EP3884519A1 - Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe - Google Patents
Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppeInfo
- Publication number
- EP3884519A1 EP3884519A1 EP20704425.6A EP20704425A EP3884519A1 EP 3884519 A1 EP3884519 A1 EP 3884519A1 EP 20704425 A EP20704425 A EP 20704425A EP 3884519 A1 EP3884519 A1 EP 3884519A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- electronic
- circuit board
- component
- component side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Definitions
- the invention relates to an electronic assembly and a method for cooling an electronic assembly.
- Today's frequency converters are built with standard silicon IGBT modules.
- Novel power semiconductors for example gallium nitride (GaN) with a large band gap, are mostly available as discrete components.
- GaN gallium nitride
- One of the main problems is the cooling of the switching and transmission losses.
- the switching losses are particularly high with hard switching, whereby both the switching frequency and the forward current are thermally limited depending on the switch technology.
- this new type of component is usually a discrete switch that is soldered onto a carrier material.
- These new types of power semiconductor switches are often offered as surface mounted devices (SMD) components, with the electrical connections only being made on one side.
- the current direction in these switches is horizontal instead of vertical, as is the case with conventional IGBTs.
- the new power semiconductor switches are discrete and laterally structured switches.
- These power semiconductor components are available, among other things, in SMD design and with a soldering pad on the lower and / or upper side that acts as a contact surface for the cooling surface. Although the total losses can be reduced due to the new technology, the component size is also small, which means that the area-related energy loss is still high.
- the new power semiconductor switches are operated with high switching frequencies. Although these high switching frequencies lead to higher losses, they create new advantages.
- a power section consists of at least one power semiconductor switch.
- the power semiconductor switches move closer together and changes to the system are often necessary in terms of electromagnetic compatibility.
- IGBTs insulated gate bipolar transistors
- DCB Direct Copper Bonded
- thermal paste is usually applied to the contact surface. The entire power loss is thereby dissipated to a massive heat sink, which is generally part of the entire housing.
- the semiconductors can be applied to the circuit board as an SMD component.
- the voltage gaps between the electrical potentials are selected to be as small as possible in order to be able to implement a compact assembly. Ideally, only the necessary air and creepage distances are provided.
- the surface of this circuit board can now be cooled with an air stream.
- the disadvantage of this solution is that the cooling air exposes the upper side of this circuit board to dirt particles that are deposited on the open pins of the components and lead to a short circuit when two potentials are connected. Therefore, this type of cooling leads to a reduced service life of the construction group.
- a heat sink structure of a circuit board module which comprises a circuit board on which an electronic component is mounted and an electronic device.
- a first electronic component which is mounted on a front side of the circuit board, can be cooled during operation by the resulting heat loss of the first electronic component is led to a heat sink mounted on the back of the circuit board by means of vias of the circuit board.
- US 2006/0006525 A1 discloses various systems for removing heat loss from a semiconductor module which is arranged in a computer system. Many of these systems have a semiconductor module, which is located on one side of a circuit board, and have a heat sink for dissipating the heat loss of the semiconductor module, which is located on the other side of the circuit board. One or more thermal vias extend through the circuit board in order to thermally couple the semiconductor module to the heat sink. Such systems thus improve the overall thermal budget of the semiconductor module by making it easier to dissipate its heat loss through the circuit board.
- the object of the present invention is to provide an electronic assembly and a method with which SMD power semiconductor switches in particular can be cooled without reducing the service life of the electronic assembly.
- One aspect of the invention relates to an electronic subassembly with a printed circuit board which is designed with a first and a second component side, and at least one first heat sink which is arranged on the first component side. Likewise, several electronic components are te, a majority of which are located on the second assembly side of the circuit board.
- the electronic subassembly comprises at least one first through-hole contacting the printed circuit board, with which thermal energy generated by the first electronic component is transported from the second mounting side to the first mounting side.
- the electronic assembly also includes a convection unit for generating forced convection only on the first component side, with which the thermal energy can be transported away from the circuit board of the electronic assembly, so that the electronic assembly can be cooled. Due to the forced convection generated exclusively on the first component side, the thermal energy or heat in particular can be transported away from the assembly. Since the majority of the electronic components are arranged on the second mounting side, which is not subjected to the forced convection, there can be no or only a small accumulation of dirt particles on current-carrying components. Because of the lower exposure to dirt particles, the service life of the circuit board and thus of the entire electronic assembly is usually extended, but above all the service life is not shortened.
