ES2004174A6 - Un objetivo de aparato de revestimiento por deposicion ctodica - Google Patents

Un objetivo de aparato de revestimiento por deposicion ctodica

Info

Publication number
ES2004174A6
ES2004174A6 ES8603636A ES8603636A ES2004174A6 ES 2004174 A6 ES2004174 A6 ES 2004174A6 ES 8603636 A ES8603636 A ES 8603636A ES 8603636 A ES8603636 A ES 8603636A ES 2004174 A6 ES2004174 A6 ES 2004174A6
Authority
ES
Spain
Prior art keywords
cathode
gap
ground shield
target
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8603636A
Other languages
English (en)
Inventor
Albert Daniel Glasser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ES2004174A6 publication Critical patent/ES2004174A6/es
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21C—NUCLEAR REACTORS
    • G21C11/00—Shielding structurally associated with the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3441—Dark space shields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

LA INVENCION SE REFIERE A UN OBJETIVO DE APARATO DE REVESTIMIENTO POR DEPOSICION CATODICA QUE COMPRENDE UN CATODO (56) QUE TIENE UNA SUPERFICIE CON MATERIAL OBJETIVO DE DEPOSICION (58) DISPUESTO SOBRE AQUELLA, Y UNA PROTECCION DE SUELO (84) SEPARADA DEL CATODO POR UN HUECO (96) DEFINIDO ENTRE AMBOS.EL HUECO (96) ESTA COMPLETAMENTE LLENO DE UN MATERIAL QUE AISLA LA ELECTRICIDAD (102) QUE IMPIDE LA FORMACION DE ARCO A TRAVES DEL HUECO, INCLUSO EN CONDICIONES DE ALTA HUMEDAD RELATIVA. ADEMAS, TIRAS (90) MONTADAS SOBRE UNA PORCION DE BORDE (66) DE LA SUPERFICIE DE CATODO QUE TIENE EL MATERIAL OBJETIVO DE REVESTIMIENTO POR DEPOSICION CATODICA DISPUESTO SOBRE ELLA FORMAN UN REBORDE PERIFERICO CONTINUO (94) QUE SOBRESALE SOBRE LA ENTRADA AL HUECO (96) Y EL BORDE ADYACENTE (86) DE LA PROTECCION DE SUELO DE MANERA QUE IMPIDA QUE ESCAMAS SUELTAS DE MATERIAL OBJETIVO DE REVESTIMIENTO POR DEPOSICION CATODICA FORME PUENTE SOBRE EL HUECO Y PRODUZCA UN CORTOCIRCUITO ENTRE EL CATODO Y LA PROTECCION DE SUELO.
ES8603636A 1986-05-01 1986-12-30 Un objetivo de aparato de revestimiento por deposicion ctodica Expired ES2004174A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/858,325 US4661233A (en) 1985-07-05 1986-05-01 Cathode/ground shield arrangement in a sputter coating apparatus

Publications (1)

Publication Number Publication Date
ES2004174A6 true ES2004174A6 (es) 1988-12-16

Family

ID=25328045

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8603636A Expired ES2004174A6 (es) 1986-05-01 1986-12-30 Un objetivo de aparato de revestimiento por deposicion ctodica

Country Status (7)

