EP3606700A1 - Poliermaschine und verfahren zum polieren von lichtwellenleitern - Google Patents
Poliermaschine und verfahren zum polieren von lichtwellenleiternInfo
- Publication number
- EP3606700A1 EP3606700A1 EP17718842.2A EP17718842A EP3606700A1 EP 3606700 A1 EP3606700 A1 EP 3606700A1 EP 17718842 A EP17718842 A EP 17718842A EP 3606700 A1 EP3606700 A1 EP 3606700A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing
- plate
- dry ice
- machine according
- polishing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B19/226—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground of the ends of optical fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/18—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions
- B24C3/20—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions the work being supported by turntables
- B24C3/22—Apparatus using nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
Definitions
- the invention relates to a polishing machine and a method for polishing optical fibers, comprising a polishing plate with a connector receptacle for holding a plug with an optical waveguide, a polishing table for receiving a polishing agent, a positioning device for Relativpo sitioning of the polishing plate and the polishing table between a polishing position and a Einrichtposition, and a driving device for performing a relative polishing movement between the polishing tables and the polishing pickup in the polishing position.
- polishing machines and methods are well known and are regularly used for polishing optical waveguides or one end of an optical fiber of an optical waveguide.
- the end of the optical fiber is received in a connector or plug for releasable connection of optical fibers or fiber optic cables.
- These connectors are used to form a male-to-male connection or a male-female connection of optical fibers.
- the plug should have the lowest possible signal attenuation and a high return loss, which is why the ends of the respective optical fibers, optionally together with the j e election connector ends, are polished.
- the known polishing machines always have a polishing plate forming a polishing holder with fixing devices for the detachable fastening of plugs.
- An attached to an optical fiber connector can be releasably secured by means of the fixing device to the polishing plate in a defined position, wherein during polishing, the polishing plate is arranged and moved relative to an abrasive layer of the polishing device.
- the abrasive layer may be a polishing agent disposed on a polishing table of the polishing machine.
- the polishing agent may be a paper or plastic web or a sheet having abrasive particles thereon.
- the end of the optical fiber in the plug then comes into contact with an abrasive layer on the polishing table and is polished by the relative movement of the polishing plate, regularly with the addition of a Spülflüs fluid.
- the rinsing liquid is used inter alia for cooling the optical waveguide or plug and prevents rapid wear of the polishing agent or the abrasive layer by residues of abrasion of the plug and the optical waveguide, ensures removal of detached from the abrasive layer abrasive particles and verbes sert so a quality polished surface of an optical waveguide.
- this can hold a plurality of plugs on a polishing plate in order to polish them at the same time and thus be able to carry out a polishing process economically.
- the polishing plate can therefore also a plurality of plug receptacles with through holes for receiving an optical fiber or.
- a plug may be formed with an optical fiber of an optical waveguide.
- a polishing machine is first set up in such a way that a number of plugs are manually fastened to a polishing plate by means of a respective optical waveguide, wherein a polishing pad is attached to a polishing pad
- Polishing a abrasive polishing or polishing film or web with abrasive particles, optionally with a polishing plate made of rubber as a support A person operating the polishing machine then wets the polishing table or the polishing agent thereon manually with Spülflüs liquid.
- the polishing operation may be performed such that the polishing machine transfers the polishing plate from the set-up position to a polishing position via a positioning device in which the fiber ends or the polishing table are moved relative to the polishing plate by means of a drive device a polishing movement of the fiber ends is performed on the polishing table with the polishing film.
- the polishing table is transferred to the setting position, and the polishing agent or the polishing film with abrasive particles on the polishing table is manually replaced. Since the plugs or fiber ends and the polishing table are contaminated with polishing residues or dirty Spülflüs fluid, the polishing plate and the polishing table is regularly wiped by the operator with a rag, in particular to prevent larger abrasive particles remain at the plug ends, and thus a clean and level bearing surface is available on the polishing table. Subsequently, in turn, a polishing plate with a polishing agent with finer abrasive grains is placed manually on the polishing table and, after an addition of rinsing liquid, a polishing process is triggered again.