- the few electronic components that are arranged on the first component side can be placed on the first component side so that they are at a large distance from one another.
- no conductive connections can arise between the individual electronic components due to the transported dirt particles of the forced convection and this can ensure that the service life of the electronic assembly is not reduced.
- the second component side which is ner plurality of the electronic components is formed, natural convection takes place.
- the natural convection is achieved by the natural air flow in the vicinity of the second component side. As a result, part of the thermal energy generated can in particular be transported away from the circuit board.
- the electronic assembly can be, for example, a DC / DC converter and / or a frequency converter or converter.
- the circuit board serves as a dividing line between the natural convection on the second component side and the forced convection on the first component side.
- Convection or heat flow should be understood to mean that a method and / or a mechanism is used to achieve heat transfer of energy from one place to another.
- the first component side has the first heat sink, which can emit the generated thermal energy into a space of forced convection, so that the thermal energy can be transported away by the forced convection.
- the convection unit for generating the forced convection should, if possible, be arranged in such a way that the air flow generated by the forced convection acts exclusively on the first component side without this having an effect on the second component side. This is intended in particular to ensure that the possible dirt particles occur exclusively on the first loading side, on which in particular no current-carrying components are arranged.
- the thermal energy or the heat from the circuit board of the electronic assembly can be transported away using forced convection or natural convection.
- the convection unit can be, for example, a ventilation unit or a fan, such as a fan, in particular a lamella fan, an axial fan, a radial fan, a diagonal fan, or a cross-flow fan.
- a ventilation unit or a fan such as a fan, in particular a lamella fan, an axial fan, a radial fan, a diagonal fan, or a cross-flow fan.
- the vias are used for this so that the generated thermal energy can be transmitted through the electronic components, in particular current-carrying electronic components, on the second component side to the first component side.
- the plated through hole can in particular be a copper plated through hole in the circuit board.
- the copper plated through-hole in the circuit board can be filled with solder.
- the plated-through holes can in particular be so-called vias.
- the through contacts are used to transfer the thermal energy or the heat from the second component side to the first component side.
- a heat line or heat transfer of the thermal energy generated is achieved with the first through-hole contact.
- the first via is required because the circuit board of the electronic African assembly itself conducts heat poorly.
- the electronic components can be logic circuits or power supply lines or power supply tracks or measuring components or power semiconductor switches or power switches or IGBTs or MOSFETs.
- the plurality of electronic components and the at least first heat sink are designed based on surface mounting technology.
- the electronic Components do not see any wire connections that have to be inserted through the circuit board, so that the majority of the electronic components can be arranged on the second component side of the circuit board and thereby cooling can be carried out through the forced convection on the first component side, so that the electronic components can be used not exposed to dirt particles who the.
- the electronic components and the at least first heat sink are built using SMD technology. With SMD technology, the SMD components are no longer attached with wire connections, but directly on the first and / or second component side of the circuit board using solderable connection surfaces. For this purpose, surface mounting SMT (Surface-Mount Technology) is used.
- the at least first heat sink is designed as a flat conductor track or as a metallic housing or as a metallic heat sink.
- the at least first heat sink is used.
- the first heat sink which is designed in particular as an SMD heat sink, is preferably mounted on the first component side in such a way that this is arranged on the opposite side in the heat path of the electronic components that generate the thermal energy.
- the heat sink can be designed as a flat conductor track or as a flat copper strip, which means that as little installation space as possible is required.
- the heat sink can be designed as a metallic housing, which is preferably made of copper or aluminum. Thus, thermal energy can be transported away from the circuit board by the forced convection.
- the first through-hole connection is arranged next to one another parallel to at least one second through-hole connection of the circuit board.
- several, in particular the first and second vias are arranged in parallel next to one another.
- a plurality of vias can also be arranged in parallel next to one another. The more vias are arranged in parallel to one another, the better the thermal energy can be given off from the second component side to the first component side. The better the thermal energy can be transferred from the second component side to the first component side, the more the service life of the electronic assembly can be increased.
- the first through-hole and the second through-hole can be arranged in such a way that they are parallel to one another and are arranged on one component of the plurality of components.
- the first through-hole and / or the second through-hole insulated from electrical conductor tracks or also connected to electrical conductor tracks of the same potential on the circuit board as close as possible to one or a group of the multiple electrical ronic components are arranged.
