EP3728501A1 - Method for producing adhesive-bonding surfaces by means of a 3d printing device - Google Patents
Method for producing adhesive-bonding surfaces by means of a 3d printing deviceInfo
- Publication number
- EP3728501A1 EP3728501A1 EP18807274.8A EP18807274A EP3728501A1 EP 3728501 A1 EP3728501 A1 EP 3728501A1 EP 18807274 A EP18807274 A EP 18807274A EP 3728501 A1 EP3728501 A1 EP 3728501A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- adherend
- printing device
- joining part
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000004026 adhesive bonding Methods 0.000 title abstract description 5
- 238000007639 printing Methods 0.000 title description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 208
- 239000000853 adhesive Substances 0.000 claims abstract description 205
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000010146 3D printing Methods 0.000 claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000011109 contamination Methods 0.000 claims description 3
- 238000006731 degradation reaction Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 3
- 239000011859 microparticle Substances 0.000 claims description 3
- 239000002105 nanoparticle Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 230000002028 premature Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229920000298 Cellophane Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 239000004839 Moisture curing adhesive Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
Definitions
- the present disclosure relates to the field of adhesive technology, in particular the production of adhesive or joining surfaces.
- it relates to the production of largely arbitrarily shaped adhesive or joining surfaces by means of a 3D printing device, and in particular to the attachment or application of adhesive surfaces on adherends or adhesive carrier.
- adhesive bonds are currently based either on the use of 1K or 2K adhesives of different classes of adhesives such as epoxy resins, polyurethanes and cyanoacrylates, of single or double-sided adhesive tapes such as with one or both sides applied to a carrier film adhesive, or so-called transfer adhesive tapes , which may have adhesive with a relatively large adhesive layer thickness, up to a few millimeters, in the middle between two protective films.
- the achievable adhesive strength depends on the material, for example, its surface energy, the wettability and cohesive strength of the respective adhesive class / type of Fügeteil surfaces, also from the The nature (for example, the roughness, porosity, pretreatment and cleanliness) of the adherend surfaces, and the properties of the adhesive itself, such as wettability, viscosity, setting and curing behavior, and finally the application conditions during bonding, such as temperature , Humidity, cleanliness, and adhesive application technology. Only then does the actual joining process take place by bringing together or compressing the parts to be joined.
- spacers for adhesives always represent potential starting points of predetermined breaking points under stress of the adhesive bond.
- the spacers themselves must be homogeneously distributed in the adhesive, and in particular must under no circumstances be agglomerated locally, which can lead to at least low contact pressures to locally larger adhesive gaps and consequently to different adhesive layer thicknesses or even adhesive-free areas.
- adhesives can be solved by spacer the problem of homogeneous adhesive layer thickness for plane-parallel and smooth surfaces usually sufficiently well, and be it in the form of tendentially or clearly oversized minimum adhesive layer thicknesses.
- the present disclosure provides a method of making an adhesive sheet according to claim 1. Furthermore, a use of a 3D printing device for Application of an adhesive according to claim 10 provided, and a method for bonding two joining parts according to claim 12.
- a method for producing an adhesive surface comprises providing an adherend having at least one surface defined as the surface to be adhered; or providing a transfer adhesive carrier having at least one, preferably flat, surface as a carrier of an applied adhesive, and the application of an adhesive to the at least one surface of the joining part or the transfer adhesive carrier by means of a 3D printing device.
- a 3D printing apparatus for applying an adhesive to a surface of a mating member or an area of a transfer adhesive carrier.
- a method for bonding two joining parts comprises the provision of a first joining part with a first surface which is to serve as an adhesive surface; applying an adhesive by means of a 3D printing device to the first surface, or producing by means of a 3D printing device of an adhesive pad or cellophane having at least one surface which is positively shaped to the first surface of the first joining part, and attaching the adhesive pad or cellophane on the first surface, as well as the pressing, preferably fitting, of the second joining part of the first adherend with the applied adhesive, adhesive pad or adhesive layer.