- This polishing process is repeated several times, whereby always a polishing agent with comparatively finer abrasive grains, relative to a previous polishing process, is used. Also, a hardness of the polishing plate can be varied. Therefore, a change of the polishing agent, a wiping of the polishing plate and the polishing table and an addition of Spülflüs fluidity always takes place between the respective polishing operations in Einrichtpo position.
- the present invention is therefore based on the object, a
- Polishing machine and a method for polishing optical waveguides to propose which allows a polishing of optical fibers with low cost and high quality.
- the polishing machine for polishing optical waveguides comprises a polishing plate having a connector receptacle for holding a connector with an optical waveguide, a polishing table for receiving a polishing agent, a positioning device for relative positioning of the polishing plate and the polishing table between a polishing position and a setup position, and a drive device for performing a relative polishing movement between the polishing table and the polishing pad in the polishing position, the polishing machine having a cleaning device for applying dry ice to the polishing table and / or to the polishing plate.
- the cleaning device of the polishing machine makes it possible to carry out a substantially residue-free cleaning of the polishing table and / or the polishing plate.
- the dry ice polishes and other contaminants located on the polishing table or on the polishing plate such as Sachö ste particles of the polishing agent or material residues or abrasion of the plug and the optical waveguide of the polishing agent itself, the polishing table and / or the polishing plate or the relevant plugs, easily removed.
- the cleaning device applies the dry ice to the respective surfaces, wherein the dry ice on the surface in question sublimated due to the much higher temperature of the surface, and due to a volume expansion in the transition to the gaseous phase any impurities are removed and eliminated.
- the dry ice can consist of solid particles of carbon dioxide (C0 2 ). In particular, the solid particles may be crystals. The dry ice can also be so-called C0 2 snow.
- the dry ice can then be applied by means of a compressed air jet at a temperature of -78, 9 ° C on the surfaces to be cleaned.
- a layer formed from impurities on the relevant surface is then locally cooled and embrittled.
- the solid particles of the carbon dioxide penetrate into the layer and sublimate, so that a volume of the carbon dioxide increased as a result of the transition into the gaseous phase breaks up the layer and explosively ablö from the surface in question.
- the carbon dioxide volatilizes in gaseous form in an ambient air. Damage to surfaces does not occur because the dry ice is comparatively soft.
- the cleaning device can have an application nozzle for dry ice, wherein a directed core jet of solid C0 2 " particles and a jacket jet coaxially surrounding the core jet can be formed from the compressed air by means of the application nozzle of liquid carbon dioxide and compressed air to act as a nozzle, which is supplied centrally with liquid carbon dioxide, which is then discharged to an environment via a central nozzle orifice, and around the nozzle orifice an annular gap for the discharge of compressed air can be formed formed jacketed jet entrains the FLÜS SiGe carbon dioxide, which will freeze at its expansion by means of the nozzle and converted into C0 2 "particles or crystals.
- the sheath beam can then direct the core stream onto a surface focus Sieren, that is collimated and directed at the surface.
- the jet stream can also be used to remove dissolved impurities into an environment, while the jacket jet can alternatively be formed with nitrogen (N 2 )
- the handling device may be formed, for example, in the manner of a single or multi-articulated arm, the position of the application nozzle in the Einrichtpo position in a gap between the polishing table and the polishing plate positioned. Thus, it can also be provided that the handling device moves the application nozzle along surfaces of the polishing table and / or the polishing plate, so that the relevant surface can then be completely cleaned.
- the handling device moves the application nozzle so that first the polishing table and subsequently the polishing plate or vice versa is cleaned. After cleaning, the handling device can then remove the application nozzle again from the intermediate space, so that the polishing table and the polishing plate can be moved into the polishing position relative to each other.
- the cleaning device has a plurality of application nozzles. Then it becomes possible to clean larger surfaces in a shorter time. For example, then also, the polishing table and the polishing plate are cleaned simultaneously when the application nozzles are arranged with acting in opposite directions core jets.
