EP3848434A1 - Composition adhésive, feuille adhésive et corps lié - Google Patents
Composition adhésive, feuille adhésive et corps lié Download PDFInfo
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- EP3848434A1 EP3848434A1 EP19857048.3A EP19857048A EP3848434A1 EP 3848434 A1 EP3848434 A1 EP 3848434A1 EP 19857048 A EP19857048 A EP 19857048A EP 3848434 A1 EP3848434 A1 EP 3848434A1
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- Prior art keywords
- adhesive
- mass
- polymer
- adhesive layer
- parts
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- 0 *N(CS)*O* Chemical compound *N(CS)*O* 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7628—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring containing at least one isocyanate or isothiocyanate group linked to the aromatic ring by means of an aliphatic group
- C08G18/765—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring containing at least one isocyanate or isothiocyanate group linked to the aromatic ring by means of an aliphatic group alpha, alpha, alpha', alpha', -tetraalkylxylylene diisocyanate or homologues substituted on the aromatic ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/797—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing carbodiimide and/or uretone-imine groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
Definitions
- the present invention relates to an adhesive composition, an adhesive sheet including an adhesive layer formed of the adhesive composition, and an adhered body of the adhesive sheet and an adherend.
- adhesive sheets electrically debondable adhesive sheets
- an ionic liquid containing a cation and an anion in a component constituting an adhesive composition and that can be debonded by applying a voltage to an adhesive layer are known (Patent Literatures 1 to 3).
- the electrically debondable adhesive sheet firmly adheres the members when no voltage is applied and is debonded with small force when a voltage is applied.
- a rate of decrease in adhesive force by voltage application is large in the electrically debondable adhesive sheet.
- the rate of decrease in adhesive force by voltage application is small in a low humidity environment such as winter.
- the present invention has been made in view of the above, and an object of the present invention is to provide an adhesive composition whose adhesive force is sufficiently decreased by applying a voltage even in a low humidity environment, and an adhesive sheet including an adhesive layer formed of the adhesive composition.
- the rate of decrease in adhesive force by the voltage application in the low humidity environment is due to a decrease in water content of the adhesive layer in the low humidity environment to make it difficult for the cation and the anion of the ionic liquid to move.
- a relative permittivity of components other than the ionic liquid in the adhesive layer has a correlation with the rate of decrease in adhesive force by the voltage application, and the increase in the relative permittivity can increase the rate of decrease in adhesive force by the voltage application.
- the relative dielectric constant is large, the electrical debondability is good, that is, the rate of decrease in adhesive force by the voltage application is large.
- an ionic conductivity of the adhesive layer and a capacitance per unit area of an interface between the adhesive layer and an adherend have a correlation with the rate of decrease in adhesive force by the voltage application, and the increase in the ionic conductivity and the capacitance per unit area of the interface between the adhesive layer and the adherend can increase the rate of decrease in adhesive force by the voltage application.
- the electrical debondability is good, that is, the rate of decrease in adhesive force by the voltage application is large.
- One of the adhesive composition according to the present invention achieved based on the above finding above contains a polymer and an ionic liquid, and when an adhesive layer is formed of a composition composed of components other than the ionic liquid among components contained in the adhesive composition, the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz after being left to stand in an environment of 22°C and 20% RH for 3 days.
- Another adhesive composition according to the present invention achieved based on the second finding above contains a polymer and an ionic liquid, and when an adhesive layer is formed of the adhesive composition, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more, and has an ionic conductivity of 10 ⁇ S/m or more after being adhered to an aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22°C and 15% RH for 7 days.
- the adhesive layer when the adhesive layer is formed of the adhesive composition, the adhesive layer may have a capacitance per unit area of the interface between the adhesive layer and the aluminum plate of 1.2 ⁇ F/cm 2 or more, and an ionic conductivity of 20 ⁇ S/m or more after being adhered to the aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in the environment of 22°C and 15% RH for 7 days.
- the adhesive composition may further contain an ionic solid.
- the polymer may include an ionic polymer.
- the polymer may include at least one selected from the group consisting of a polyester-based polymer, a urethane-based polymer, and an acrylic polymer having a carboxyl group, an alkoxy group, a hydroxy group and/or an amide bond.
- Another adhesive composition according to the present invention contains a polymer and an ionic liquid, and the adhesive composition contains 0.5 to 30 parts by mass of the ionic liquid and 0.5 to 10 parts by mass of an ionic solid per 100 parts by mass of the polymer.
- Another adhesive composition according to the present invention contains a polymer and an ionic liquid, and the adhesive composition contains 0.5 to 30 parts by mass of the ionic liquid per 100 parts by mass of the polymer, and the polymer contains 0.05 to 2 parts by mass of an ionic polymer.
- Another adhesive composition according to the present invention contains 100 parts by mass of an acrylic polymer and 0.5 to 30 parts by mass of an ionic liquid, in which a proportion of a polar group-containing monomer to total monomer components constituting the acrylic polymer is 0.1 to 35% by mass.
- an adhesive composition is for use in electrical debonding.
- An adhesive sheet according to the present invention includes an adhesive layer formed of the adhesive composition according to the present invention.
- An adhered body according to the present invention includes an adherend having a metal adherend surface and the adhesive sheet according to claim 11, and the adhesive layer of the adhesive sheet is adhered to the metal adherend surface.
- the adhesive force of the adhesive composition according to the present invention is sufficiently decreased by applying a voltage even in a low humidity environment.
- Both adhesive compositions according to first and second embodiments of the present invention contain a polymer and an ionic liquid.
- the adhesive layer When an adhesive layer is formed of a composition composed of components other than the ionic liquid among components contained in the adhesive composition according to the first embodiment, the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz after being left to stand in an environment of 22°C and 20% RH for 3 days.
- the adhesive layer when an adhesive layer is formed of the adhesive composition according to the second embodiment, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more, and an ionic conductivity of 10 ⁇ S/m or more after being adhered to an aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22°C and 15% RH for 7 days.
- These adhesive compositions have a property that the adhesive force is decreased due to voltage application, and thus are suitable as an electrically debondable adhesive composition.
- the first and second embodiments described above are not exclusive, some adhesive compositions fall under both of the first and second embodiments, and some adhesive compositions only fall under one of the first and second embodiments. Any adhesive composition corresponding to either the first or second embodiment exhibits the effects of the present invention.
- the first and second embodiments of the present invention may be collectively referred to as "the present embodiment”.
- the adhesive force when no voltage is applied may be referred to as "initial adhesive force”.
- a composition composed of components other than the ionic liquid may be referred to as an "ionic liquid-free adhesive composition”.
- the adhesive layer formed of the ionic liquid-free adhesive composition may be referred to as an "ionic liquid-free adhesive layer".
- electrical debondability The property that the adhesive force is decreased due to voltage application
- excellent in electrical debondability a large rate of decrease in adhesive force by voltage application
- the adhesive composition of the present embodiment contains a polymer.
- the polymer is not limited as long as the polymer is a general organic polymer compound, and examples thereof include a polymerized product or a partially polymerized product of monomers.
- the monomers may be one kind of monomers and may be a monomer mixture of two or more kinds of monomers.
- the partially polymerized product means a polymerized product in which the monomer or at least a part of the monomer mixture is partially polymerized.
- the polymer in the present embodiment is not limited as long as the polymer is used as a general adhesive and has adhesiveness, and examples thereof include an acrylic polymer, a rubber-based polymer, a vinyl alkyl ether-based polymer, a silicone-based polymer, a polyester-based polymer, a polyamide-based polymer, a urethane-based polymer, a fluorine-based polymer, and an epoxy-based polymer.
- the polymer can be used alone or a combination of two or more kinds thereof may be used may be used.
- the polymer preferably has a high relative permittivity.
- the polymer in the present embodiment preferably includes at least one selected from the group consisting of a polyester-based polymer, a urethane-based polymer, and an acrylic polymer having a carboxyl group, an alkoxy group, a hydroxy group and/or an amide bond.
- the polyester-based polymer and the urethane-based polymer have a hydroxy group that is easily polarized at the ends, and in the acrylic polymer having a carboxyl group, an alkoxy group, a hydroxy group and/or an amide bond, the carboxyl group, the alkoxy group, the hydroxy group and/or the amide bond are easily polarized.
- the total content of the polyester-based polymer and the acrylic polymer having a carboxyl group, an alkoxy group, a hydroxy group and/or an amide bond in the polymer of the present embodiment is preferably 60% by mass or more, and more preferably 80% by mass or more.
- the polymer in the present embodiment is preferably an acrylic polymer.
- the adhesive composition of the present embodiment is preferably an acrylic adhesive composition containing an acrylic polymer as a polymer.
- R a is a hydrogen atom or a methyl group
- R b is an alkyl group having 1 to 14 carbon atoms.
- alkyl (meth)acrylate having an alkyl group having 1 to 14 carbon atoms examples include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, 1,3-dimethylbutyl acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethyl butyl (meth)acrylate, heptyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate,
- n-butyl acrylate, 2-ethylhexyl acrylate, and isononyl acrylate are preferred.
- the alkyl (meth)acrylate having an alkyl group having 1 to 14 carbon atoms can be used alone or a combination of two or more kinds thereof may be used.
- the proportion of the alkyl (meth)acrylate having an alkyl group having 1 to 14 carbon atoms to total monomer components (100% by mass) constituting the acrylic polymer is not limited, but is preferably 70% by mass or more, more preferably 80% by mass or more, and still more preferably 85% by mass or more. 70% by mass or more of the proportion of the acrylic polymer easily allows initial adhesive force to be large.