- Embodiments and aspects of the invention make it possible to provide homogeneous adhesive layer thicknesses or adhesive layers with thickness profiles in a novel, simple, rapid and economical manner. This applies in particular to adhesive layers on contoured or structured planes, and also to globally or locally non-planar, one-dimensional or two-dimensional or virtually arbitrarily curved surfaces. It also makes it possible, as with adhesive tapes, to provide a ready-to-use, largely protected against undesired external action, transportable and storable adhesive package which can be provided detachably on an adhesive transfer carrier. BRIEF SUMMARY OF THE FIGURES
- FIG. 1 shows a schematic representation of a joining part with applied adhesive, according to embodiments
- FIG. 2 is a schematic representation of an adhesive transfer carrier with adhesive applied, according to embodiments
- FIG. 3 is a schematic representation of a joining part with applied adhesive, according to embodiments.
- FIG. 4 is a schematic representation of a joining part with applied adhesive and protective layer, according to embodiments.
- FIG. 5 is a schematic representation of an adhesive transfer carrier with applied adhesive and protective layer, according to embodiments.
- FIG. 6 shows a 3D printing device with a joining part to be processed, according to methods and uses according to exemplary embodiments.
- the adhesive employed may be one of the following, or a combination of one or more of the following: a pressure-sensitive adhesive; an intrinsically self-curing adhesive, in particular a two-component adhesive curing by a chemical reaction; an extrinsically curing adhesive, in particular under the action of atmospheric oxygen, air humidity, Curing heat or UV radiation; and an adhesive which cures in a combination of extrinsic and intrinsic factors, in particular a metallic microparticle or nanoparticle-enriched adhesive which is internally heated by external inductive heating and thus cures intrinsically.
- a pressure-sensitive adhesive an intrinsically self-curing adhesive, in particular a two-component adhesive curing by a chemical reaction
- an extrinsically curing adhesive in particular under the action of atmospheric oxygen, air humidity, Curing heat or UV radiation
- an adhesive which cures in a combination of extrinsic and intrinsic factors in particular a metallic microparticle or nanoparticle-enriched adhesive which is internally heated by external inductive heating and thus cures intrinsically.
- the adhesive may be applied with a homogeneous layer thickness over the at least one surface, wherein the layer thickness is preferably from about 5 pm to about 5000 m m.
- the adhesive can be applied to the at least one surface as a 3D adhesive structure, wherein the 3D adhesive structure has at least two, or optionally a plurality, of regions with different layer thicknesses.
- the adhesive may be applied to the at least one surface in a manner that repeats individual, substantially identical 3D adhesive structures, and / or single non-identical 3D adhesive structures occur in combination, or the 3D adhesive structure has an architecture which is at least partially complementary or inverse to the surface shape of the second adherend surface.
- At least one surface has at least one of the following properties: the surface is flat or has at least one flat surface part; the surface is contoured on at least one part, 3D-structured or equipped with 3D surface forms; the surface has a curvature in at least one of a width dimension and a length dimension; and the surface has a defined roughness purposefully produced and / or given by the manufacturing process of the adherend.
- a releasable protective layer may be applied to the adhesive.
- the protective layer may be configured to prevent an extrinsically induced curing process from beginning and / or premature degradation or contamination of the adhesive.
- the protective layer can be printed or sprayed about on the adhesive.
- it may be silica gel-based, for forming SiO 2 protective layers, or a synthetic resin paint such as, for example, an acrylic paint, as a non-limiting example.
- a 3D printing device is used to apply the adhesive. This can work about the inkjet principle or from fed an endless strand.
- the 3D printing device serves to apply the adhesive to a surface of a joining part or to a surface of a transfer adhesive carrier.
- the adhesive layer or 3D adhesive structure produced using the 3D printing device may be detached from the adherend or transfer adhesive carrier after it is formed. After one, depending on the Fagerlub of the adhesive, and almost any length of time or duration Fager the adhesive layer or 3D adhesive structure is then added again to one of the two joining parts before the gluing process.
- the detached adhesive layer or the 3D adhesive structure represents a transportable and storable adhesive container.
- the adhesive after application by the 3D printing device, may have a substantially homogeneous layer thickness over the surface, the layer thickness preferably being from about 5 pm to about 5000 m, more typically from about 10 pm to about 500 pm.
- a 3D adhesive structure may be provided which has at least two, optionally a plurality, of regions with different layer thicknesses and geometric features.
- an adhesive inlay or adhesive pad is made by methods and uses in accordance with the aspects and / or embodiments described herein.
- Embodiments relate, inter alia, to a method for producing an adhesive surface on a joining part 15.
- An exemplary joining part 15 with an adhesive surface produced in this way is shown in FIG. 1.
