EP3699321A1 - Verfahren zur herstellung einer kupfermetallschicht auf nichtmetallischem material - Google Patents

Verfahren zur herstellung einer kupfermetallschicht auf nichtmetallischem material Download PDF

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Publication number
EP3699321A1
EP3699321A1 EP19157906.9A EP19157906A EP3699321A1 EP 3699321 A1 EP3699321 A1 EP 3699321A1 EP 19157906 A EP19157906 A EP 19157906A EP 3699321 A1 EP3699321 A1 EP 3699321A1
Authority
EP
European Patent Office
Prior art keywords
carbon
plating
inks
based electroless
metallic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19157906.9A
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English (en)
French (fr)
Inventor
Kuanlin KU
Jia-Cing Chen
Kuo-Hsin Chang
Chung- Ping Lai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BGT Materials Ltd
Original Assignee
BGT Materials Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BGT Materials Ltd filed Critical BGT Materials Ltd
Priority to EP19157906.9A priority Critical patent/EP3699321A1/de
Publication of EP3699321A1 publication Critical patent/EP3699321A1/de
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Definitions

  • the present invention relates to a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • a method of plating non-metallic material contains steps of: surface pretreating and metal plating, such as cleaning, etching, sensitizing, activating, and accelerating.
  • the strong oxidants (chromium trioxide) and sulfuric acid mixture are applied for surface roughness to obtain mechanical adhesion and to produce pores for adhering positions of a metal plate and a substrate.
  • the non-metallic material is a mixture of chromium trioxide, sulfuric acid, and water.
  • the non-metallic material is a mixture of inorganic substance and phosphate.
  • toxic carcinogen such as hexavalent chromium.
  • the hexavalent chromium causes environmental pollution.
  • electroless plating also known as chemical or auto-catalytic plating
  • chemical or auto-catalytic plating is a non-galvanic plating method that involves several simultaneous reactions in an aqueous solution, which occur without the use of external electrical power. It is mainly different from electroplating by not using external electrical power.
  • electroless plating is used to form the conductive part of plated through holes.
  • the non-conductive part is treated with palladium catalyst and then made conductive by electroless copper plating.
  • Stable catalysts for electroless metallization is disclosed in EP 2559486A1 , the catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
  • a report is disclosed in [ Science 318 (2007) 426 ] regarding a electroless plating adapted for copper or silver, wherein a non-metallic catalyst (such as polydopamine) is employed in the electroless plating.
  • EP 2712885A1 taught a method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described.
  • the method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.
  • A an amine compound having at least two functional groups, where at least one of the functional groups is an amino group
  • B an aromatic compound having at least one hydroxyl group on the aromatic ring.
  • US20160168715A1 discloses that aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ⁇ m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. But this method takes 24 hours in polymerization. Furthermore, a PH range of dopamine in polymerization is 6.5 to 9.5, thus reducing self - polymerization rate of dopamine.
  • the present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
  • the primary objective of the present invention is to provide a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • a method of forming copper metal layer on a non-metallic material provided by the present invention contains steps:
  • the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth.
  • the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent
  • the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt% to 50 wt% of the oxygen-functional carbon powders.
  • a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt% to 30 wt% of the oxygen-functional carbon powders
  • a content of the dispersant is 0.05 wt% to 20 wt% of the mixture of the carbon-based electroless-plating inks
  • a content of the solvent is 30 wt% to 90 wt% of the mixture of the carbon-based electroless-plating inks.
  • the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt% to 20 wt% of the functional carbon powder material.
  • the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
  • the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt% to 30 wt% of the carbon-based electroless-plating inks.
  • the dispersant is ionic dispersant or nonionic dispersant
  • the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.
  • a method of forming a copper metal layer on a non-metallic material according to the present invention comprises steps:
  • the carbon-based electroless-plating inks 10 are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent.
  • the functional carbon powder material consists of oxygen-functional carbon powders, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
  • An oxygen content of the oxygen-functional carbon powders is 5 wt% to 50 wt% of the oxygen-functional carbon powders.
  • a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt% to 30 wt% of the oxygen-functional carbon powders.
  • a content of the dispersant is 0.05 wt% to 20 wt% of the mixture of the carbon-based electroless-plating inks, wherein the dispersant is ionic dispersant or nonionic dispersant.
  • the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent, and a content of the solvent is 30 wt% to 90 wt% of the mixture of the carbon-based electroless-plating inks.
  • the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus.
  • a content of the oxygen-functional carbon powders is 1 wt% to 20 wt% of the functional carbon powder material.
  • the carbon-based electroless-plating inks 10 further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder.
  • a content of the adhesive is 0.1 wt% to 30 wt% of the carbon-based electroless-plating inks 10.
  • the binder is added with the polymer or the resin.
  • the oxygen-functional carbon powders are graphene flakes or graphene oxides
  • the adhesive is not the polymer or the resin.
  • a content of the thicker is 0.01 wt% to 10 wt% of the carbon-based electroless-plating inks 10.
  • the carbon-based electroless-plating inks 10 are baked in a temperature of 100 °C for 20 minutes, and the carbon-based electroless-plating inks 10 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 °C to 70 °C for 30 minutes to 120 minutes, thus obtaining copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the first embodiment of FIG. 3B .
  • the non-metallic material 20 is the ceramic
  • the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20
  • the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 °C to 70 °C for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the second embodiment of FIG. 4B .
  • the non-metallic material 20 is the wood
  • the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20
  • the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50 °C to 70 °C for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the third embodiment of the second embodiment of FIG. 5B .
  • the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
EP19157906.9A 2019-02-19 2019-02-19 Verfahren zur herstellung einer kupfermetallschicht auf nichtmetallischem material Withdrawn EP3699321A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19157906.9A EP3699321A1 (de) 2019-02-19 2019-02-19 Verfahren zur herstellung einer kupfermetallschicht auf nichtmetallischem material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19157906.9A EP3699321A1 (de) 2019-02-19 2019-02-19 Verfahren zur herstellung einer kupfermetallschicht auf nichtmetallischem material