Country Link
US (1) US4661233A (es)
EP (1) EP0243556B1 (es)
JP (1) JPS62260057A (es)
KR (1) KR940006206B1 (es)
CN (1) CN86107820A (es)
DE (1) DE3688556T2 (es)
ES (1) ES2004174A6 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802968A (en) * 1988-01-29 1989-02-07 International Business Machines Corporation RF plasma processing apparatus
US5280510A (en) * 1992-09-25 1994-01-18 Combuation Engineering, Inc. Microparticle coating on inside of fuel rods and other fuel assembly components
WO1998031845A1 (en) 1997-01-16 1998-07-23 Bottomfield, Layne, F. Vapor deposition components and corresponding methods
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US20070245553A1 (en) * 1999-05-27 2007-10-25 Chong Fu C Fine pitch microfabricated spring contact structure & method
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
DE10045544C2 (de) * 2000-09-07 2002-09-12 Siemens Ag Verfahren zum Aufbringen einer Beschichtung auf eine Lampe
US7153399B2 (en) * 2001-08-24 2006-12-26 Nanonexus, Inc. Method and apparatus for producing uniform isotropic stresses in a sputtered film
SE527180C2 (sv) 2003-08-12 2006-01-17 Sandvik Intellectual Property Rakel- eller schaberblad med nötningsbeständigt skikt samt metod för tillverkning därav
US20060172065A1 (en) * 2005-02-01 2006-08-03 Carlotto John A Vacuum deposition of coating materials on powders
US20090194414A1 (en) * 2008-01-31 2009-08-06 Nolander Ira G Modified sputtering target and deposition components, methods of production and uses thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562140A (en) * 1967-10-23 1971-02-09 Eversharp Inc Sequential sputtering apparatus
US3635811A (en) * 1967-11-06 1972-01-18 Warner Lambert Co Method of applying a coating
US4080281A (en) * 1976-04-09 1978-03-21 Tsunehiko Endo Apparatus for making metal films
US4303489A (en) * 1978-08-21 1981-12-01 Vac-Tec Systems, Inc. Method and apparatus for producing a variable intensity pattern of sputtering material on a substrate
US4312731A (en) * 1979-04-24 1982-01-26 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device and method
US4391697A (en) * 1982-08-16 1983-07-05 Vac-Tec Systems, Inc. High rate magnetron sputtering of high permeability materials
US4520757A (en) * 1982-10-27 1985-06-04 Energy Conversion Devices, Inc. Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus
JPS6092472A (ja) * 1983-10-24 1985-05-24 Ulvac Corp 広帯域スパツタ圧力用タ−ゲツト電極
JPS60135571A (ja) * 1983-12-21 1985-07-18 Shimadzu Corp スパツタリングにおけるタ−ゲツト取付方法
DE3404880A1 (de) * 1984-02-11 1985-08-14 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden Verfahren zum herstellen von schichtwerkstoff oder schichtwerkstuecken
US4560462A (en) * 1984-06-22 1985-12-24 Westinghouse Electric Corp. Apparatus for coating nuclear fuel pellets with a burnable absorber
DE3580953D1 (de) * 1984-08-31 1991-01-31 Anelva Corp Entladungsvorrichtung.
US4524052A (en) * 1984-12-24 1985-06-18 The Firestone Tire & Rubber Company Borate chloride polymerization catalysts
US4610775A (en) * 1985-07-26 1986-09-09 Westinghouse Electric Corp. Method and apparatus for clearing short-circuited, high-voltage cathodes in a sputtering chamber

Also Published As

Publication number Publication date
EP0243556A1 (en) 1987-11-04
CN86107820A (zh) 1987-11-11
DE3688556T2 (de) 1993-09-16
DE3688556D1 (de) 1993-07-15
KR870011625A (ko) 1987-12-24
KR940006206B1 (ko) 1994-07-11
JPS62260057A (ja) 1987-11-12
EP0243556B1 (en) 1993-06-09
US4661233A (en) 1987-04-28

Similar Documents

Publication Publication Date Title
ES2004174A6 (es) Un objetivo de aparato de revestimiento por deposicion ctodica
US5334298A (en) Sputtering cathode
EP0090539A3 (en) Shielded connector
TW324843B (en) Compound electrode stack capacitor
JPS6486594A (en) Electromagnetic shielding component electromagnetic shielding apparatus and method of assembling electromagnetic shielding apparatus
GB1465745A (en) Sputtering apparatus
EP0182560A3 (en) Semi-transferred arc in a liquid stabilized plasma generator and method for utilizing the same
MY100406A (en) Lightning conductor
AU529960B2 (en) Material for electrical contacts
ES2002466A6 (es) Un objetivo de aparato de recubrimeinto por deposicion catodica
ATE100240T1 (de) Zerstaeubungskatode nach dem magnetronprinzip.
DE3168063D1 (en) Self blast electrical circuit breaker with rotating arc
GB2021642B (en) Electrically conductive boat for vacuum evaporation of metals
JPS5632607A (en) Conductive terminal for heat resistant insulator substrate
GB1169747A (en) Improvements in or relating to Sputtering Apparatus
AU3990685A (en) Improved installation for vacuum processing of substrates
DE3170365D1 (en) Electrically conductive substrate with insulating coating and coating for same
JPS5558370A (en) Electrode for sputtering target
MD2173G2 (ro) Dispozitiv pentru efectuarea procesului continuu de depunere electrolitică
JPS56149813A (en) Elastic surface wave device
JPS5564443A (en) Miniature communication device
JPS55150255A (en) Sealing structure of mic circuit
JPS5675572A (en) Sputtering device
SU1548157A1 (ru) Устройство дл удалени липкого материала
JPS5242290A (en) Grounding system of cable

Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2006-12-30