ES2079445T3 - Procedimiento para la formacion de una pelicula con deposito de metal, conteniendo aluminio como componente principal, utilizando hidruro de alquil aluminio. - Google Patents

Procedimiento para la formacion de una pelicula con deposito de metal, conteniendo aluminio como componente principal, utilizando hidruro de alquil aluminio.

Info

Publication number
ES2079445T3
ES2079445T3 ES90309832T ES90309832T ES2079445T3 ES 2079445 T3 ES2079445 T3 ES 2079445T3 ES 90309832 T ES90309832 T ES 90309832T ES 90309832 T ES90309832 T ES 90309832T ES 2079445 T3 ES2079445 T3 ES 2079445T3
Authority
ES
Spain
Prior art keywords
film
procedure
formation
main component
metal deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90309832T
Other languages
English (en)
Inventor
Nobuo Mikoshiba
Kazuo Tsubouchi
Kazuya Masu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1233927A external-priority patent/JP2781220B2/ja
Priority claimed from JP1233925A external-priority patent/JP2781219B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of ES2079445T3 publication Critical patent/ES2079445T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C23C16/20—Deposition of aluminium only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PROCESO PARA LA FORMACION DE UNA PELICULA DE AL QUE CONTENGA SI DE GRAN CALIDAD SEGUN EL METODO CVD QUE UTILIZA UN HIBRIDO DE ALUMINIO DE ALQUILO Y UN GAS QUE CONTENGA SILICIO E HIDROGENO. SE TRATA DE UN EXCELENTE PROCESO PARA LA FORMACION DE PELICULAS CON DEPOSITOS QUE TAMBIEN ADMITE LA DEPOSICION SELECTIVA DEL AL QUE CONTENGA SI.
ES90309832T 1989-09-09 1990-09-07 Procedimiento para la formacion de una pelicula con deposito de metal, conteniendo aluminio como componente principal, utilizando hidruro de alquil aluminio. Expired - Lifetime ES2079445T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1233927A JP2781220B2 (ja) 1989-09-09 1989-09-09 堆積膜形成法
JP1233925A JP2781219B2 (ja) 1989-09-09 1989-09-09 堆積膜形成法

Publications (1)

Publication Number Publication Date
ES2079445T3 true ES2079445T3 (es) 1996-01-16

Family

ID=26531261

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90309832T Expired - Lifetime ES2079445T3 (es) 1989-09-09 1990-09-07 Procedimiento para la formacion de una pelicula con deposito de metal, conteniendo aluminio como componente principal, utilizando hidruro de alquil aluminio.

Country Status (10)

Country Link
EP (1) EP0417997B1 (es)
KR (1) KR940011006B1 (es)
AT (1) ATE130636T1 (es)
DE (1) DE69023724T2 (es)
DK (1) DK0417997T3 (es)
ES (1) ES2079445T3 (es)
GR (1) GR3018958T3 (es)
MY (1) MY107426A (es)
PT (1) PT95233B (es)
SG (1) SG43271A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0498580A1 (en) * 1991-02-04 1992-08-12 Canon Kabushiki Kaisha Method for depositing a metal film containing aluminium by use of alkylaluminium halide
GB2320129B (en) * 1996-06-24 2001-09-26 United Microelectronics Corp Method of fabricating an aluminium plug for contact with a semiconductor device

Also Published As

Publication number Publication date
EP0417997A1 (en) 1991-03-20
KR940011006B1 (ko) 1994-11-22
PT95233A (pt) 1991-05-22
KR910007076A (ko) 1991-04-30
DE69023724T2 (de) 1996-05-09
ATE130636T1 (de) 1995-12-15
DK0417997T3 (da) 1995-12-27
DE69023724D1 (de) 1996-01-04
EP0417997B1 (en) 1995-11-22
GR3018958T3 (en) 1996-05-31
MY107426A (en) 1995-12-30
SG43271A1 (en) 1997-10-17
PT95233B (pt) 1998-06-30

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