US20190145008A1 - Method of forming copper metal layer on non-metallic material - Google Patents

Method of forming copper metal layer on non-metallic material Download PDF

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Publication number
US20190145008A1
US20190145008A1 US16/244,303 US201916244303A US2019145008A1 US 20190145008 A1 US20190145008 A1 US 20190145008A1 US 201916244303 A US201916244303 A US 201916244303A US 2019145008 A1 US2019145008 A1 US 2019145008A1
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Prior art keywords
carbon
plating
inks
based electroless
metallic material
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Abandoned
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US16/244,303
Inventor
Kuanlin KU
Jia-Cing Chen
Kuo-Hsin CHANG
Chung-Ping Lai
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BGT Materials Ltd
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BGT Materials Ltd
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Priority claimed from US15/688,059 external-priority patent/US20190069414A1/en
Application filed by BGT Materials Ltd filed Critical BGT Materials Ltd
Priority to US16/244,303 priority Critical patent/US20190145008A1/en
Publication of US20190145008A1 publication Critical patent/US20190145008A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Definitions

  • the present invention relates to a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • a method of plating non-metallic material contains steps of: surface pretreating and metal plating, such as cleaning, etching, sensitizing, activating, and accelerating.
  • the strong oxidants (chromium trioxide) and sulfuric acid mixture are applied for surface roughness to obtain mechanical adhesion and to produce pores for adhering positions of a metal plate and a substrate.
  • the non-metallic material is a mixture of chromium trioxide, sulfuric acid, and water.
  • the non-metallic material is a mixture of inorganic substance and phosphate.
  • toxic carcinogen such as hexavalent chromium.
  • the hexavalent chromium cause environmental pollution.
  • the present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
  • the primary objective of the present invention is to provide a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • a method of forming copper metal layer on a non-metallic material provided by the present invention contains steps:
  • the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth.
  • the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent
  • the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.
  • a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders
  • a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks
  • a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.
  • the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.
  • the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
  • the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks.
  • the dispersant is ionic dispersant or nonionic dispersant
  • the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.
  • FIG. 1 is a flow chart of a method of forming a copper metal layer on a non-metallic material according to the present invention.
  • FIG. 2-1 is a cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.
  • FIG. 2-2 is another cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.
  • FIG. 3A is a schematic view showing a sample A of a first embodiment of the present invention.
  • FIG. 3B is a schematic view showing a sample B of the first embodiment of the present invention.
  • FIG. 4A is a schematic view showing a sample A of a second embodiment of the present invention.
  • FIG. 4B is a schematic view showing a sample B of the second embodiment of the present invention.
  • FIG. 5A is a schematic view showing a sample A of a third embodiment of the present invention.
  • FIG. 5B is a schematic view showing a sample B of the third embodiment of the present invention.
  • a method of forming a copper metal layer on a non-metallic material according to the present invention comprises steps:
  • the non-metallic material 20 is any one of plastic, ceramic, wood, glass, and cloth;
  • the carbon-based electroless-plating inks 10 are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent.
  • the functional carbon powder material consists of oxygen-functional carbon powders, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
  • An oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.
  • a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders.
  • a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, wherein the dispersant is ionic dispersant or nonionic dispersant.
  • the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.
  • the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus.
  • a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.
  • the carbon-based electroless-plating inks 10 further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder.
  • a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks 10 .
  • the binder is added with the polymer or the resin.
  • the oxygen-functional carbon powders are graphene flakes or graphene oxides
  • the adhesive is not the polymer or the resin.
  • a content of the thicker is 0.01 wt % to 10 wt % of the carbon-based electroless-plating inks 10 .
  • the carbon-based electroless-plating inks 10 are baked in a temperature of 100° C. for 20 minutes, and the carbon-based electroless-plating inks 10 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining copper deposition on the carbon-based electroless-plating inks 10 , as shown in a sample B of the first embodiment of FIG. 3B .
  • the non-metallic material 20 is the ceramic
  • the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20
  • the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10 , as shown in a sample B of the second embodiment of FIG. 4B .
  • the non-metallic material 20 is the wood
  • the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20
  • the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10 , as shown in a sample B of the third embodiment of the second embodiment of FIG. 5B .
  • the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.