Publications (1)

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EP3699321A1 true EP3699321A1 (de) 2020-08-26

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2388355A1 (de) * 2010-05-18 2011-11-23 Samsung Electronics Co., Ltd. Harzbeschichtungsverfahren mit Graphendünnschicht
EP2559486A1 (de) 2011-08-17 2013-02-20 Rohm and Haas Electronic Materials, L.L.C. Stabile Katalysatoren für stromlose Metallisierung
EP2712885A1 (de) 2012-09-30 2014-04-02 Rohm and Haas Electronic Materials LLC Verfahren zur stromlosen Metallisierung
US20160168715A1 (en) 2014-12-11 2016-06-16 The Research Foundation For The State University Of New York Electroless copper plating polydopamine nanoparticles
WO2018186804A1 (en) * 2017-04-04 2018-10-11 Nanyang Technological University Plated object and method of forming the same
CN109295440A (zh) * 2017-07-25 2019-02-01 Bgt材料有限公司 无电镀触媒和使用该触媒在基材表面形成铜金属层的方法
WO2019099061A1 (en) * 2017-11-15 2019-05-23 Nanotek Instruments, Inc. Graphene-mediated metal-plated polymer article and production method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2388355A1 (de) * 2010-05-18 2011-11-23 Samsung Electronics Co., Ltd. Harzbeschichtungsverfahren mit Graphendünnschicht
EP2559486A1 (de) 2011-08-17 2013-02-20 Rohm and Haas Electronic Materials, L.L.C. Stabile Katalysatoren für stromlose Metallisierung
EP2712885A1 (de) 2012-09-30 2014-04-02 Rohm and Haas Electronic Materials LLC Verfahren zur stromlosen Metallisierung
US20160168715A1 (en) 2014-12-11 2016-06-16 The Research Foundation For The State University Of New York Electroless copper plating polydopamine nanoparticles
WO2018186804A1 (en) * 2017-04-04 2018-10-11 Nanyang Technological University Plated object and method of forming the same
CN109295440A (zh) * 2017-07-25 2019-02-01 Bgt材料有限公司 无电镀触媒和使用该触媒在基材表面形成铜金属层的方法
WO2019099061A1 (en) * 2017-11-15 2019-05-23 Nanotek Instruments, Inc. Graphene-mediated metal-plated polymer article and production method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SCIENCE, vol. 318, 2007, pages 426

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