- the acrylic polymer preferably further has a monomer unit derived from a polar group-containing monomer copolymerizable with the monomer unit derived from the alkyl (meth)acrylate having an alkyl group having 1 to 14 carbon atoms, for the purpose of the modification of cohesive force, heat resistance, crosslinking property, and the like.
- a monomer unit is preferable for allowing initial adhesive force to be large because the monomer can impart a crosslinking point.
- the acrylic polymer preferably includes a monomer unit derived from a polar group-containing monomer.
- Examples of the polar group-containing monomer include a carboxyl group-containing monomer, an alkoxy group-containing monomer, a hydroxy group-containing monomer, a cyano group-containing monomer, a vinyl group-containing monomer, an aromatic vinyl monomer, an amide group-containing monomer, an imide group-containing monomer, an amino group-containing monomer, an epoxy group-containing monomer, a vinyl ether monomer, an N-acryloyl morpholine, a sulfo group-containing monomer, a phosphate group-containing monomer, and an acid anhydride group-containing monomer.
- a carboxyl group-containing monomer an alkoxy group-containing monomer, a hydroxy group-containing monomer, and an amide group-containing monomer are preferred, and a carboxyl group-containing monomer is particularly preferred.
- a carboxyl group-containing monomer is particularly preferable for allowing initial adhesive force to be large.
- the polar group-containing monomer can be used alone or a combination of two or more kinds thereof may be used.
- carboxyl group-containing monomer examples include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isocrotonic acid. Acrylic acid is particularly preferred.
- the carboxyl group-containing monomer can be used alone or a combination of two or more kinds thereof may be used.
- alkoxy group-containing monomer examples include a methoxy group-containing monomer and an ethoxy group-containing monomer.
- methoxy group-containing monomer examples include 2-methoxyethyl acrylate.
- hydroxy group-containing monomer examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methyl (meth)acrylate, N-methylol (meth)acrylamide, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are particularly preferred.
- the hydroxy group-containing monomer can be used alone or a combination of two or more kinds thereof may be used.
- amide group-containing monomer examples include acrylamide, methacrylamide, N-vinyl pyrrolidone, N,N-dimethylacrylamide, N,N-dimethyl methacrylamide, N,N-diethylacrylamide, N,N-diethyl methacrylamide, N,N'-methylenebisacrylamide, N,N-dimethylaminopropyl acrylamide, N,N-dimethylaminopropyl methacrylamide, and diacetone acrylamide.
- the amide group-containing monomer can be used alone or a combination of two or more kinds thereof may be used.
- Examples of the cyano group-containing monomer include acrylonitrile and methacrylonitrile.
- vinyl group-containing monomer examples include vinyl esters such as vinyl acetate, vinyl propionate, and vinyl laurate. Vinyl acetate is particularly preferred.
- aromatic vinyl monomer examples include styrene, chlorostyrene, chloromethylstyrene, ⁇ -methyl styrene, and other substituted styrene.
- Examples of the imide group-containing monomer include cyclohexyl maleimide, isopropyl maleimide, N-cyclohexyl maleimide, and itaconimide.
- amino group-containing monomer examples include aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and N,N-dimethylaminopropyl (meth)acrylate.
- epoxy group-containing monomer examples include glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, and allyl glycidyl ether.
- vinyl ether monomer examples include methyl vinyl ether, ethyl vinyl ether, and isobutyl vinyl ether.
- the proportion of the polar group-containing monomer to total monomer components (100% by mass) constituting the acrylic polymer is preferably 0.1% by mass or more and 35% by mass or less.
- the upper limit of the proportion of the polar group-containing monomer is more preferably 25% by mass, and still more preferably 20% by mass.
- the lower limit of the proportion is more preferably 0.5% by mass, still more preferably 1% by mass, and particularly preferably 2% by mass.
- the proportion of the polar group-containing monomer is 30% by mass or less, the adhesive layer is easy to be prevented from excessively adhering to the adherend and becoming a heavy debonding type.
- the proportion is 2% by mass or more and 20% by mass or less, both debondability to the adherend and adhesion between the surface of the adhesive layer and another layer are easy to be achieved.
- the monomer components constituting the acrylic polymer may contain a polyfunctional monomer, for introducing a crosslinked structure into the acrylic polymer and allowing for easily obtaining necessary cohesive force.
- polyfunctional monomer examples include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, divinylbenzene, and N,N'-methylene bisacrylamide.
- the polyfunctional monomer can be used alone or a combination of two or more kinds thereof may be used.
- the content of the polyfunctional monomer to total monomer components (100% by mass) constituting the acrylic polymer is preferably 0.1% by mass or more and 15% by mass or less.
- the upper limit of the content of the polyfunctional monomer is more preferably 10% by mass, and the lower limit thereof is more preferably 3% by mass.
- 0.1% by mass or more of the content of the polyfunctional monomer is preferable as flexibility and adhesiveness of the adhesive layer are easy to be improved.
- the content of the polyfunctional monomer is 15% by mass or less, the cohesive force is not excessively high, and appropriate adhesiveness is easy to be obtained.
- the polyester-based polymer is typically a polymer having a structure in which a polycarboxylic acid such as a dicarboxylic acid or a derivative thereof (hereinafter also referred to as “polycarboxylic acid monomer”) is condensed with a polyhydric alcohol such as a diol or a derivative thereof (hereinafter also referred to as “polyhydric alcohol monomer").
- a polycarboxylic acid such as a dicarboxylic acid or a derivative thereof
- polyhydric alcohol monomer a polyhydric alcohol monomer
- the polycarboxylic acid monomer is not limited, but examples thereof include adipic acid, azelaic acid, dimer acid, sebacic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 4-methyl-1,2-cyclohexanedicarboxylic acid, dodecenyl succinic anhydride, fumaric acid, succinic acid, dodecanedioic acid, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, maleic acid, maleic anhydride, itaconic acid, citraconic acid, and a derivative thereof.
- the polycarboxylic acid monomer can be used alone or a combination of two or more kinds thereof may be used.
- the polyhydric alcohol monomer is not limited, but examples thereof include ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 2-methyl-1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, 2,2,4-trimethyl-1,5-pentanediol, 2-ethyl-2-butylpropanediol, 1,9-nonanediol, 2-methyloctanediol, 1,10-decanediol, a derivative thereof.
- the polyhydric alcohol monomer can be used alone or a combination of two or more kinds thereof may be used.
- the polymer in the present embodiment may contain an ionic polymer.
- the ionic polymer is a polymer having an ionic functional group.
- the relative permittivity of the polymer is increased and the electrical debondability is improved.
- the content of the ionic polymer is preferably 0.05 parts by mass or more and 2 parts by mass or less, per 100 parts by mass of the polymer.
- the polymer in the present embodiment can be obtained by (co)polymerizing the monomer components.
- the polymerization method is not limited, but examples thereof include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization, and photopolymerization (active energy ray polymerization).
- the solution polymerization is preferred from the viewpoint of costs and productivity.
- the resulting copolymer may be any of a random copolymer, a block copolymer, an alternating copolymer, a graft copolymer and the like.
- the solution polymerization is not limited, but examples thereof include a method in which monomer components, a polymerization initiator, and the like are dissolved in a solvent, and the resultant one is heated and polymerized to obtain a polymer solution containing a polymer.
- solvents include organic solvents, for example, aromatic hydrocarbons such as toluene, benzene, and xylene; esters such as ethyl acetate and n-butyl acetate; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methyl cyclohexane; and ketones such as methyl ethyl ketone and methyl isobutyl ketone.
- the solvent can be used alone or a combination of two or more kinds thereof may be used.
- the amount of the solvent to be used is not limited, but is preferably 10 parts by mass or more and 1000 parts by mass or less to total monomer components (100 parts by mass) constituting the polymer.
- the upper limit of the amount of the solvent to be used is more preferably 500 parts by mass and the lower limit thereof is more preferably 50 parts by mass.
- the polymerization initiator to be used in the solution polymerization is not limited, but examples thereof include a peroxide-based polymerization initiator and an azo-based polymerization initiator.
- the peroxide-based polymerization initiator is not limited, but examples thereof include a peroxycarbonate, a ketone peroxide, a peroxy ketal, a hydroperoxide, a dialkyl peroxide, a diacyl peroxide, and a peroxy ester, and more specific examples thereof include benzoyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, and 1,1-bis(t-butylperoxy)cyclododecane.
- the azo-based polymerization initiator is not limited, but examples thereof include 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2-methylpropionic acid)dimethyl, 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4,4-trimethylpentane), 4,4'-azobis-4-cyanovaleric acid, 2,2'-azobis(2-amidinopropane) dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane] dihydrochloride, 2,2'-azobis(2-methylpropionamidine) disulfate, 2,2'-azobis(N,N'-dimethyleneisobutyl
- the amount of the polymerization initiator to be used is not limited, but is preferably 0.01 parts by mass or more and 5 parts by mass or less, to total monomer components (100 parts by mass) constituting the polymer.
- the upper limit of the amount of the polymerization initiator to be used is more preferably 3 parts by mass, and the lower limit thereof is more preferably 0.05 parts by mass.
- the heating temperature in heating and polymerizing in the solution polymerization is not limited, but is, for example, 50°C or higher and 80°C or lower.
- the heating time is not limited, but is, for example, 1 hour or more and 24 hours or less.
- the weight average molecular weight of the polymer is not limited, but is preferably 100,000 or more and 5,000,000 or less.
- the upper limit of the weight average molecular weight is more preferably 4,000,000 and still more preferably 3,000,000, and the lower limit thereof is more preferably 200,000 and still more preferably 300,000. 100,000 or more of the weight average molecular weight allows the cohesive force to be small, and this can effectively prevent the disadvantage that an adhesive residue remains on the surface of the adherend after debonding the adhesive layer.