- the first through-hole and / or the second through-hole should be arranged as close as possible on one or on a group of electronic components while observing electrical and mechanical conditions.
- the thermal energy that is generated by the electronic components can be transferred with the first and / or the second plated-through hole from the second component side to the first component side.
- the thermal energy can be transported as efficiently as possible through the forced convection to the first component side.
- the arrangement of the first through-hole and the second through-hole depends on specific conditions or standards in the manufacture of the printed circuit board of the electronic assembly.
- the first and / or the second through-contact can only be arranged so close to the electronic component that certain insulation distances between the through-contact and the electronic component can be maintained.
- the electronic components and the plated-through holes should also be arranged in such a way that they have sufficient distance from the current-carrying conductor track so that no flashovers can occur.
- the DRC Design Rule Check
- ERC Electronic Rule Check
- the arrangement of the first and / or the second plated-through hole should be arranged as close as possible to the electronic component, on the one hand, that the standards and conditions for the layout of the circuit board are guaranteed and, on the other hand, the generated thermal energy can be easily dissipated.
- the arrangement of the first through-hole and the second through-hole to the electrical ronic components, aspects of electromagnetic compatibility are also taken into account.
- the first through-hole is designed to carry current and is coated with an electrically insulating layer on the second component side of the circuit board, whereas the second through-hole is not designed to carry current and, if necessary, is not coated with the electrically insulating layer is.
- the insulating layer can be designed as an interface material between the heat sink and the circuit board.
- Through-hole plating and / or the second through-hole plating are primarily used for the heat transfer of the thermal energy from the second component side to the first component side.
- the first through-contact can also be configured to conduct current and, for example, provide various electronic components with power. Since the first via and the second via can be arranged spatially without a great distance from one another and the first via and the second via can be at different potentials, a short circuit can occur in the event of a fault.
- the current-carrying first via is provided with an electrically insulating Layer coated. This electrically isolating layer ensures that there is no short circuit between the first via and the second via on the first component side. In particular, the coating takes place with the insulating
- the second through-hole which is not current-carrying, but rather for the heat transfer of the thermal energy. is formed, not be coated with the electrically insulating layer.
- the second plated-through hole is therefore not coated with the layer because the electrically insulating layer, although it ensures good electrical insulation, causes poor or deterioration in heat transfer. As a result, not enough heat can be removed from the electronic component in an emergency.
- the electrically insulating layer is designed as an insulating film or as an insulating varnish.
- the current-carrying vias are provided with an electrically insulating
- the electrically insulating layer is preferably be purchased as an insulating film or as an insulating varnish.
- the insulating film can be used in particular if, for example, the complete or only partial areas of the first component side are covered with the insulating
- the insulating film can be applied efficiently to the entire first component side.
- the insulating varnish has the advantage that only the plated-through holes which are designed for conducting current can be coated with the insulating layer in a targeted manner.
- the first heat sink is assigned to a first electronic component and / or a second electronic component, which is arranged on the first mounting side or on the second mounting side, is assigned a second heat sink on the first mounting side, and / or the first electronic component and the second electronic component of the first heat sink or the second heat sink are assigned.
- each electronic component in particular each power semiconductor switch, can be assigned a heat sink on the first component side.
- the first heat sink is arranged in such a way that it is arranged opposite the first electronic component.
- the second heat sink can be arranged on the first component side in such a way that it is placed opposite the second electronic component.
- the first electronic component and the second electronic component can be assigned one and the same heat sink, so that the heat sinks can be arranged in a space-saving manner, especially on the first component side, and savings can be made in the number of heat sinks depending on the space required.
- the first electronic component which is a power semiconductor
- the first heat sink being arranged directly on the first electronic component on the first assembly side.
- the first or the second heat sink can be designed as a flat conductor track, so that both the first electronic component and the second electronic component can be cooled with this flat conductor track.
- a first potential is provided for a first heat sink and a second potential different from the first potential is provided for the second heat sink, or the first heat sink and the second heat sink are connected to the first potential or to the second potential are .
- SMD heat sinks which are at a certain potential
- new freedoms in the structure of the electronic assembly can be achieved. This can lead to smaller dimensions of the electronic assembly and to an increase in the performance of the electronic assembly.
