ES2057886T3 - Procedimiento para la fabricacion de un sensor para determinar fuerzas de presion. - Google Patents

Procedimiento para la fabricacion de un sensor para determinar fuerzas de presion.

Info

Publication number
ES2057886T3
ES2057886T3 ES91907858T ES91907858T ES2057886T3 ES 2057886 T3 ES2057886 T3 ES 2057886T3 ES 91907858 T ES91907858 T ES 91907858T ES 91907858 T ES91907858 T ES 91907858T ES 2057886 T3 ES2057886 T3 ES 2057886T3
Authority
ES
Spain
Prior art keywords
manufacture
pressure forces
procedure
sensor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91907858T
Other languages
English (en)
Inventor
Werner Grunwald
Kurt Schmid
Martin Mast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19904014511 external-priority patent/DE4014511A1/de
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of ES2057886T3 publication Critical patent/ES2057886T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

SE PROPONE UN METODO Y UN DISPOSITIVO PARA LA FABRICACION DE SENSORESPREVISTOS EN PARTICULAR PARA LA DETERMINACION DE FUERZAS DE PRESION. EN LA TECNICA DE CAPA GRUESA SE APLICA PRIMERAMENTE POR LO MENOS SOBRE UNA PLACA SOPORTE (10) UNA CAPA AISLANTE (14), SOBRE ELLA UNA CAPA RESISTIVA SENSIBLE A LA PRESION (12) Y FINALMENTE PISTAS CONDUCTORAS (13). EL CONJUNTO DE LA CAPA (1114) SE COMPRIME A CONTINUACION JUNTO CON UNA MASA DE MOLDEO DE PLASTICO (15) EN UNA ESTAMPA DE COMPRESION (20-22). A CONTINUACION SE RETIRA LA PLACA SOPORTE (10) DE LA PIEZA PRENSADA.
ES91907858T 1990-05-07 1991-04-29 Procedimiento para la fabricacion de un sensor para determinar fuerzas de presion. Expired - Lifetime ES2057886T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904014511 DE4014511A1 (de) 1989-04-14 1990-05-07 Verfahren und vorrichtung zum herstellen eines sensors zum bestimmen von druckkraeften

Publications (1)

Publication Number Publication Date
ES2057886T3 true ES2057886T3 (es) 1994-10-16

Family

ID=6405814

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91907858T Expired - Lifetime ES2057886T3 (es) 1990-05-07 1991-04-29 Procedimiento para la fabricacion de un sensor para determinar fuerzas de presion.

Country Status (6)

Country Link
US (1) US5349746A (es)
EP (1) EP0527775B1 (es)
JP (1) JPH05506717A (es)
DE (1) DE59102443D1 (es)
ES (1) ES2057886T3 (es)
WO (1) WO1991017415A1 (es)

Families Citing this family (28)

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JP2584201B2 (ja) * 1994-01-14 1997-02-26 インターナショナル・ビジネス・マシーンズ・コーポレイション 力変換器、コンピュータ・システムおよびキーボード
US6184865B1 (en) 1996-10-23 2001-02-06 International Business Machines Corporation Capacitive pointing stick apparatus for symbol manipulation in a graphical user interface
DE19753800C2 (de) * 1997-12-04 1999-12-30 Mannesmann Vdo Ag Verfahren zur Herstellung eines elektrischen Widerstandes sowie eines mechanisch-elektrischen Wandlers
DE19814261A1 (de) * 1998-03-31 1999-10-14 Mannesmann Vdo Ag Dehnungsempfindlicher Widerstand
DE10252023B3 (de) * 2002-11-06 2004-07-15 Metallux Gmbh Drucksensor
DE10320090A1 (de) * 2003-05-05 2004-08-26 Infineon Technologies Ag Elektrisches Bauteil mit Leitungen aus karbonisiertem Kunststoff, sowie Verfahren und Vorrichtung zu seiner Herstellung
US20060185446A1 (en) * 2005-02-18 2006-08-24 Speckhart Frank H Printed strain gage for vehicle seats
US7360438B2 (en) * 2006-02-08 2008-04-22 Honeywell International Inc. Advanced thick film load cell
WO2013192539A1 (en) 2012-06-21 2013-12-27 Nextinput, Inc. Wafer level mems force dies
WO2014008377A1 (en) 2012-07-05 2014-01-09 Ian Campbell Microelectromechanical load sensor and methods of manufacturing the same
WO2015106246A1 (en) 2014-01-13 2015-07-16 Nextinput, Inc. Miniaturized and ruggedized wafer level mems force sensors
EP3307671B1 (en) 2015-06-10 2022-06-15 Nextinput, Inc. Ruggedized wafer level mems force sensor with a tolerance trench
WO2018148510A1 (en) 2017-02-09 2018-08-16 Nextinput, Inc. Integrated piezoresistive and piezoelectric fusion force sensor
CN110494724B (zh) 2017-02-09 2023-08-01 触控解决方案股份有限公司 集成数字力传感器和相关制造方法
WO2019018641A1 (en) 2017-07-19 2019-01-24 Nextinput, Inc. STACK OF STRAIN TRANSFER IN A MEMS FORCE SENSOR
WO2019023309A1 (en) 2017-07-25 2019-01-31 Nextinput, Inc. FORCE SENSOR AND INTEGRATED FINGERPRINTS
WO2019023552A1 (en) 2017-07-27 2019-01-31 Nextinput, Inc. PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME
JP6793103B2 (ja) 2017-09-29 2020-12-02 ミネベアミツミ株式会社 ひずみゲージ
JP2019066453A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ
JP2019066312A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ
JP2019066454A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ、センサモジュール
WO2019079420A1 (en) 2017-10-17 2019-04-25 Nextinput, Inc. SHIFT TEMPERATURE COEFFICIENT COMPENSATION FOR FORCE SENSOR AND STRAIN GAUGE
US11385108B2 (en) 2017-11-02 2022-07-12 Nextinput, Inc. Sealed force sensor with etch stop layer
US11874185B2 (en) 2017-11-16 2024-01-16 Nextinput, Inc. Force attenuator for force sensor
JP2019113411A (ja) * 2017-12-22 2019-07-11 ミネベアミツミ株式会社 ひずみゲージ、センサモジュール
JP2019184344A (ja) 2018-04-05 2019-10-24 ミネベアミツミ株式会社 ひずみゲージ及びその製造方法
EP3855148A4 (en) 2018-10-23 2022-10-26 Minebea Mitsumi Inc. ACCELERATOR PEDAL, STEERING GEAR, 6-AXIS SENSOR, ENGINE, BUMPER AND THE LIKE
US10962427B2 (en) 2019-01-10 2021-03-30 Nextinput, Inc. Slotted MEMS force sensor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3298863A (en) * 1964-05-08 1967-01-17 Joseph H Mccusker Method for fabricating thin film transistors
US3626256A (en) * 1970-10-16 1971-12-07 Transidyne Gen Corp Thin film semiconductor strain gauges and method for making same
US5070596A (en) * 1988-05-18 1991-12-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
DE3912280A1 (de) * 1989-04-14 1990-10-18 Bosch Gmbh Robert Verfahren zum herstellen eines sensors zum bestimmen von druckkraeften

Also Published As

Publication number Publication date
US5349746A (en) 1994-09-27
EP0527775A1 (de) 1993-02-24
EP0527775B1 (de) 1994-08-03
DE59102443D1 (de) 1994-09-08
WO1991017415A1 (de) 1991-11-14
JPH05506717A (ja) 1993-09-30

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