- 5,000,000 or less of the weight average molecular weight can effectively prevent the disadvantage that wettability of the surface of the adherend after debonding the adhesive layer is insufficient.
- the weight average molecular weight is obtained by measuring with a gel permeation chromatography (GPC) method. More specifically, for example, the weight average molecular weight can be measured using "HLC-8220GPC” (trade name, manufactured by Tosoh Corporation) as a GPC measuring device, under the following conditions and can be calculated from a standard polystyrene conversion value.
- GPC gel permeation chromatography
- Sample concentration 0.2% by mass (tetrahydrofuran solution)
- Sample injection amount 10 ⁇ L
- Reference column TSK gel Super H-RC (1 piece)
- Eluent tetrahydrofuran (THF)
- Flow rate 0.6 mL/min
- Detector differential refractometer (RI) Column temperature (measurement temperature): 40°C
- the glass transition temperature (Tg) of the polymer is not limited. 0°C or lower of the glass transition temperature is preferable, as this allows for preventing the decrease in initial adhesive force.
- the glass transition temperature is more preferably -10°C or lower, and still more preferably -20°C or lower.
- -40°C or lower the glass transition temperature is particularly preferable, as this allows the rate of decrease in adhesive force by voltage application to be particularly large.
- the glass transition temperature is most preferably -50°C or lower.
- Tg represents a glass transition temperature (unit: K) of the polymer
- the formula (Y) is a calculation formula in a case where the polymer is formed of n kinds (monomer 1, monomer 2, ... monomer n) of monomer components.
- the glass transition temperature when the homopolymer has been formed means a glass transition temperature of a homopolymer of the monomer and means a glass transition temperature (Tg) of a polymer that is formed of only a certain monomer (referred to as "monomer X" in some cases) as the monomer component.
- Tg glass transition temperature
- monomer X monomer
- numerical values are exemplified in " Polymer Handbook” (Third Edition, John Wiley & Sons, Inc, 1989 ).
- the glass transition temperature (Tg) of a homopolymer not described in the above-described literature is, for example, a value obtained by the following measuring method.
- the homopolymer solution is coated onto a release liner by flow casting, and dried to prepare a test sample (sheet-shaped homopolymer) having a thickness of approximately 2 mm. Then, approximately 1 to 2 mg of the test sample is weighed into an open cell made of aluminum to measure the behavior of reversing heat flow (specific heat component) of the homopolymer using a temperature-modulated DSC (trade name "Q-2000" manufactured by TA Instruments) at a temperature rising rate of 5°C/min in 50 ml/min of a nitrogen atmosphere.
- a temperature-modulated DSC trade name "Q-2000” manufactured by TA Instruments
- a temperature at the point where a straight line equidistant in a vertical axis direction from straight lines which are obtained by extending a baseline on a high temperature side and a baseline on the low temperature side of the obtained reversing heat flow, intersects with a curve of a portion in which the glass transition changes stepwise, is set as the glass transition temperature (Tg) when the homopolymer has been formed.
- the content of the polymer in the adhesive composition of the present embodiment is preferably 50% by mass or more and 99.9% by mass or less, to the total amount (100% by mass) of the adhesive composition.
- the upper limit of the content is more preferably 99.5% by mass and still more preferably 99% by mass, and the lower limit thereof is more preferably 60% by mass and still more preferably 70% by mass.
- the ionic liquid in the present embodiment is constituted of a pair of an anion and a cation, and is not limited so long as it is a molten salt that is liquid at 25°C (room temperature molten salt).
- a molten salt that is liquid at 25°C (room temperature molten salt).
- the anion and the cation are given below.
- the one that is liquid at 25°C is an ionic liquid
- the one that is solid at 25°C is not an ionic liquid but an ionic solid described later.
- anion of the ionic liquid examples include (FSO 2 ) 2 N - , (CF 3 SO 2 ) 2 N - , (CF 3 CF 2 SO 2 ) 2 N - , (CF 3 SO 2 ) 3 C - , Br - , AlCl 4 - , Al 2 Cl 7 - , NO 3 - , BF 4 - , PF 6 - , CH 3 COO - , CF 3 COO - , CF 3 CF 2 CF 2 COO - , CF 3 SO 3 - , CF 3 (CF 2 ) 3 SO 3 - , AsF 6 - , SbF 6 - , and F(HF) n - .
- anions of a sulfonyl imide-based compound such as (FSO 2 ) 2 N - [bis(fluorosulfonyl)imide an ion] or (CF 3 SO 2 ) 2 N - [bis(trifluoromethanesulfonyl)imide anion] are preferred as the anion since the anions are chemically stable and suitable in improving the electrical debondability.
- nitrogen-containing onium, sulfur-containing onium and phosphorus-containing onium cations are preferred as they are chemically stable and suitable in improving the electrical debondability.
- Imidazolium-based, ammonium-based, pyrrolidinium-based and pyridinium-based cations are more preferred.
- imidazolium-based cation examples include 1-methylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-propyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-pentyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-heptyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-nonyl-3-methylimidazolium cation, 1-undecyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tridecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, 1-pentadecyl-3-methylimidazolium cation, 1-p
- Examples of the pyridinium-based cation include 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, and 1-octyl-4-methylpyridinium cation.
- Examples of the pyrrolidinium-based cation include 1-ethyl-1-methylpyrrolidinium cation, and 1-butyl-1-methylpyrrolidinium cation.
- ammonium-based cation examples include tetraethylammonium cation, tetrabutylammonium cation, methyltrioctylammonium cation, tetradecytrihexylammonium cation, glycidyltrimethylammonium cation, and trimethylaminoethyl acrylate cation.
- the ionic liquid it is preferable to select a cation having a molecular weight of 160 or less as the constituent cation, from the viewpoint of increasing the rate of decrease in adhesive force during voltage application.
- the ionic liquid containing the above-described (FSO 2 ) 2 N - [bis(fluorosulfonyl)imide anion] or (CF 3 SO 2 ) 2 N - [bis(trifluoromethanesulfonyl)imide anion] and a cation having a molecular weight of 160 or less is particularly preferred.
- Examples of the cation having a molecular weight of 160 or less include 1-methylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-propyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-pentyl-3-methylimidazolium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-ethyl-1-methylpyrrolidinium cation, 1-butyl-1-methylpyrrolidinium cation, tetraethylammonium cation, glycidyltrimethylammonium cation, and trimethylaminoethyl acrylate cation.
- R 1 represents a hydrocarbon group having 4 to 10 carbon atoms (preferably a hydrocarbon group having 4 to 8 carbon atoms and more preferably a hydrocarbon group having 4 to 6 carbon atoms) and may contain a hetero atom
- R 2 and R 3 may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms (preferably a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 2 to 6 carbon atoms, and still more preferably a hydrocarbon group having 2 to 4 carbon atoms), and may contain a hetero atom.
- R 3 is not present.
- R 4 represents a hydrocarbon group having 2 to 10 carbon atoms (preferably a hydrocarbon group having 2 to 8 carbon atoms and more preferably a hydrocarbon group having 2 to 6 carbon atoms) and may contain a hetero atom
- R 5 , R 6 , and R 7 may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms (preferably a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 2 to 6 carbon atoms, and still more preferably a hydrocarbon group having 2 to 4 carbon atoms), and may contain a hetero atom.
- R 8 represents a hydrocarbon group having 2 to 10 carbon atoms (preferably a hydrocarbon group having 2 to 8 carbon atoms and more preferably a hydrocarbon group having 2 to 6 carbon atoms) and may contain a hetero atom
- R 9 , R 10 , and R 11 may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 16 carbon atoms (preferably a hydrocarbon group having 1 to 10 carbon atoms and more preferably a hydrocarbon group having 1 to 8 carbon atoms), and may contain a hetero atom.
- X represents a nitrogen atom, a sulfur atom or a phosphorus atom
- R 12 , R 13 , R 14 , and R 15 may be the same or different, represent a hydrocarbon group having 1 to 16 carbon atoms (preferably a hydrocarbon group having 1 to 14 carbon atoms, more preferably a hydrocarbon group having 1 to 10 carbon atoms, still more preferably a hydrocarbon group having 1 to 8 carbon atoms, and particularly preferably a hydrocarbon group having 1 to 6 carbon atoms), and may contain a hetero atom.
- R 12 is not present.
- the molecular weight of the cation in the ionic liquid is, for example, 500 or less, preferably 400 or less, more preferably 300 or less, still more preferably 250 or less, particularly preferably 200 or less, and most preferably 160 or less. In addition, the molecular weight is typically 50 or more. It is considered that the cation in the ionic liquid has the property to move to a cathode side in the adhesive layer during voltage application and deviate to the vicinity of the interface between the adhesive layer and the adherend. Thus, in the present invention, the adhesive force during voltage application is decreased as compared with the initial adhesive force, and the electrical debondability occurs.
- the cation having a small molecular weight of 500 or less is further easy to move to the cathode side in the adhesive layer, and is suitable in increasing the rate of decrease in adhesive force during the voltage application.
- Examples of commercially available products of the ionic liquid include "ELEXCEL AS-110", “ELEXCEL MP-442", “ELEXCEL IL-210", “ELEXCEL MP-471”, “ELEXCEL MP-456” and “ELEXCEL AS-804" (trade names, manufactured by DKS Co. Ltd.); "HMI-FSI” (trade name, manufactured by Mitsubishi Materials Corporation); and "CIL-312” and “CIL-313” (trade names, manufactured by Japan Carlit Co., Ltd.)
- the ionic conductivity of the ionic liquid is preferably 0.1 mS/cm or more and 10 mS/cm or less.