- the application nozzles can be arranged, for example, in a row arrangement, so that a surface can be cleaned particularly effectively. If the cleaning device comprises a handling device, the application nozzles can then be arranged on this.
- the cleaning device may comprise a nozzle arrangement formed from application nozzles, wherein the application nozzles may be arranged adjacent and outside an edge of the polishing table and / or the polishing plate and aligned with a respective cleaning beam on a surface of the polishing table and / or the polishing plate.
- the nozzle arrangement may be formed alone or in combination with a handling device, with further application nozzles.
- the nozzle arrangement may be formed by the application nozzles being arranged equidistantly adjacent to the edge along a circumference of the polishing table and / or the polishing plate.
- the j e fraud cleaning jet of the application nozzles within a space between the polishing table and the polishing plate in the Einrichtpo position and be directed to the surface of the polishing table and / or the polishing plate, the s radiate the surface substantially of the j eterrorism cleaning is completely cleanable.
- the application nozzles which are then arranged annularly around the polishing table and / or the polishing plate are moved along the edge, ie radially, or to be pivoted axially.
- a rotation of the polishing table and / or the polishing plate during a cleaning process can take place in order to completely clean the j eshu surface with the cleaning jets.
- a through hole may be formed, through which the dry ice by means of the cleaning device on the Polishing table can be siert.
- the dry ice can now be applied to the polishing table with the polishing agent applied thereon, wherein the polishing agent can also be arranged together with a polishing plate on the polishing table.
- the dry ice it is also possible for the dry ice to be applied directly to the polishing table if no polishing agent is arranged thereon.
- a passage opening is then formed in the polishing plate, through which the dry ice can be applied by the cleaning device to the polishing table.
- the through hole is explicitly not as a through hole for receiving a
- Plug or formed as a through hole of a connector receptacle, but as a different from it through opening.
- the polishing plate can also be formed a plurality of through holes through which the dry ice can be applied by means of the metering device to the polishing table. This is particularly advantageous when an application of dry ice in the polishing position is to take place, since then a uniform distribution of the dry ice on the polishing table or the polishing agent is possible.
- the cleaning device can have a liquid reservoir or dry ice reservoir, a metering pump, a feed line, a metering valve, an application nozzle and a control device for dry ice.
- the liquid reservoir may be a temperature-insulated container for, for example, liquid carbon dioxide.
- the carbon dioxide can be promoted or metered.
- the supply line can be used to supply liquid carbon dioxide and compressed air to the application nozzle.
- An amount of dry ice or liquid carbon dioxide and compressed air can be metered or adjusted via the metering valve.
- the control device can be used to control and regulate the aforementioned components.
- the control device can also be formed by a control device which is present anyway for controlling the polishing machine.
- the liquid reservoir or the dry ice reservoir, the metering pump, the supply line, the metering valve and the application nozzle can form a modular cleaning unit which can be removably arranged outside or inside a housing of the polishing machine. It is thus possible to retrofit or retrofit a conventional polishing machine with the cleaning unit or even to design a polishing machine in such a way that it can easily be supplemented by the cleaning unit. Furthermore, it will then also be possible to simply replace the cleaning unit in case of a defect against a new cleaning unit.
- the positioning device may comprise a holding device, wherein the holding device may have a receptacle for releasably holding the polishing plate, wherein the receptacle with a magnet for kraftschlüs sigen and / or may be formed with a coupling for formschlüs sigen mounting the polishing plate.
- the positioning device may comprise an arm or a boom, at the end of the holding device is formed.
- the arm or the cantilever may be such that a pressing force of the polishing plate on the polishing table is determined. This can, for example, via a bending beam strip with Dehnungsmes done in the boom, so that a weight of the polishing plate can be measured.
- the recording can be formed for example by magnets that hold the polishing plate kraftschlüs sig.
- the magnet may be a permanent magnet or an electromagnet.