- the second potential is provided, can be dispensed with a large, ground potential heat sink, which can be improved, for example, compliance with the electromagnetic compatibility rule for the increased switching frequencies on the electronic assembly.
- the first and / or the second potential does not necessarily have to be the earth potential, but can in each case be any fixed or jumping potential.
- the first and / or the second potential of the first and / or the second heat sink are each independent of one another and can differ from the respective other potential. As a result, aspects of electromagnetic compatibility can be better taken into account when creating the electronic assembly.
- Another aspect of the invention relates to a method for cooling an electronic assembly which has a circuit board with a first or a second component side.
- the second component side can be cooled with a natural convection and thermal energy can be transported from the second component side with a through-contact in the circuit board to the first component side. With a forced convection on the first component side, the thermal energy can be transported away from the circuit board so that the electronic assembly is cooled.
- Natural convection is the natural flow of air that can cool the second component side, in particular the electronic components on the second component side.
- the thermal energy, which is generated in particular by electronic components on the second component side can be transported through vias, in particular copper vias, in the circuit board from the second component side to the first component side of the circuit board become.
- the first component side is provided with a forced convection.
- the forced convection is generated in particular by a convection unit.
- the convection unit creates an air flow which transports the thermal energy or heat away from the first component side, so that in particular the circuit board of the electronic assembly can be cooled.
- An independent aspect of the invention relates to an electronic assembly with a printed circuit board which is formed with a first component side and a second component side.
- the circuit board comprises at least one first heat sink, which is arranged on the first assembly side, and several electronic components, a plurality of which is arranged on the second assembly side of the circuit board.
- the circuit board comprises the electronic assembly can be transported.
- the circuit board comprises, for example, a heat sink which is designed as a metallic housing and which is arranged on the first component side.
- the circuit board can include a convection unit for generating a forced convection exclusively on the first component side, with which the thermal energy can be transported from the circuit board of the electronic assembly, so that the electronic assembly (1) can be cooled.
- Another independent aspect of the invention relates to a method for cooling an electronic assembly which has a circuit board with a first component side and a second component side, the second component side being cooled with natural convection.
- thermal energy is transferred from the second component side with a current-carrying through-hole contact in the circuit board to the first component side and transported in a heat sink.
- the thermal energy is transported away from the circuit board and / or from the heat sink, so that the electronic assembly is cooled.
- Assembly with a circuit board which comprises a first and a second component side;
- the electronic component is located on a first component side of the circuit board
- FIG 3 shows a further schematic electronic assembly with a printed circuit board, the heat sinks here being at different potentials.
- FIG. 1 shows a schematic representation of the electronic assembly 1 with a circuit board 2, which is formed with a first component side 3 and a second component side 4.
- the first component side 3 of the printed circuit board 2 comprises a first heat sink 5.
- the circuit board 2 of the electronic assembly 1 comprises, for example, a plurality of electronic components 6, a plurality of which is arranged on the second component side 4 of the circuit board 2.
- the circuit board 2 comprises in particular a first non-current-carrying through-hole contact 7, with which the generated thermal energy of an electronic component 6 can be transported from the second component side 4 to the first component side 3.
- the electronic assembly 1 includes in particular a convection unit 8, with which a forced convection 9 can be generated.
- the forced convection 9 is generated exclusively on the first component side 3 of the circuit board 2, with which the thermal energy can be transported away from the circuit board 2 of the electronic assembly 1, so that the electronic assembly 1 can be cooled.
- an air flow can be generated which only removes the thermal energy or heat on the first component side 3 of the circuit board 2.
- the second component side 4 can, for example, have a natural convection, which can be achieved by a natural air flow. As a result, part of the thermal energy generated can in particular already be dissipated, so that the electronic components 6 in particular can be cooled.
- the first via 7 can in particular be a copper via which, for example, is filled with solder. With the first through-hole contact, the thermal energy of the second component side 4 can be transferred to, in particular, the heat sink 5 of the first component side 3. The first heat sink 5 can then use the forced convection 9 to transport the thermal energy away from the circuit board 2 so that the electronic assembly 1 can be cooled.
- the electronic components 6 and the first heat sink 5 can be designed as SMD components.
- SMD the electronic components 6 in particular can be mounted on the second loading side 4 in a space-saving manner.
- the electronic assembly 1 can, for example, be a converter or frequency converter.
- the electronic components 6 can be logic circuits, current-carrying components, measuring lines, conductor tracks, IGBTs or MOSFETs.