Abstract

A method of forming a copper metal layer on a non-metallic material contains: a. providing a carbon-based electroless-plating inks; b. spraying the carbon-based electroless-plating inks on the non-metallic material; c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution. Thereby, the copper metal layer is formed on the carbon-based electroless-plating inks of the non-metallic material.

Description

    BACKGROUND OF THE INVENTION
  • This application is a Continuation-in-Part of application Ser. No. 15/688,059, filed on 28 AUG 2017.
    • FIELD OF THE INVENTION
  • The present invention relates to a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
    • BACKGROUND OF THE INVENTION
  • A method of plating non-metallic material contains steps of: surface pretreating and metal plating, such as cleaning, etching, sensitizing, activating, and accelerating. The strong oxidants (chromium trioxide) and sulfuric acid mixture are applied for surface roughness to obtain mechanical adhesion and to produce pores for adhering positions of a metal plate and a substrate.
  • The non-metallic material is a mixture of chromium trioxide, sulfuric acid, and water. Alternatively, the non-metallic material is a mixture of inorganic substance and phosphate. However, in producing the mixture of the non-metallic material, it is easy to cause toxic carcinogen, such as hexavalent chromium. Furthermore, the hexavalent chromium cause environmental pollution.
  • The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
    • SUMMARY OF THE INVENTION
  • The primary objective of the present invention is to provide a method of forming copper metal layer on a non-metallic material by which the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • To obtain above-mentioned objectives, a method of forming copper metal layer on a non-metallic material provided by the present invention contains steps:
  • a. providing a carbon-based electroless-plating inks;
  • b. spraying the carbon-based electroless-plating inks on the non-metallic material;
  • c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and
  • d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution so as to form the copper metal layer on the carbon-based electroless-plating inks of the non-metallic material.
  • Preferably, the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth.
  • Preferably, the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent
  • Preferably, the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.
  • Preferably, a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders, a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.
  • Preferably, the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.
  • Preferably, the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
  • Preferably, the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks.
  • Preferably, the dispersant is ionic dispersant or nonionic dispersant, and the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a flow chart of a method of forming a copper metal layer on a non-metallic material according to the present invention.
  • FIG. 2-1 is a cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.
  • FIG. 2-2 is another cross sectional view showing the copper metal layer on the non-metallic material according to the present invention.
  • FIG. 3A is a schematic view showing a sample A of a first embodiment of the present invention.
  • FIG. 3B is a schematic view showing a sample B of the first embodiment of the present invention.
  • FIG. 4A is a schematic view showing a sample A of a second embodiment of the present invention.
  • FIG. 4B is a schematic view showing a sample B of the second embodiment of the present invention.
  • FIG. 5A is a schematic view showing a sample A of a third embodiment of the present invention.
  • FIG. 5B is a schematic view showing a sample B of the third embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • With reference to FIG. 1, a method of forming a copper metal layer on a non-metallic material according to the present invention comprises steps:
  • a. providing a carbon-based electroless-plating inks 10;
  • b. spraying or printing the carbon-based electroless-plating inks 10 on the non-metallic material 20, as shown in FIG. 2-1, wherein the non-metallic material 20 is any one of plastic, ceramic, wood, glass, and cloth;
  • c. dry spraying the carbon-based electroless-plating inks 10 on the non-metallic material 20; and
  • d. dipping the non-metallic material 20 on which the carbon-based electroless-plating inks 10 dry sprayed in an electroless plating solution so as to form a copper metal layer 30 on the carbon-based electroless-plating inks 10 of the non-metallic material 20, as shown in FIG. 2-2.
  • Preferably, the carbon-based electroless-plating inks 10 are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent. Preferably, the functional carbon powder material consists of oxygen-functional carbon powders, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon. An oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.
  • A content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders.
  • A content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, wherein the dispersant is ionic dispersant or nonionic dispersant.
  • The solvent is any one of organic solvent, inorganic solvent, and aqueous solvent, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.
  • The oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus. A content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.
  • Preferably, the carbon-based electroless-plating inks 10 further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder. A content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks 10. Preferably, when the adhesive is made of the polymer or the resin, the binder is added with the polymer or the resin. Preferably, when the oxygen-functional carbon powders are graphene flakes or graphene oxides, the adhesive is not the polymer or the resin. A content of the thicker is 0.01 wt % to 10 wt % of the carbon-based electroless-plating inks 10.
  • Referring to FIG. 3A, in a first sample A of a first embodiment, the carbon-based electroless-plating inks 10 are baked in a temperature of 100° C. for 20 minutes, and the carbon-based electroless-plating inks 10 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the first embodiment of FIG. 3B.
  • Referring to FIG. 4A, in a first sample A of a second embodiment, the non-metallic material 20 is the ceramic, the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20, the non-metallic material 20 on which the carbon-based electroless-plating inks 10 are baked in a temperature 100° C. for 20 minutes, and the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the second embodiment of FIG. 4B.
  • Referring to FIG. 5A, in a first sample A of a third embodiment, the non-metallic material 20 is the wood, the carbon-based electroless-plating inks 10 are sprayed on the non-metallic material 20, the non-metallic material 20 on which the carbon-based electroless-plating inks 10 are baked in a temperature 100° C. for 20 minutes, and the non-metallic material 20 are plating bathed in formaldehyde-based electroless plating solution in a temperature of 50° C. to 70° C. for 30 minutes to 120 minutes, thus obtaining even copper deposition on the carbon-based electroless-plating inks 10, as shown in a sample B of the third embodiment of the second embodiment of FIG. 5B.
  • Thereby, the copper metal layer is formed on a variety of non-metallic materials at a low cost, quickly, and environmentally friendly.
  • While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.