- the polishing plate itself can have a magnet or consist of a ferromagnetic material.
- the recording a clutch for formschlüs sigen bracket of the polishing plate be.
- the polishing plate can be inserted with an axis disposed thereon in the recording.
- the axle can then lock in the receptacle or coupling or optionally also clamped or clamped, so that the clutch can hold the axis kraftschlüs sig. If a passage opening is formed in the polishing plate, a feed line can also be guided to or through the receptacle to the polishing plate.
- the receptacle may allow an inclination of the polishing plate at an angle of up to 2 ° relative to the polishing table, the positioning device having a force measuring device for determining a pressing force of the polishing plate on the polishing table.
- the polishing plate can therefore be mounted pendulum on the recording by the angle. Thus, it can be ensured that the polishing plate always aligns with the polishing table and results in a uniform distribution of a polishing force on the polishing plate.
- the force measuring device can strip within the holding device, for example, by a bending beam with Dehnungsmes, be formed.
- the polishing plate can sen a connection extension, which is detachably connectable to the receptacle.
- the connection extension may be formed in the manner of an axle which is fixed to the polishing plate. The axle can then simply be plugged into the receptacle.
- a channel for the passage of dry ice can be formed to a through hole of the polishing plate. If a connection extension is arranged on the polishing plate, the channel can also connect to the connection extension and be guided therethrough to the passage opening of the polishing plate. Alternatively, the channel can also terminate at the receptacle without being directly connected to the polishing plate. For example, the polishing plate can then be positioned in the receptacle so that the channel always always ends above a passage opening in the polishing plate.
- the polishing machine may have a metering device for applying Spülflüs fluid on the polishing table, wherein in the polishing plate, a through hole may be formed through which the Spülflüs fluid can be metered by means of the metering device on the polishing table.
- the rinsing liquid can now be applied to the polishing table with a polishing agent applied thereon, wherein the polishing agent can also be arranged together with a polishing plate on the polishing table.
- the passage opening is then formed in the polishing plate, through which the Spülflüs fluid from the metering device on the polishing table siert or can be applied.
- the rinsing liquid can be applied through the through hole on the polishing table or on the polishing table arranged on the polishing agent, an amount of Spülflüs fluid can be dispensed dosed during the entire polishing process of the metering device. As a result, it can be ensured that a sufficient amount of rinsing liquid is always present on the polishing agent or polishing table during the polishing process. Depending on the type of dosing of the flushing liquid It can then be prevented that particles of the polishing agent and material residues or abrasion of the plug and the optical waveguide impair a polishing effect of the polishing agent. A quality of the polished surface can be significantly improved.
- an atomizer valve of the metering device can be arranged.
- a nebulizer Spülflüs fluid can be sprayed over a larger surface area of the polishing table.
- the polishing agent can be completely wetted with the liquid Spülflüs.
- the polishing plate and / or the polishing table may be at least partially coated with an amorphous carbon layer.
- the amorphous carbon layer may be applied by a DLC coating method, wherein a surface of the polishing plate and / or the polishing table may be completely coated with the amorphous carbon layer.
- a coating has a smooth surface with a high abrasion resistance.
- such a coating may have a hardness of about 2,500 to 3,000 HV.
- the coating has a black color, so that s possible damage or wear of the coating can be easily detected. A service life of the polishing plate and / or the polishing table can be significantly extended.
- polishing plate and / or the polishing table it is then no longer necessary to pay for the material of the polishing plate and / or the polishing table several times in order to achieve a desired hardness of the surface of the polishing plate and / or the polishing table.
- a heat treatment of the polishing plate and / or the polishing table can be significantly simplified. Overall, a number of working steps for the production of the polishing plate and / or the polishing table can be saved thereby, whereby a production is low-cost.
- the polishing machine may comprise a changing device, wherein the changing device may include a plurality of polishing plates each having a polishing agent, wherein the polishing agents may be different from each other, wherein the polishing plates with the polishing medium storable in a storage device of the changing device and by means of a handling device Changing device each can be arranged on the polishing table or removable from this.