- the upper limit of the ionic conductivity is more preferably 5 mS/cm, and still more preferably 3 mS/cm, and the lower limit thereof is more preferably 0.3 mS/cm, and still more preferably 0.5 mS/cm.
- the ionic conductivity can be measured by an AC impedance method using, for example, 1260 frequency response analyzer manufactured by Solartron.
- the content (blending amount) of the ionic liquid in the adhesive composition of the present embodiment is preferably 0.5 parts by mass or more per 100 parts by mass of the polymer from the viewpoint of decreasing the adhesive force during voltage application and is preferably 30 parts by mass or less per 100 parts by weight of the polymer from the viewpoint of increasing the initial adhesive force. From the same viewpoints, the content is more preferably 20 parts by mass or less, still more preferably 15 parts by mass or less, particularly preferably 10 parts by mass or less, and most preferably 5 parts by mass or less. In addition, the content is more preferably 0.6 parts by mass or more, still more preferably 0.8 parts by mass or more, particularly preferably 1.0 part by mass or more, and most preferably 1.5 parts by mass or more.
- the adhesive composition of the present embodiment may contain one or more components other than the polymer and the ionic liquid (hereinafter, may also be referred to as "other components"), if necessary, as long as the effects of the present invention are not impaired.
- other components that may be contained in the adhesive composition of the present embodiment will be described.
- the adhesive composition of the present embodiment may contain an ionic additive for the purpose of controlling the relative permittivity, the ionic conductivity, and the capacitance.
- an ionic additive for example, an ionic solid can be used.
- the ionic solid is an ionic substance that is solid at 25°C.
- the ionic solid is not limited, but for example, among ionic substances obtained by combining the anions and cations exemplified in the above-mentioned description for the ionic liquid, the solid ones can be used.
- the content of the ionic solid is preferably 0.5 parts by mass or more, and more preferably 1 part by mass or more, and is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and still more preferably 2.5 parts by mass or less, per 100 parts by mass of the polymer.
- the adhesive composition of the present embodiment may contain a crosslinking agent, if necessary, for the purpose of improving creeping property or shear property by crosslinking the polymers.
- a crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a melamine-based crosslinking agent, a peroxide-based crosslinking agent, a urea-based crosslinking agent, a metal alkoxide-based crosslinking agent, a metal chelate-based crosslinking agent, a metal salt-based crosslinking agent, an oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, and an amine-based crosslinking agent.
- Examples of the isocyanate-based crosslinking agent include toluene diisocyanate and methylene bisphenyl isocyanate.
- Examples of the epoxy-based crosslinking agent include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl) cyclohexane, and 1,6-hexanediol diglycidyl ether.
- the content thereof is preferably 0.1 parts by mass or more, and more preferably 0.7 parts by mass or more, and is preferably 50 parts by mass or less, more preferably 10 parts by mass or less, and still more preferably 3 parts by mass or less, per 100 parts by mass of the polymer.
- the crosslinking agent can be used alone or a combination of two or more kinds thereof may be used.
- the adhesive composition of the present embodiment may contain polyethylene glycol and/or tetraethylene glycol dimethyl ether, if necessary, for the purpose of assisting the movement of the ionic liquid during voltage application.
- polyethylene glycol and/or tetraethylene glycol dimethyl ether if necessary, for the purpose of assisting the movement of the ionic liquid during voltage application.
- Those having a number average molecular weight of 100 to 6,000 can be used as polyethylene glycol and tetraethylene glycol dimethyl ether.
- the content thereof is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, and still more preferably 1 part by mass or more, and is preferably 30 parts by mass or less, more preferably 20 parts by mass or less, and still more preferably 15 parts by mass or less, per 100 parts by mass of the polymer.
- the adhesive composition of the present embodiment may contain a conductive filler, if necessary, for the purpose of imparting conductivity to the adhesive composition.
- the conductive filler is not limited, but as the filler, the general and/or conventional conductive fillers can be used. For example, graphite, carbon black, carbon fiber, and a metal powder such as silver or copper can be used.
- the conductive filler is contained, the content thereof is preferably 0.1 parts by mass or more and 200 parts by mass or less, per 100 parts by mass of the polymer.
- the adhesive composition of the present embodiment may contain a corrosion inhibitor, if necessary, for the purpose of inhibiting corrosion of a metal adherend.
- the corrosion inhibitor is not limited, but as the corrosion inhibitor, the general and/or conventional corrosion inhibitors can be used.
- a carbodiimide compound, an adsorption-type inhibitor, and a chelate-forming metal inactivating agent can be used.
- carbodiimide compound examples include 1-[3-(dimethylamino)propyl]-3-ethyl carbodiimide, 1-ethyl-3-(3-dimethylaminopropyl) carbodiimide, N,N'-dicyclohexyl carbodiimide, N,N'-diisopropyl carbodiimide, 1-ethyl-3-tert-butyl carbodiimide, N-cyclohexyl-N'-(2-morpholinoethyl) carbodiimide, N,N'-di-tert-butyl carbodiimide, 1,3-bis(p-tolyl) carbodiimide, and a polycarbodiimide resin using these as monomers.
- the carbodiimide compound can be used alone or a combination of two or more kinds thereof may be used.
- the content thereof is preferably 0.01 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of the polymer.
- the adsorption-type inhibitor examples include an alkylamine, a carboxylic acid salt, a carboxylic acid derivative, and an alkyl phosphate salt.
- the adsorption-type inhibitor can be used alone or a combination of two or more kinds thereof may be used.
- the alkylamine is contained as the adsorption-type inhibitor in the adhesive composition of the present embodiment, the content thereof is preferably 0.01 parts by mass or more and 20 parts by mass or less, per 100 parts by mass of the polymer.
- the carboxylic acid salt is contained as the adsorption-type inhibitor in the adhesive composition of the present embodiment, the content thereof is preferably 0.01 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of the polymer.
- the content thereof is preferably 0.01 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of the polymer.
- the content thereof is preferably 0.01 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of the polymer.
- the chelate-forming metal inactivating agent for example, a triazole group-containing compound or a benzotriazole group-containing compound can be used. These components are preferred as they have a high effect of inactivating the surface of metals such as aluminum and do not easily influence the adhesiveness even if contained in the adhesive component.
- the chelate-forming metal inactivating agent can be used alone or a combination of two or more kinds thereof may be used.
- the content thereof is preferably 0.01 parts by mass or more and 20 parts by mass or less, per 100 parts by mass of the polymer.
- the total content (blending amount) of the corrosion inhibitor is preferably 0.01 parts by mass or more and 30 parts by mass or less, per 100 parts by mass of the polymer.
- the adhesive composition of the present embodiment may further contain, if necessary, various additives such as a filler, a plasticizer, an age resister, an antioxidant, a pigment (a dye), a flame retardant, a solvent, a surfactant (leveling agent), a rust inhibitor, a tackifying resin, and an antistatic agent.
- various additives such as a filler, a plasticizer, an age resister, an antioxidant, a pigment (a dye), a flame retardant, a solvent, a surfactant (leveling agent), a rust inhibitor, a tackifying resin, and an antistatic agent.
- the total content of these components is not limited as long as the effects of the present invention are exhibited, but is preferably 0.01 parts by mass or more and 20 parts by mass or less, more preferably 10 parts by mass or less, and still more preferably 5 parts by mass or less, per 100 parts by mass of the polymer.
- filler examples include silica, iron oxide, zinc oxide, aluminum oxide, titanium oxide, barium oxide, magnesium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, pyrophyllite clay, kaolin clay, and calcined clay.
- the conventional plasticizers that are used the typical resin compositions can be used.
- oils such as paraffin oil and process oil
- liquid rubber such as liquid polyisoprene, liquid polybutadiene, and liquid ethylenepropylene rubber
- oils such as paraffin oil and process oil
- liquid rubber such as liquid polyisoprene, liquid polybutadiene, and liquid ethylenepropylene rubber
- tetrahydrophthalic acid azelaic acid, benzoic acid,
- age resister examples include hindered phenol-based compounds, and aliphatic or aromatic hindered amine-based compounds.
- antioxidants examples include butylhydroxytoluene (BHT) and butylhydroxyanisole (BHA).
- the pigment examples include an inorganic pigment such as titanium dioxide, zinc oxide, ultramarine, red iron oxide, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride or sulfate, and an organic pigment such as an azo pigment or a copper phthalocyanine pigment.
- an inorganic pigment such as titanium dioxide, zinc oxide, ultramarine, red iron oxide, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride or sulfate
- an organic pigment such as an azo pigment or a copper phthalocyanine pigment.
- rust inhibitor examples include zinc phosphate, a tannic acid derivative, phosphate, basic sulfonate, and various rust preventive pigments.
- adhesion-imparting agent examples include a titanium coupling agent and a zirconium coupling agent.
- antistatic agent examples include, in general, a quaternary ammonium salt or a hydrophilic compound such as polyglycolic acid or ethylene oxide derivative.
- the tackifying resin examples include a polyamide-based tackifying resin, an epoxy-based tackifying resin and an elastomer-based tackifying resin, in addition to a rosin-based tackifying resin, a terpene-based tackifying resin, a phenol-based tackifying resin, a hydrocarbon-based tackifying resin and a ketone-based tackifying resin.
- the tackifying resin can be used alone or a combination of two or more kinds thereof may be used.
- an adhesive layer ionic liquid-free adhesive layer
- a composition ionic liquid-free adhesive composition
- the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz after being left to stand in an environment of 22°C and 20% RH for 3 days.
- the above-mentioned relative permittivity means the relative permittivity measured as follows.