- the electronic assembly 1 can have a power semiconductor switch 10 as the electronic component 6.
- the examples of the electronic components 6 are not intended to be exhaustive, but are only intended to represent the large number of possible electronic components 6.
- the first heat sink 5 can be designed as a flatly executed conductor track or flatly executed conductive surface.
- the first heat sink 5 can also be designed as a metallic housing, wherein the housing of the first heat sink 5 can be made of copper or aluminum, for example.
- the first via 7 can be arranged parallel to at least one second via 11 of the printed circuit board 2 next to one another.
- the first through-hole 7 and the second through-hole 11 can be arranged as close as possible to one or on a group of the plurality of electronic components 6, isolated from the electrical conductor tracks on the circuit board 2.
- the first via 7 and / or the second via 11 should be as close as possible to one of the electrical ronic components 6 are arranged, but certain criteria and / or standards in the layout of the Lei terplatte 2 must be taken into account.
- first via 7 and / or the second via 11 insulation distances between the first via 7 and / or the second via 11 with the electronic component 6 or with a conductor on the circuit board 2 must be observed.
- aspects of the electromagnetic compatibility of the electronic assembly 1 must also be taken into account.
- the first via 7 and the second via 11 should be arranged as close as possible to one of the electronic components 6 so that on the one hand the criteria can be met and on the other hand an efficient heat dissipation of the generated thermal energy to the first assembly side 3 can be carried out.
- the first through-contact 7 and / or the second through-contact 11 can also be directly under the electrical component 6 in order to improve the thermal dissipation of heat.
- the first via 7 can be used to conduct current on the circuit board 2, in particular the area of the first via 7, which is located on the first component side 3 of the circuit board 2, can be coated with an electrically insulated layer.
- the second through-contact 11, which is not designed to carry current, but is designed to transport away the thermal energy generated, is not connected to the electrically insulating one
- the electrically insulating layer prevents it from becoming one between the first via 7 and the second via 11
- the electrically insulating layer can be, for example, an insulating film or an insulating varnish.
- the electrically insulating layer can be, for example, an insulating film or an insulating varnish.
- the current-carrying first te through contact 7 be coated, but it can also be a part or the entire area of the first fitting side 3 be coated with the insulated layer.
- the first heat sink 5 and the power semiconductor switch 10 being located as an electronic component 6 on the first component side 3 of the circuit board 2 in this example.
- the first heat sink 5 is assigned to the power semiconductor switch 10 on the first component side 3.
- the thermal energy generated by the power semiconductor switch 10 can be cooled with the aid of the heat sink 5 by the forced convection 9 generated by the convection unit 8.
- the power semiconductor switch 10 can only have pins on the underside of the power semiconductor switch 10, the pins being at a sufficiently large distance from one another. In order to be able to protect the power semiconductor switch 10 from a short circuit or flashover, the pins of the power semiconductor switch 10 can be connected to the
- the electrically insulating layer are coated. If, for example, the pins of the power semiconductor switch 10 are coated with the layer, the first heat sink 5 or the first component side 3 of the circuit board 2 itself need not be coated.
- the second component side 4 of the circuit board 2 there are in this example, for example, logic circuits that also generate thermal energy that is transferred from the second component side 4 to the first component side 3 in particular through the first through-hole 7 and / or the second through-hole 11 becomes . With the forced convection 9, the thermal energy can then be transported away from the printed circuit board 2, so that the printed circuit board 2 and in particular the electronic assembly 1 can be cooled.
- FIG 3 shows a further schematic representation of the electronic assembly 1 with the printed circuit board 2, wherein in this example the first heat sink 5 can be assigned to the first electronic component 10 and a second heat sink 13 can be assigned to a further power semiconductor switch 12.
- the first heat sink 5 and the second heat sink 13 are on the first component side 3 of the circuit board 2 and the power semiconductor switch 10 and the further power semiconductor switch 12 are located on the second component side 4 of the circuit board 2.
- the first heat sink 5 are assigned to a first potential and the second heat sink 13 are assigned to a second potential different from the first potential.
- the power semiconductor switch 10 can be assigned to the first heat sink 5.
- the first heat sink 5 and the power semiconductor switch 10 are located opposite one another.
- the further power semiconductor switch 12 can also be arranged opposite the second heat sink.