- the joining part 15 has at least one surface 16 which is defined as the surface to be bonded (after the adhesive surface has been produced), ie is glued to a second joining part at a later time.
- the adhesive 30 is applied or applied to the surface 16 of the joining part 15 by means of a 3D printing device (not shown, see FIG. 6).
- the applied adhesive 30 may be selected from a variety of adhesive types. These typically include, for example, a pressure-sensitive adhesive and an intrinsically self-curing adhesive.
- the latter may in particular be a two-component adhesive (2K) curing by a chemical reaction.
- extrinsically curing adhesives are provided which can cure in particular under the action of atmospheric oxygen, air humidity, heat or UV radiation.
- Learners are, according to embodiments, possible adhesives that cure in a combination of extrinsic and intrinsic Laktoren. This includes, for example, as a non-limiting example, an enriched with metallic micro- or nanoparticles adhesive, which is heated by external inductive heating (the particles) from the inside by an electromagnetic field and thus hardens intrinsically.
- the adhesive 30 is applied with a homogeneous layer thickness on the surface 16.
- Typical layer thicknesses are in the range of about 5 pm to about 5000 pm, more typically in the range of about 10 pm to about 500 pm. In the simplest application, this means that a flat homogeneous thick layer of the adhesive 30 is applied to a flat or planar surface 16.
- the adhesive 30 is applied with the aid of the 3D printing device so that a 3D adhesive structure 33 is formed on the surface 16.
- a 3D adhesive structure 33 has at least two or more regions with different layer thicknesses.
- several examples of 3D adhesive structures 33 are shown, each having a layer thickness profile (in the direction parallel to the surface 16) and thus have a plurality of different layer thicknesses.
- the adhesive 30 may be applied to the at least one surface 16 such that various individual, i. separate adhesive structures 33 result.
- the created 3D adhesive structure 33, 33a, 33b, 33c has an architecture that is at least partially complementary to the surface shape of a surface of a second luting portion (not shown) to be adhered to the first luting portion 15.
- Lig. 2 the result of a similar manufacturing process for an adhesive surface as shown in Lig. 1, but wherein the carrier of the adhesive is not a lug 15 as in
- the applied 3D adhesive structure 33, 33a, 33b, 33c may have identical 3D adhesive structures 33a, 33b, 33c that repeat like the adhesive structure 33a in Fig. 2.
- the adhesive structure itself has repetitive elements.
- These and other adhesive fabric structures can be arbitrarily combined with each other according to embodiments, so that individual, non-identical 3D adhesive structures (in cross section) are adjacent to each other, or can be combined with repeating, or repeating elements having adhesive structures. It will be readily apparent to those skilled in the art that in this manner, highly variable, varied 3D adhesive structures with individual and / or repetitive elements can be created that go beyond the examples shown herein and are considered to fall within the scope of the present disclosure.
- the surface 16 of the joining part 15 may also be non-planar, unlike in Figs. 1 and 2 shown.
- the surface 16 may have at least one of the following properties: the surface is flat (see FIGS. 1 and 2) or has at least planar surface parts; the surface is contoured on at least one part, 3D-structured or equipped with 3D surface forms; the surface has a curvature s running in at least one of a width dimension and a catch dimension; and / or the surface has a defined, selectively produced or given by the manufacturing process of the joining part roughness.
- a homogeneous layer thickness of an adhesive 30 is combined with a 3D adhesive structure 33.
- a releasable protective layer 45 may be additionally applied to the adhesive 30, as shown in Fig. 4.
- the protective layer 45 is designed to prevent an extrinsically induced curing process from beginning and / or premature degradation or contamination of the adhesive 30 from occurring.
- the protective layer 45 may be printed or sprayed onto the adhesive 30, for example, or applied by dipping.
- the protective layer 45 may comprise, for example, a synthetic resin varnish, as a non-limiting example such as an acrylic varnish, or based on silica gel, to form SiO 2 protective layers.
- the produced adhesive material layer or 3D adhesive structure 33 may be detached after its production of the joining part 15 or the transfer adhesive carrier 25, and be applied before the gluing process again on the first joining part 15 or a second joining part, preferably one inversely shaped to the first surface 15 Has surface.
- the detached adhesive layer or the 3D adhesive structure 33 may also represent a long-term transportable and storable adhesive container.
- an additional protective layer 45 can also be dispensed with.
