Envelope Co Apparatus for conveying envelope blanks
US3112723A (en) * 1961-05-15 1963-12-03 Admiral Corp Automatic fluxing machine
JPS5226793B2 (es) * 1974-04-30 1977-07-15
JPS5833697B2 (ja) * 1979-12-17 1983-07-21 ヱム・セテツク株式会社 フオトレジストの両面塗布装置
US4559896A (en) * 1983-09-15 1985-12-24 Ciba Geigy Corporation Coating apparatus
DE3602350C2 (de) * 1986-01-27 1994-08-18 Weber Marianne Verfahren und Anlage zum beidseitigen Beschichten von Platten mit flüssigem Beschichtungsmaterial
CH670243A5 (es) * 1986-07-08 1989-05-31 Ciba Geigy Ag
US4754869A (en) * 1987-05-22 1988-07-05 Hutchison Donald S Down flow distributor
US4926789A (en) * 1987-10-13 1990-05-22 Ciba-Geigy Corporation Transport apparatus for boards
US5009306A (en) * 1989-06-19 1991-04-23 Simplimatic Engineering Company Printed circuit board conveyor and method
EP0421931A1 (de) * 1989-10-06 1991-04-10 Ciba-Geigy Ag Transportvorrichtung für Platten, insbesondere mit empfindlicher Oberfläche
EP0441743A1 (de) * 1990-02-05 1991-08-14 Ciba-Geigy Ag Transportvorrichtung für Platten mit empfindlicher Oberfläche, insbesondere für nassbeschichtete Leiterplatten
JPH0794067B2 (ja) * 1990-10-08 1995-10-11 権士 近藤 プリント基板の保持搬送方法およびその装置
DE4107224C1 (es) * 1991-03-07 1992-06-04 Dupont De Nemours Gmbh, 6380 Bad Homburg, De
EP0542684B1 (de) * 1991-11-13 1997-04-09 Ciba-Geigy Ag Beschichtungsvorrichtung für Platten
ES2074691T3 (es) * 1991-11-14 1995-09-16 Ciba Geigy Ag Secador continuo para materiales consistentes en piezas de forma plana.
TW220028B (en) * 1992-08-24 1994-02-01 Ciba Geigy Ag Method and apparatus for coating board-shaped articles, especially printed circuit boards

Also Published As

Publication number Publication date
DE59205188D1 (de) 1996-03-07
ATE133531T1 (de) 1996-02-15
US5637148A (en) 1997-06-10
JPH06198244A (ja) 1994-07-19
HK1005202A1 (en) 1998-12-24
EP0592745B1 (de) 1996-01-24
KR940008542A (ko) 1994-04-29
KR100275233B1 (ko) 2001-01-15
EP0592745A1 (de) 1994-04-20

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