- only either the first heat sink 5 and / or the second heat sink 13 can be assigned for the power semiconductor switch 10 and the further power semiconductor switch 12.
- the first heat sink 5 or the second heat sink 13 can be designed as a flat conductor track.
- the first and / or the second potential do not necessarily have to be the earth potential, but the first and / or the second potential can be any fixed or jumping potential.
- the heat dissipation of the generated thermal energy can be optimally improved, so that the heat through the forced convection 9 on the first th component side 3 can be transported away.
- the first via 7 can be made available to the power semiconductor switch 10 and the second via 11 can be assigned to the further power semiconductor switch 12. As a result, it can be sufficient that the circuit board 2 and in particular the electronic assembly 1 can be optimally cooled.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19155237.1A EP3690934A1 (de) | 2019-02-04 | 2019-02-04 | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
PCT/EP2020/052168 WO2020160978A1 (de) | 2019-02-04 | 2020-01-29 | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3884519A1 true EP3884519A1 (de) | 2021-09-29 |
Family
ID=65351867
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19155237.1A Withdrawn EP3690934A1 (de) | 2019-02-04 | 2019-02-04 | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
EP20704425.6A Pending EP3884519A1 (de) | 2019-02-04 | 2020-01-29 | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19155237.1A Withdrawn EP3690934A1 (de) | 2019-02-04 | 2019-02-04 | Entwärmung einer elektronischen baugruppe mittels forcierter konvektion, sowie verfahren zum entwärmen einer elektronischen baugruppe |
Country Status (4)
Country | Link |
---|---|
US (1) | US11337299B2 (de) |
EP (2) | EP3690934A1 (de) |
CN (1) | CN113383414A (de) |
WO (1) | WO2020160978A1 (de) |
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US5986887A (en) * | 1998-10-28 | 1999-11-16 | Unisys Corporation | Stacked circuit board assembly adapted for heat dissipation |
DE19910500A1 (de) | 1999-03-10 | 2000-10-05 | Bosch Gmbh Robert | Elektrisches Gerät |
DE10033352B4 (de) * | 2000-07-08 | 2010-08-19 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe |
US7443025B2 (en) * | 2004-06-07 | 2008-10-28 | Broadcom Corporation | Thermally improved placement of power-dissipating components onto a circuit board |
US7538424B2 (en) * | 2004-07-08 | 2009-05-26 | Rambus Inc. | System and method for dissipating heat from a semiconductor module |
US8289715B2 (en) * | 2009-08-31 | 2012-10-16 | Panasonic Corporation | Plasma display device |
CN104094683B (zh) * | 2013-01-29 | 2016-06-08 | 三菱电机株式会社 | 电子设备 |
DE102014205411A1 (de) * | 2014-03-24 | 2015-09-24 | Zf Friedrichshafen Ag | Wärmemanagement an einer Leiterplatte |
CN113394181A (zh) * | 2016-12-20 | 2021-09-14 | 台达电子企业管理(上海)有限公司 | 功率开关组件及其散热器电位的固定方法 |
CN106486433B (zh) | 2016-12-30 | 2019-01-18 | 株洲时代金属制造有限公司 | Igbt散热器 |
EP3358917A1 (de) | 2017-02-07 | 2018-08-08 | Siemens Aktiengesellschaft | Leiterplatte mit einer kühlfunktion |
JP2018186143A (ja) * | 2017-04-25 | 2018-11-22 | オムロンオートモーティブエレクトロニクス株式会社 | 回路基板モジュール、電子装置 |
US10182494B1 (en) * | 2017-09-07 | 2019-01-15 | Flex Ltd. | Landless via concept |
-
2019
- 2019-02-04 EP EP19155237.1A patent/EP3690934A1/de not_active Withdrawn
-
2020
- 2020-01-29 EP EP20704425.6A patent/EP3884519A1/de active Pending
- 2020-01-29 US US17/428,202 patent/US11337299B2/en active Active
- 2020-01-29 WO PCT/EP2020/052168 patent/WO2020160978A1/de active Search and Examination
- 2020-01-29 CN CN202080012256.8A patent/CN113383414A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US11337299B2 (en) | 2022-05-17 |
CN113383414A (zh) | 2021-09-10 |
WO2020160978A1 (de) | 2020-08-13 |
EP3690934A1 (de) | 2020-08-05 |
US20220046786A1 (en) | 2022-02-10 |
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