Claims (9)

What is claimed is:
1. A method of forming a copper metal layer on a non-metallic material comprising:
a. providing a carbon-based electroless-plating inks;
b. spraying the carbon-based electroless-plating inks on the non-metallic material;
c. dry spraying the carbon-based electroless-plating inks on the non-metallic material; and
d. dipping the non-metallic material on which the carbon-based electroless-plating inks dry sprayed in an electroless plating solution so as to form the copper metal layer on the carbon-based electroless-plating inks of the non-metallic material.
2. The method as claimed in claim 1, wherein the non-metallic material is any one of plastic, ceramic, wood, glass, and cloth.
3. The method as claimed in claim 1, wherein the carbon-based electroless-plating inks are a mixture of functional carbon powder material, a dispersant, a thicker, and a solvent
4. The method as claimed in claim 3, wherein the functional carbon powder material consists of oxygen-functional carbon powders, an oxygen content of the oxygen-functional carbon powders is 5 wt % to 50 wt % of the oxygen-functional carbon powders.
5. The method as claimed in claim 4, wherein a content of the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks is 0.5 wt % to 30 wt % of the oxygen-functional carbon powders, a content of the dispersant is 0.05 wt % to 20 wt % of the mixture of the carbon-based electroless-plating inks, and a content of the solvent is 30 wt % to 90 wt % of the mixture of the carbon-based electroless-plating inks.
6. The method as claimed in claim 3, wherein the oxygen-functional carbon powders of the mixture of the carbon-based electroless-plating inks are any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), phosphorus (P), and a mixture of nitrogen, sulfur, boron, fluorine, and phosphorus, wherein a content of the oxygen-functional carbon powders is 1 wt % to 20 wt % of the functional carbon powder material.
7. The method as claimed in claim 4, wherein the oxygen-functional carbon powders are oxide consisting of any one of graphene, graphite, carbon nanotubes, carbon black, and activated carbon.
8. The method as claimed in claim 3, wherein the carbon-based electroless-plating inks further consist of adhesive made any one of polymer, resin, and binder or a mixture of the polymer, the resin, and the binder, wherein a content of the adhesive is 0.1 wt % to 30 wt % of the carbon-based electroless-plating inks.
9. The method as claimed in claim 3, wherein the dispersant is ionic dispersant or nonionic dispersant, and the solvent is any one of organic solvent, inorganic solvent, and aqueous solvent.
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