- a protective layer 45 may be expedient, if necessary detaching from an adherend 15 also a protective layer 45 on both sides of the adhesive layer.
- a method of bonding two joining parts comprises, for example: providing a first joining part 15 with a first surface 16 which is to serve as an adhesive surface; the application of an adhesive 30 by means of a 3D printing device 40 on the first surface 16, or manufacture by means of a 3D printing device 40 of a Klebepads 50 or Klebeinlays 52, which has at least one surface which forms a form fit to the first surface 16 of the first joining part 15 is. Subsequently, the adhesive pad 50 or Klebeinlay 52 is attached to the first surface 16. This is followed by the exact fitting of the second joining part to the first joining part 15 with the applied adhesive 30, adhesive pad 50 or adhesive layer 52.
- Embodiments also relate to the adhesive inlays or adhesive pads produced by methods according to embodiments. These can be obtained by deducting the adhesive application from the joining part 16 or from the transfer adhesive carrier 25, wherein the adhesive pads and adhesive pads are removed, for example, from a joining part 15 as in FIG. 1 or a transfer adhesive carrier 25 as in FIG can.
- the 3D printing device 40 used in and according to embodiments, as shown in Fig. 6, operate on the inkjet principle or fed by an endless strand.
- the type or type of adhesive that can be used depends on the type of 3D printing device, or the type of device can be selected or designed, inter alia, as a function of the adhesive to be used.
- the 3D printing device 40 typically includes at least one printhead 41, typically electromechanically guided, which applies the adhesive to the adherend 15 or the transfer adhesive carrier 25 (not shown in FIG. 6 for illustrative purposes).
- the properties of the adhesive or the components of the adhesive can have a significant impact, such as when the mixture of the adhesive "on demand” or in real time when printing is or is to be made.
- the viscosity and the pot life of the adhesive play a role. The same applies mutatis mutandis to the imprint of any protective layers, for example based on silica gels to form SiO 2 protective layers.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017131236.6A DE102017131236A1 (en) | 2017-12-22 | 2017-12-22 | METHOD FOR PRODUCING ADHESIVE SURFACES BY MEANS OF A 3D PRINTING DEVICE |
PCT/EP2018/081766 WO2019120818A1 (en) | 2017-12-22 | 2018-11-19 | Method for producing adhesive-bonding surfaces by means of a 3d printing device |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3728501A1 true EP3728501A1 (en) | 2020-10-28 |
Family
ID=64426910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18807274.8A Withdrawn EP3728501A1 (en) | 2017-12-22 | 2018-11-19 | Method for producing adhesive-bonding surfaces by means of a 3d printing device |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3728501A1 (en) |
DE (1) | DE102017131236A1 (en) |
WO (1) | WO2019120818A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230312993A1 (en) * | 2020-10-07 | 2023-10-05 | Lohmann Gmbh & Co. Kg | Geometrically defined pressure-sensitive adhesive film |
WO2022073608A1 (en) * | 2020-10-07 | 2022-04-14 | Lohmann Gmbh & Co. Kg | Geometrically defined pressure-sensitive adhesive film |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10205761B4 (en) * | 2002-02-12 | 2010-02-04 | Fujitsu Siemens Computers Gmbh | Arrangement for attaching a component to a housing by means of an adhesive connection |
DE102010001987A1 (en) * | 2010-02-16 | 2011-08-18 | Evonik Röhm GmbH, 64293 | Functional materials with reversible crosslinking |
DE102013109755A1 (en) * | 2013-09-06 | 2015-03-12 | Rent A Scientist Gmbh | Conductive adhesive |
DE102016211465A1 (en) * | 2016-06-27 | 2017-12-28 | Robert Bosch Gmbh | 3D printing system and 3D printing device |
DE102017115201A1 (en) * | 2017-07-07 | 2018-07-19 | Schaeffler Technologies AG & Co. KG | Hot melt adhesive and method of applying a hot melt adhesive to a surface of an electronic component |
-
2017
- 2017-12-22 DE DE102017131236.6A patent/DE102017131236A1/en active Pending
-
2018
- 2018-11-19 WO PCT/EP2018/081766 patent/WO2019120818A1/en unknown
- 2018-11-19 EP EP18807274.8A patent/EP3728501A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE102017131236A1 (en) | 2019-06-27 |
WO2019120818A1 (en) | 2019-06-27 |
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