- the ionic liquid-free adhesive composition is uniformly coated onto a release surface of a separator whose surface is subjected to a release treatment, and dried by heating at 130°C for 3 minutes, thereby obtaining an ionic liquid-free adhesive layer having a thickness of 30 ⁇ m.
- the obtained ionic liquid-free adhesive layer is left to stand in an environment of 22°C and 20% RH for 3 days. Thereafter, the relative permittivity is measured under the following conditions.
- Measurement method capacitance method (device: 4294A Precision Impedance Analyzer, Agilent Technologies) Electrode configuration: aluminum plate having a diameter of 12.1 mmcp and a thickness of 0.5 mm Counter electrode: aluminum foil having a thickness of 60 ⁇ m Measurement environment: 23 ⁇ 1°C, 52 ⁇ 1% RH
- the relative permittivity of the ionic liquid-free adhesive layer has a correlation with the mobility of the ionic liquid in the adhesive layer formed of the adhesive composition containing the ionic liquid.
- the larger relative permittivity of the ionic liquid-free adhesive layer equates to the easier movement of the ionic liquid in the adhesive layer formed of the adhesive composition containing the ionic liquid, and thus, equates to the easier decrease in the adhesive force in applying a voltage.
- the ionic liquid-free adhesive layer formed of the adhesive composition according to the first embodiment has a relative permittivity of 5 or more at a frequency of 100 Hz after the adhesive layer is left to stand in an environment of 22°C and 20% RH for 3 days, and thus this allows for forming an adhesive whose adhesive force is sufficiently decreased by applying a voltage even in a low humidity environment.
- the relative permittivity of the ionic liquid-free adhesive layer can be controlled, for example, by appropriately adjusting the polymer component in the adhesive composition and the type and content of the ionic additive within the above-mentioned preferred ranges.
- the adhesive layer when an adhesive layer is formed of the adhesive composition, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more, and an ionic conductivity of 10 ⁇ S/m or more after being adhered to an aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22°C and 15% RH for 7 days.
- the ionic conductivity of the adhesive layer has a correlation with the mobility of the ionic liquid in the adhesive layer.
- the larger ionic conductivity allows for the easier movement of the ionic liquid.
- the capacitance per unit area of the interface between the adhesive layer and the adherend has a correlation with the easiness of the ionic liquid to be present at the interface between the adhesive layer and the adherend. The larger capacitance equates to the more easiness of the ionic liquid to be present at the interface between the adhesive layer and the adherend.
- the adhesive layer formed of the adhesive composition according to the second embodiment has a capacitance per unit area of the interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more and an ionic conductivity of 10 ⁇ S/m or more after being adhered to the aluminum plate made of A5052P H32 in JIS H4000: 2014 and left to stand in an environment of 22°C and 15% RH for 7 days, and thus this allows for forming an adhesive whose adhesive force is sufficiently decreased by applying a voltage even in a low humidity environment.
- the capacitance per unit area is more preferably 1.2 ⁇ F/cm 2 or more and the ionic conductivity of the adhesive layer is more preferably 20 ⁇ S/m or more.
- the ionic conductivity and the capacitance can be controlled, for example, by appropriately adjusting the polymer component in the adhesive composition, the type and content of the ionic liquid, and the type and content of the ionic additive within the above-mentioned preferred ranges.
- ionic conductivity and capacitance mean the ionic conductivity and capacitance measured as follows.
- the adhesive composition is uniformly coated onto an aluminum-deposited surface side of an aluminum-deposited PET film 100 (trade name "Metalumy-TS” manufactured by TORAY ADVANCED FILM CO., LTD.). At this time, in order to bring the electrode into contact with the aluminum-deposited surface, a portion where the adhesive composition is not coated is formed.
- an adhesive layer 200 is formed by heating and drying the resultant one at 130°C for 3 minutes to obtain an adhesive sheet sample.
- FIG. 5 is a side view and FIG. 6 is a top view.
- An LCR meter (for example, IM3533 manufactured by HIOKI E.E.CORPORATION) is used for measuring the capacitance and the ionic conductivity.
- an AC voltage of 0.5 V is applied between the aluminum plate 300 and the aluminum-deposited surface of the aluminum-deposited PET film 100 using an LCR meter, and the frequency is changed from 0.5 Hz to 200 kHz to obtain a cole-cole plot.
- the bulk of the adhesive layer 200 is regarded as a parallel circuit of a resistance component R adh and a capacitance component C adh
- the interface of the adhesive layer 200 is regarded as a parallel circuit of a resistance component R p and a capacitance component C dl
- an equivalent circuit of the adhered body sample is set as shown in FIG. 7
- the obtained cole-cole plot is fitted by the following equation (A).
- a resistance component Ro is a wiring resistance.
- ⁇ represents an angular frequency
- the capacitance per unit area of the interface between the adhesive layer 200 and the aluminum plate 300 can be obtained.
- 1 represents the thickness of the adhesive layer
- A represents the area of the adhesive surface of the adhesive layer 200.
- the adhesive force of the adhesive composition of the present embodiment can be evaluated by various methods. For example, it can be evaluated by a 180° peel test described in Examples.
- the adhesive composition of the present embodiment preferably has an initial adhesive force of 1.0 N/cm or more, more preferably 1.5 N/cm or more, still more preferably 2.0 N/cm or more, particularly preferably 2.5 N/cm or more, and most preferably 3.0 N/cm or more, which is measured by performing a 180° peel test after an adhesive sheet is formed as described in Examples.
- the initial adhesive force is 1.0 N/cm or more, the adhesion to the adherend is sufficient, and the adherend is unlikely to be debonded or displaced.
- the adhesive composition of the present embodiment after an adhesive sheet is formed as described in Examples, is left to stand in an environment of a predetermined temperature and humidity for a predetermined period, and is applied with a voltage of 10 V for 30 seconds, the adhesive force measured by the 180° peel test with a voltage of 10 V applied is sufficiently smaller than the initial adhesive force.
- the rate of decrease in adhesive force obtained by the following equation (C) based on the adhesive force (simply expressed as "adhesive force during voltage application” in the following equation (C)) measured by the above method and the initial adhesive force is preferably 60% or more, more preferably 70% or more, and still more preferably 80% or more.
- the predetermined temperature, humidity and period are preferably 22°C and 20% RH for 3 days, and more preferably 22°C and 15% RH for 7 days.
- Rate of decrease in adhesive force % 1 ⁇ adhesive force during voltage application / initial adhesive force ⁇ 100
- the applied voltage and voltage application time during electrical debonding are not limited to those described above as long as the adhesive sheet can be debonded. Preferred ranges of those are described below.
- the applied voltage is preferably 1 V or more, more preferably 3 V or more, and still more preferably 6 V or more.
- the applied voltage is preferably 100 V or less, more preferably 50 V or less, still more preferably 30 V or less, and particularly preferably 15 V or less.
- the voltage application time is preferably 60 seconds or less, more preferably 40 seconds or less, still more preferably 20 seconds or less, and particularly preferably 10 seconds or less. In such a case, the workability is excellent. Shorter application time is preferred, but the application time is generally 1 second or more.
- the adhesive composition of the present invention can be produced by appropriately stirring and mixing the polymer, the ionic liquid and the additives, and a crosslinking agent, polyethylene glycol, a conductive filler and the like, which are blended therewith if necessary, but the production method is not limited.
- the adhesive sheet of the present embodiment is not limited as long as it has at least one adhesive layer (hereinafter, also referred to as "electrically debondable adhesive layer”) formed of the adhesive composition of the present embodiment described above.
- the adhesive sheet of the present embodiment may have an adhesive layer (hereinafter, may be referred to as "another adhesive layer”) free of an ionic liquid, in addition to the electrically debondable adhesive layer.
- the adhesive sheet of the present embodiment may include a substrate, a conductive layer, a conduction substrate, an intermediate layer, an undercoat layer, and the like.
- the adhesive sheet of the present embodiment may be, for example, rolled in a roll shape or may be in a sheet shape.
- the "adhesive sheet” shall also include the meaning of "adhesive tape”. That is, the adhesive sheet of the present embodiment may be an adhesive tape having a tape-like form.
- the adhesive sheet of the present embodiment may be a double-sided adhesive sheet including only the electrically debondable adhesive layer without a substrate, that is, a (substrateless) double-sided adhesive sheet including no substrate layer.
- the adhesive sheet of the present embodiment may be a double-sided adhesive sheet including a substrate, both surfaces of the substrate being the adhesive layer (electrically debondable adhesive layer or another adhesive layer).
- the adhesive sheet of the present embodiment may be a single-sided adhesive sheet including a substrate, only one surface of the substrate being an adhesive layer (electrically debondable adhesive layer or another adhesive layer).
- the adhesive sheet of the present embodiment may include a separator (release liner) for protecting the surface of the adhesive layer, but the separator is not included in the adhesive sheet of the present embodiment.
- the structure of the adhesive sheet of the present embodiment is not limited, but the adhesive sheet preferably includes an adhesive sheet X1 illustrated in FIG. 1 , an adhesive sheet X2 in which a laminate structure is illustrated in FIG. 2 , and an adhesive sheet X3 in which a laminate structure is illustrated in FIG. 3 .
- the adhesive sheet X1 is a substrateless double-sided adhesive sheet including an electrically debondable adhesive layer 1 only.
- the adhesive sheet X2 is a substrate-attached double-sided adhesive sheet having a layer configuration including an adhesive layer 2, a conduction substrate 5 (substrate 3 and conductive layer 4), and the electrically debondable adhesive layer 1.
- the adhesive sheet X3 is a substrate-attached double-sided adhesive sheet having a layer configuration including the adhesive layer 2, the conduction substrate 5 (substrate 3 and conductive layer 4), the electrically debondable adhesive layer 1, another conduction substrate 5 (substrate 3 and conductive layer 4), and another adhesive layer 2.
- the substrate 3 is not essential and only the conductive layer 4 may be present.
- the adhesive sheet X2 in FIG. 2 may be a single-sided adhesive sheet free of the adhesive layer 2.
- the substrate 3 is not limited, but examples thereof include a paper-based substrate such as paper, a fiber-based substrate such as cloth and nonwoven fabric, a plastic substrate such as a film or sheet made of various plastics (a polyolefin-based resin such as polyethylene and polypropylene, a polyester-based resin such as polyethylene terephthalate, an acrylic resin such as polymethyl methacrylate, and the like), and a laminate thereof.
- the substrate may have a form of a single layer and may have a form of multi-layers.
- the substrate may be subjected to, if necessary, various treatments such as a back-face treatment, an antistatic treatment, and an undercoating treatment.
- the conductive layer 4 is not limited so long as it is a layer having conductivity, but may be a metal-based substrate such as a metal foil (for example, aluminum, magnesium, copper, iron, tin, and gold) and a metal plate (for example, aluminum, magnesium, copper, iron, tin, and silver), a conductive polymer, and the like.
- the conductive layer 4 may be a metal-deposited film provided on the substrate 3.
- the conduction substrate 5 is not limited so long as it is a substrate having a conductive layer (carrying a current), but examples thereof include a substrate having a metal layer formed on a surface thereof. Examples thereof include one having a metal layer formed on a surface of the substrate exemplified above by a method such as a plating method, a chemical vapor deposition or sputtering.
- the metal layer includes the metal, metal plate and conductive polymer exemplified above.
- the adherend at the both sides of the adhesive sheet is an adherend having a metal adherend surface. It is preferred in the adhesive sheet X2 that an adherend at the side of the electrically debondable adhesive layer 1 is an adherend having a metal adherend surface.
- the metal adherend surface examples include a surface having conductivity and composed of a metal containing, for example, aluminum, copper, iron, magnesium, tin, gold, silver or lead as a main component.
- the surface composed of a metal containing aluminum is preferred.
- the adherend having a metal adherend surface examples include a sheet, a component, or a plate that is composed of a metal containing, for example, aluminum, copper, iron, magnesium, tin, gold, silver or lead as a main component.
- An adherend other than the adherend having a metal adherend surface is not limited, and examples thereof include a fiber sheet such as paper, cloth or nonwoven fabric, and a film or a sheet of various plastics.
- the thickness of the electrically debondable adhesive layer 1 is preferably 1 ⁇ m or more and 1,000 ⁇ m or less from the viewpoint of the initial adhesive force.
- the upper limit of the thickness of the electrically debondable adhesive layer 1 is more preferably 500 ⁇ m, still more preferably 100 ⁇ m and particularly preferably 30 ⁇ m, and lower limit thereof is more preferably 3 ⁇ m, still more preferably 5 ⁇ m and particularly preferably 8 ⁇ m.
- the thickness of the electrically debondable adhesive layer is a thickness of the adhesive sheet.
- the thickness of the adhesive layer 2 is preferably 1 ⁇ m or more and 2000 ⁇ m or less from the viewpoint of adhesive force.
- the upper limit of the thickness of the adhesive layer 2 is more preferably 1,000 ⁇ m, still more preferably 500 ⁇ m and particularly preferably 100 ⁇ m, and the lower limit thereof is more preferably 3 ⁇ m, still more preferably 5 ⁇ m and particularly preferably 8 ⁇ m.
- the thickness of the substrate 3 is preferably 10 ⁇ m or more and 1,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 500 ⁇ m, still more preferably 300 ⁇ m and particularly preferably 100 ⁇ m, and the lower limit thereof is more preferably 12 ⁇ m and still more preferably 25 ⁇ m.
- the thickness of the conductive layer 4 is preferably 0.001 ⁇ m or more and 1,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 500 ⁇ m, still preferably 300 ⁇ m, still more preferably 50 ⁇ m and still more preferably 10 ⁇ m, and the lower limit thereof is more preferably 0.01 ⁇ m, still more preferably 0.03 ⁇ m and still more preferably 0.05 ⁇ m.
- the thickness of the conduction substrate 5 is preferably 10 ⁇ m or more and 1,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 500 ⁇ m, still more preferably 300 ⁇ m and particularly preferably 100 ⁇ m, and the lower limit thereof is more preferably 12 ⁇ m and still more preferably 25 ⁇ m.
- the surfaces of the electrically debondable adhesive layer of the adhesive sheet of the present embodiment and another adhesive layer may be protected by a separator (release liner).
- the separator is not limited, but examples thereof include a release liner in which the surface of a substrate (liner substrate) such as paper or plastic film has been silicone-treated, and a release liner in which the surface of a substrate (liner substrate) such as paper or plastic film has been laminated with a polyolefin-based resin.
- the thickness of the separator is not limited, but is preferably 10 ⁇ m or more and 100 ⁇ m or less.
- the thickness of the adhesive sheet of the present embodiment is preferably 20 ⁇ m or more and 3,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 1,000 ⁇ m, still more preferably 300 ⁇ m and particularly preferably 200 ⁇ m, and the lower limit thereof is more preferably 30 ⁇ m and still more preferably 50 ⁇ m.
- the thickness of the adhesive sheet is preferably 50 ⁇ m or more and 2,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 1,000 ⁇ m and still more preferably 200 ⁇ m, and the lower limit thereof is more preferably 80 ⁇ m and still more preferably 100 ⁇ m.
- the thickness of the adhesive sheet is preferably 100 ⁇ m or more and 3,000 ⁇ m or less.
- the upper limit of the thickness is more preferably 1,000 ⁇ m and still more preferably 300 ⁇ m, and the lower limit thereof is more preferably 150 ⁇ m and still more preferably 200 ⁇ m.
- a known or common production method can be used.
- a method in which a solution of the adhesive composition of the present embodiment which is dissolved in a solvent as needed is coated onto a separator and dried and/or cured may be used.
- a method in which a solution of the adhesive composition free of the ionic liquid and the additive which is dissolved in a solvent as needed is coated onto a separator and dried and/or cured may be used.
- the solvent and the separator those described above can be used.
- a common coater for example, a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, and a spray roll coater
- a gravure roll coater for example, a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, and a spray roll coater
- the electrically debondable adhesive layer and another adhesive layer can be produced by the method described above, and the adhesive sheet of the present embodiment can be produced by appropriately laminating the electrically debondable adhesive layer and another adhesive layer on the substrate, the conductive layer and the conduction substrate.
- the adhesive sheet may be produced by coating the adhesive composition using the substrate, the conductive layer and the conduction substrate, instead of the separator.
- Debonding of the adhesive sheet of the present embodiment from an adherend can be performed by generating a potential difference in a thickness direction of the electrically debondable adhesive layer by applying a voltage to the electrically debondable adhesive layer.
- debonding can be performed by carrying a current to both metal adherend surfaces on both sides of the adhesive sheet and applying a voltage to the electrically debondable adhesive layer.
- debonding can be performed by carrying a current to the conductive adherend and the conductive layer 4 and applying a voltage to the electrically debondable adhesive layer.
- debonding can be performed by carrying a current the conductive layers 4 on both surfaces of the adhesive layer and applying a voltage to the electrically debondable adhesive layer.
- the current-carrying is preferably performed by connecting terminals to one end and the other end of the adhesive sheet such that a voltage is applied to the entire electrically debondable adhesive layer.
- the adherend has a metal adherend surface
- the one end and the other end may be a part of the adherend having a metal adherend surface.
- a voltage may be applied after adding water to the interface between the metal adherend surface and the electrically debondable adhesive layer.
- the conventional debonding technology includes an adhesive layer that is cured by ultraviolet (UV) irradiation and debonded, and an adhesive layer that is debonded by heat.
- the adhesive sheet using such an adhesive layer cannot be used when ultraviolet (UV) irradiation is difficult or damages occurs in a member, which is an adherend, by heat.
- the adhesive sheet of the present embodiment having the electrically debondable adhesive layer does not use ultraviolet rays and heat, and thus debonding can be easily performed by applying a voltage without damaging a member, which is an adherend.
- the adhesive sheet of the present embodiment is suitable for use in fixation of a secondary battery (for example, lithium ion battery pack) used in a mobile device such as a smart phone, mobile phone, a notebook computer, a video camera or a digital camera, to a case.
- a secondary battery for example, lithium ion battery pack
- Examples of a rigid member to be adhered by the adhesive sheet of the present embodiment include a silicon substrate, a sapphire substrate for LED, an SiC substrate and a metal base substrate for use in a semiconductor wafer; a TFT substrate and a color filter substrate for a display; and a base substrate for an organic EL panel.
- Examples of a brittle member to be adhered by a double-sided adhesive sheet include a semiconductor substrate such as a compound semiconductor substrate; a silicon substrate for use in MEMS device, a passive matrix substrate, a surface cover glass, OGS (One Glass Solution) substrate in which the cover glass is provided on a touch panel sensor, an organic substrate and an organic/inorganic hybrid substrate including silsesquioxane as a main component for a smart phone; a flexible glass substrate for a flexible display; and a graphene sheet.
- An adhered body of the present embodiment has a laminate structure part including an adherend having a metal adherend surface, and an adhesive sheet having an electrically debondable adhesive layer adhered to the metal adherend surface.
- the adherend having a metal adherend surface include those made of metals containing, for example, aluminum, copper, iron, magnesium, tin, silver, and lead as a main component. Among these, a metal containing aluminum is preferred.
- Examples of the adhered body of the present embodiment include an adhered body including the adhesive sheet X1 and adherends having a metal adherend surface provided on both surfaces of the electrically debondable adhesive layer 1; an adhered body including the adhesive sheet X2, an adherend having a metal adherend surface provided on the electrically debondable adhesive layer 1 side, and an adherend provided on the adhesive layer 2 side; and an adhered body including the adhesive sheet X3 and adherends provided on both surfaces of the adhesive layer 2.
- n-butyl acrylate (BA) and 10 parts by mass of 4-hydroxybutyl acrylate (4HBA) as monomer components and 150 parts by mass of ethyl acetate as a polymerization solvent were charged and stirred for 1 hour with nitrogen gas introduced.
- oxygen in the polymerization system was removed, and then 0.2 parts by mass of 2,2'-azobisisobutyronitrile (AIBN) as a polymerization initiator was added.
- AIBN 2,2'-azobisisobutyronitrile
- n-butyl acrylate (BA) and 33 parts by mass of methyl methacrylate (MMA) as monomer components and 150 parts by mass of ethyl acetate as a polymerization solvent were charged and stirred for 1 hour with nitrogen gas introduced.
- oxygen in the polymerization system was removed, and then 0.2 parts by mass of 2,2'-azobisisobutyronitrile (AIBN) as a polymerization initiator was added.
- AIBN 2,2'-azobisisobutyronitrile
- the temperature was raised to 63°C and a reaction was performed for 6 hours. Thereafter, ethyl acetate was added to obtain an acrylic polymer 4 solution having a solid content concentration of 40% by mass.
- each component in Table 1 mean parts by mass. Further, the blending amount (parts by mass) of the polymer indicates the blending amount (parts by mass) of the solid content in the polymer solution.
- VYLON UR-V8700 urethane-modified polyester resin, trade name "VYLON UR-V8700", manufactured by Toyobo Co., Ltd.
- VYLON BX1001 polyester resin, trade name "VYLON BX1001", manufactured by Toyobo Co., Ltd.
- SOMAREX 530 anionic polyacrylamide polymer (ionic polymer), trade name "SOMAREX 530", manufactured by SOMAR Corporation
- AS-110 cation: 1-ethyl-3-methylimidazolium cation, anion: bis(fluorosulfonyl)imide anion, trade name "ELEXCEL AS-110", manufactured by DKS Co. Ltd.
- V-05 polycarbodiimide resin, trade name "CARBODILITE V-05", manufactured by Nisshinbo Chemical Inc.
- TAKENATE D110 trimethylolpropanexylylene diisocyanate, trade name "TAKENATE D110N”, manufactured by Mitsui Chemicals, Inc.
- EMI-nitrate 1-ethyl-3-methylimidazolium nitrate, manufactured by Tokyo Chemical Industry Co., Ltd.
- Zn-nitrate zinc nitrate hexahydrate, manufactured by Wako Pure Chemical Industries, Ltd.
- ionic liquid-free adhesive composition Materials, obtained in the same manner as in Examples 1-1 to 1-8 and Comparative Examples 1-1 to 1-5 except that an ionic liquid was not added, were stirred and mixed to obtain an ionic liquid-free adhesive composition.
- the ionic liquid-free adhesive composition was coated, using an applicator, onto a release-treated surface of a polyethylene terephthalate separator ("MRF38" (trade name) manufactured by Mitsubishi Plastics, Inc.) whose surface was subjected to a release treatment to have a uniform thickness.
- MRF38 polyethylene terephthalate separator
- the resulting coating film was dried by heating at 130°C for 3 minutes to obtain an ionic liquid-free adhesive layer having a thickness of 30 ⁇ m.
- the obtained ionic liquid-free adhesive layer was left to stand in an environment of 22°C and 20% RH for 3 days, and then the relative permittivity of the adhesive layer at a frequency of 100 kHz was measured under the following conditions according to JIS K 6911.
- Measurement method capacitance method (device: 4294A Precision Impedance Analyzer, Agilent Technologies)
- Electrode configuration aluminum plate having a diameter of 12.1 mmcp and a thickness of 0.5 mm
- the adhesive composition of each example was coated, using an applicator, onto a release-treated surface of a polyethylene terephthalate separator ("MRF38" (trade name) manufactured by Mitsubishi Plastics, Inc.) whose surface was subjected to a release treatment to have a uniform thickness.
- MRF38 polyethylene terephthalate separator
- the resulting coating film was dried by heating at 130°C for 3 minutes to obtain an electrically debondable adhesive layer (adhesive sheet) having a thickness of 30 ⁇ m.
- the obtained electrically debondable adhesive layer (adhesive sheet) was made into a sheet having a size of 10 mm ⁇ 80 mm, and a metal layer surface of a metal layer-attached film (trade name "BR1075", manufactured by Toray Film Co., Ltd., thickness: 25 ⁇ m, size: 10 mm ⁇ 100 mm) was adhered to a separator-free surface of the adhesive sheet, to obtain a substrate-attached single-sided adhesive sheet.
- a metal layer surface of a metal layer-attached film (trade name "BR1075", manufactured by Toray Film Co., Ltd., thickness: 25 ⁇ m, size: 10 mm ⁇ 100 mm) was adhered to a separator-free surface of the adhesive sheet, to obtain a substrate-attached single-sided adhesive sheet.
- a separator of the substrate-attached single-sided adhesive sheet was peeled off, and an aluminum plate (A5052P H32 (JIS H4000: 2014)) as an adherend was adhered to the peeled face such that one end of the adhesive sheet was protruded from the adherend by approximately 2 mm, pressed by reciprocating a 2 kg roller one time, followed by allowing it to stand in an environment of 23°C for 30 minutes, and thus an adhered body including stainless steel plate 6/electrically debondable adhesive layer (adhesive sheet) 1'/metal layer-attached film (conduction substrate) 5' was obtained.
- the outline of the adhered body is shown in FIG. 4 . Thereafter, the adhesive sheet was peeled in an arrow method in FIG.
- the adhesive force during voltage application was measured in the same manner as the above initial adhesive force measurement, except that, after pressing by reciprocating a 2 kg roller one time, the obtained adhesive sheet was left to stand in an environment of 22°C and 20% RH for 3 days and that, before the peeling, negative and positive electrodes of a DC current machine were attached to ⁇ and ⁇ points of the adhered body in FIG. 4 , a voltage of 10 V was applied for 30 seconds, and the peeling was performed with the voltage applied.
- the measurement results are shown in Table 1.
- the adhesive compositions of Examples 1-1 to 1-8 in which the adhesive layer is formed of the composition composed of components other than the ionic liquid among components contained in the adhesive composition and the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz after being left to stand in an environment of 22°C and 20% RH for 3 days, all have a large rate of decrease in adhesive force by voltage application.
- n-butyl acrylate (BA) and 10 parts by mass of acrylic acid (AA) as monomer components and 150 parts by mass of ethyl acetate as a polymerization solvent were charged and stirred for 1 hour with nitrogen gas introduced.
- oxygen in the polymerization system was removed, and then 0.2 parts by mass of 2,2'-azobisisobutyronitrile (AIBN) as a polymerization initiator was added.
- AIBN 2,2'-azobisisobutyronitrile
- the temperature was raised to 63°C and a reaction was performed for 6 hours. Thereafter, ethyl acetate was added to obtain an acrylic polymer 6 solution having a solid content concentration of 40% by mass.
- n-butyl acrylate (BA) 10 parts by mass of 2-methoxyethyl acrylate (MEA) and 3 parts by mass of acrylic acid (AA) as monomer components and 150 parts by mass of ethyl acetate as a polymerization solvent were charged and stirred for 1 hour with nitrogen gas introduced.
- oxygen in the polymerization system was removed, and then 0.2 parts by mass of 2,2'-azobisisobutyronitrile (AIBN) as a polymerization initiator was added.
- AIBN 2,2'-azobisisobutyronitrile
- the temperature was raised to 63°C and a reaction was performed for 6 hours. Thereafter, ethyl acetate was added to obtain an acrylic polymer 10 solution having a solid content concentration of 40% by mass.
- Irgamet 30 N,N-bis(2-ethylhexyl)-1,2,4-triazole-1-ylmethaneamine, trade name "Irgamet30", manufactured by BASF
- Irgacor DSSG disodium sebacate, trade name "Irgamet DSSG", manufactured by BASF
- AminO imidazolines derivative, trade name "AminO", manufactured by BASF
- PEG400 polyethylene glycol, trade name "PEG400", manufactured by Tokyo Chemical Industry Co., Ltd.
- CORONATE L Isocyanate compound, trade name "CORONATE L", manufactured by Tosoh Corporation
- a measurement sample (composite sample) was prepared using the adhesive composition of each example as follows, and the capacitance of the adhesive interface and the ionic conductivity of the adhesive layer were obtained by the following methods. The results are shown in Table 2.
- the adhesive composition was uniformly coated onto an aluminum-deposited surface side of an aluminum-deposited PET film 100 (trade name "Metalumy-TS” manufactured by TORAY ADVANCED FILM CO., LTD.). At this time, in order to bring the electrode into contact with the aluminum-deposited surface, a portion where the adhesive composition was not coated was provided. Next, an adhesive layer 200 was formed by heating and drying the aluminum-deposited PET film at 130°C for 3 minutes to obtain an adhesive sheet sample.
- FIG. 5 is a side view and FIG. 6 is a top view.
- An LCR meter (for example, IM3533 manufactured by HIOKI E.E.CORPORATION) was used for measuring the capacitance and the ionic conductivity.
- an AC voltage of 0.5 V was applied between the aluminum plate 300 and the aluminum-deposited surface of the aluminum-deposited PET film 100 using an LCR meter, and the frequency was changed from 0.5 Hz to 200 kHz to obtain a cole-cole plot.
- the bulk of the adhesive layer 200 was regarded as a parallel circuit of a resistance component R adh and a capacitance component C adh
- the interface of the adhesive layer 200 was regarded as a parallel circuit of a resistance component R p and a capacitance component C dl
- an equivalent circuit of the adhered body sample was set as shown in FIG. 7
- the obtained cole-cole plot was fitted by the following equation (A).
- a resistance component Ro is a wiring resistance.
- Z R 0 + R p cos ⁇ 2 ⁇ 1 + i ⁇ sin ⁇ 2 ⁇ 1 ⁇ ⁇ ⁇ 1 ⁇ C dl + 1 + R adh cos ⁇ 2 ⁇ 2 + i ⁇ sin ⁇ 2 ⁇ 2 ⁇ ⁇ ⁇ 2 ⁇ C adh + 1
- ⁇ represents an angular frequency
- 1 represents the thickness of the adhesive layer
- A represents the area of the adhesive surface of the adhesive layer 200.
- the initial adhesive force was measured in the same manner as in Examples 1-1 to 1-8 and Comparative Examples 1-1 to 1-5, except that an aluminum-deposited PET film (trade name "Metalumy-TS” manufactured by TORAY ADVANCED FILM CO., LTD.) was used as a substrate and an adhesive layer was formed on the aluminum-deposited surface.
- An aluminum-deposited PET film (trade name "Metalumy-TS” manufactured by TORAY ADVANCED FILM CO., LTD.) was used as a substrate and an adhesive layer was formed on the aluminum-deposited surface.
- the measurement results are shown in Table 2.
- the adhesive force during voltage application was measured in the same manner as the above initial adhesive force measurement, except that, after pressing by reciprocating a 2 kg roller one time, the obtained adhesive sheet was left to stand in an environment of 22°C and 20% RH for 3 days and that, before the peeling, negative and positive electrodes of a DC current machine were attached to ⁇ and ⁇ points of the adhered body in FIG. 4 , a voltage of 10 V was applied for 30 seconds, and the peeling was performed with the voltage applied.
- the electrical debondability was evaluated according to the following criteria. The measurement results are shown in Table 2.
- the adhesive force during voltage application was measured in the same manner as the above initial adhesive force measurement, except that, after pressing by reciprocating a 2 kg roller one time, the obtained adhesive sheet was left to stand in an environment of 22°C and 15% RH for 7 days and that, before the peeling, negative and positive electrodes of a DC current machine were attached to ⁇ and ⁇ points of the adhered body in FIG. 4 , a voltage of 10 V was applied for 10 seconds, and the peeling was performed with the voltage applied.
- the measurement results are shown in Table 2.
- the adhesive compositions of Examples 2-1 to 2-11 in which the adhesive layer is formed of the adhesive composition, and, after being adhered to the aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22°C and 15% RH for 7 days, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more and an ionic conductivity of 10 ⁇ S/m or more, all have a large rate of decrease in adhesive force by voltage application.
- FMIM-MeSO 3 ionic additive, imidazolium salt, manufactured by Tokyo Chemical Industry Co., Ltd.
- EPOMIN 200 polyethyleneimine, manufactured by NIPPON SHOKUBAI CO., LTD.
- Example 3-1 Example 3-2
- Example 3-3 Example 3-4
- Example 3-5 Component Polymer Acrylic polymer 10
- Acrylic polymer 11 100
- VYLON UR-V8700 100
- VYLON BX1001 100
- Corrosion inhibitor Irgamet 30
- 0.8 0.8 0.8 Irgacor DSSG 0.3 0.3 0.3
- AminO 3 3 Additive EMI-nitrate 2
- SOMAREX 530 0.2 0.2 0.2 0.2 EMIM-MeSO 3
- EPOMIN 200 10
- Crosslinking agent V-05 0.3
- TAKENATE D110 0.15
- Initial adhesive force (N/cm) 6.22 6.25 6.22 2.83 1.93 After storage under 22°C and 20% RH for 3 days
- Adhesive force during voltage application (N/cm) 0.03 0.04 0.03 0.03 0.03
- Rate of decrease in adhesive force (%) 99.5 99.4 99.5 98.9
- the adhesive compositions of Examples 3-1 to 3-5 in which the adhesive layer is formed of the adhesive composition, and, after being adhered to the aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22°C and 15% RH for 7 days, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 ⁇ F/cm 2 or more and an ionic conductivity of 10 ⁇ S/m or more, all have a large rate of decrease in adhesive force by voltage application.
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- Chemical & Material Sciences (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
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JP2019157325A JP2020164778A (ja) | 2018-09-03 | 2019-08-29 | 粘着剤組成物、粘着シート、及び接合体 |
PCT/JP2019/034143 WO2020050169A1 (fr) | 2018-09-03 | 2019-08-30 | Composition adhésive, feuille adhésive et corps lié |
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EP (1) | EP3848434A4 (fr) |
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JP7427235B2 (ja) * | 2020-02-18 | 2024-02-05 | ビッグテクノス株式会社 | 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法 |
US20230088278A1 (en) * | 2020-03-06 | 2023-03-23 | 3M Innovative Properties Company | Thermal debonding of primer-initiated curable structural adhesive films |
EP4067401A1 (fr) * | 2021-03-30 | 2022-10-05 | Henkel AG & Co. KGaA | Composition adhésive durcissable à deux composants (2k) |
WO2023054484A1 (fr) | 2021-09-30 | 2023-04-06 | 日東電工株式会社 | Composition adhésive, feuille adhésive et corps lié |
WO2023054480A1 (fr) | 2021-09-30 | 2023-04-06 | 日東電工株式会社 | Composition adhésive, feuille adhésive et corps lié |
KR20240068664A (ko) | 2021-09-30 | 2024-05-17 | 닛토덴코 가부시키가이샤 | 점착제 조성물, 점착 시트, 및 접합체 |
JP2023073161A (ja) * | 2021-11-15 | 2023-05-25 | 日東電工株式会社 | 粘着剤組成物、粘着シート、光学積層体、画像表示パネル及び画像表示装置 |
JP7369887B2 (ja) * | 2021-11-15 | 2023-10-26 | 日東電工株式会社 | 粘着剤組成物、粘着シート、光学積層体、画像表示パネル及び画像表示装置 |
KR20240024216A (ko) * | 2022-02-10 | 2024-02-23 | 빅텍크노스 컴퍼니 엘티디. | 전기 박리성 점착제 조성물, 전기 박리성 점착 제품 및 그 이용 |
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WO2009041445A1 (fr) * | 2007-09-25 | 2009-04-02 | Three Bond Co., Ltd. | Composition durcissable par voie anaérobie |
KR101542633B1 (ko) * | 2007-11-07 | 2015-08-06 | 닛폰고세이가가쿠고교 가부시키가이샤 | 점착제, 광학 부재용 점착제, 광학 부재 및 일시 표면 보호용 점착제 |
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EP2602814A1 (fr) * | 2010-08-06 | 2013-06-12 | Nitto Denko Corporation | Procédé de fabrication de composant électronique |
JP5425258B2 (ja) * | 2012-04-16 | 2014-02-26 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着剤層付偏光フィルムおよび画像形成装置 |
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US20160009960A1 (en) * | 2013-03-27 | 2016-01-14 | Lintec Corporation | Electrically peelable adhesive composition and electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet |
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US11279855B2 (en) * | 2015-10-16 | 2022-03-22 | Nitto Denko Corporation | Electrically peelable adhesive composition, adhesive sheet, and joined body |
WO2017064925A1 (fr) * | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | Feuille adhésive double face, corps lié de feuille adhésive double face, et procédé de liaison/séparation vis-à-vis d'adhérés |
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JP6767104B2 (ja) * | 2015-11-24 | 2020-10-14 | 日東電工株式会社 | 被着体の接合・分離方法 |
TWI553078B (zh) * | 2015-12-24 | 2016-10-11 | Nanya Plastics Corp | A polyamine acrylate adhesive and its use |
EP3339388B1 (fr) * | 2016-12-22 | 2022-01-26 | 3M Innovative Properties Company | Compositions d'adhésif sensible à la pression pour la fabrication de dispositifs électroniques |
JP2018135438A (ja) * | 2017-02-21 | 2018-08-30 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、及び、粘着剤層付光学フィルム |
JP7136567B2 (ja) * | 2017-03-03 | 2022-09-13 | 日東電工株式会社 | 電気剥離用粘着剤組成物、粘着シート、及び接合体 |
JP6911745B2 (ja) * | 2017-03-31 | 2021-07-28 | 東洋インキScホールディングス株式会社 | 導電性粘着剤、粘着性コネクタ、および粘着性端子部材 |
EP3524654B1 (fr) * | 2018-02-08 | 2022-09-07 | 3M Innovative Properties Company | Compositions d'adhésif sensible à la pression pour des applications de collage électronique |
-
2019
- 2019-08-29 JP JP2019157325A patent/JP2020164778A/ja active Pending
- 2019-08-30 CN CN201980057389.4A patent/CN112639045B/zh active Active
- 2019-08-30 EP EP19857048.3A patent/EP3848434A4/fr active Pending
- 2019-08-30 KR KR1020217006251A patent/KR20210053896A/ko not_active Application Discontinuation
- 2019-08-30 US US17/272,958 patent/US20210277286A1/en active Pending
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EP3848434A4 (fr) | 2022-11-16 |
JP2020164778A (ja) | 2020-10-08 |
CN112639045A (zh) | 2021-04-09 |
US20210277286A1 (en) | 2021-09-09 |
KR20210053896A (ko) | 2021-05-12 |
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