- the polishing plates may also be formed differently from each other, if the polishing plates are made of rubber and have different hardnesses.
- the polishing agents may differ in abrasive particle size or grain size and be positioned on the respective polishing plates.
- the magazine device can store a plurality of polishing plates, each with polishing agents.
- the magazine device may be formed as a circulating B and or a chain in the manner of a paternoster, in which the polishing plates are stored or held with the polishing agents.
- the handling device may be a robot arm, a treadmill or other suitable means by which a change of a polishing plate located on the polishing table with a polishing agent against a polishing plate with a polishing agent in the
- Magazine device can be done.
- one end of an optical fiber of an optical waveguide is polished, wherein a plug with the optical waveguide is held in a plug receptacle of a polishing plate, wherein a polishing agent is received on a polishing table, wherein the polishing plate and the polishing table are moved by means of a positioning relative to one another from a set-up position to a polishing position, wherein in the polishing position, the polishing pickup and the polishing table by means of a drive device relative to each other perform a polishing, wherein by means of a cleaning device
- Polishing machine dry ice is applied to the polishing table and / or on the polishing plate.
- an application of dry ice can take place. This makes it possible, after performing a polishing operation, to clean the polishing agent or the polishing table as well as the polishing plate, for example, in preparation for a subsequent polishing operation.
- the dry ice may be sublimated on a surface of the polishing table and / or the polishing plate, and impurities of the surface may be removed from the surface.
- the impurities may be, for example, Spülflüs stechniksreste or dirt particles of plugs, optical fibers and the polishing agent. So it can then be prevented that s these dirt particles are dragged to a subsequent polishing process, whereby a quality of j e election polished surfaces can be significantly improved.
- a volume of the dry ice may be increased by about 700 to 1,000 times when passing into the gaseous phase, whereby the impurities are carried away from the respective surface into an environment of the polishing table and the polishing plate.
- the contaminants can then be easily collected and removed via a suction device of the polishing machine, which can at least partially surround the polishing table and / or the polishing plate.
- a suction device of the polishing machine which can at least partially surround the polishing table and / or the polishing plate.
- it may be provided to form a flow of cleaning exhaust gas which extends from a center to an edge of the polishing table and / or the polishing plate.
- the dry ice may be applied in the center of a polishing table and / or the polishing plate so that an expansion of sublimation-generated gas from the center to the edge occurs.
- the dry ice may be applied to one edge of the polishing table and / or the polishing plate so that opposing flows of cleaning exhaust gases in the center meet and impinge on the opposite center of the polishing table or polishing plate and are discharged therefrom to the edge ,
- a control device of the polishing machine By means of a control device of the polishing machine, a relative positioning of the polishing plate and the polishing table, a change of polishing plates, the execution of the polishing movement and / or a dosing of the Spülflüs fluid can be controlled.
- the control device can in principle also serve to control other functions of the polishing machines. By using the control device, it becomes possible to perform a polishing process or a sequence of polishing operations completely automatically.
- a dosage of Spülflüs fluid can be provided to dose Spülflüs fluid in order to obtain high quality polished surfaces.
- control device can also be used to control a metering function of the polishing machine.
- the figure shows a polishing machine 10 for polishing optical waveguides with a housing 1 1 and a control device 12 for controlling a function of the polishing machine 10.
- the polishing machine has in particular a polishing plate 13 with a plurality of Steckeraufnah- 14 on.
- the polishing plate 13 is opposite a polishing table
- a polishing pad not shown here, can be placed with a polishing agent.
- a positioning device 17 of the polishing machine 10 has a linearly movable column 18 with an arm 19 and a holding device 20 for holding the polishing table 15.
- the holding device 20 forms a receptacle 21 for releasably holding the polishing plate 13.
- an axis 22 is formed, which is inserted into the receptacle 21.
- the polishing machine 10 has a cleaning device not shown here for applying dry ice to the polishing table 15 and / or the polishing plate 13.
- a cleaning device not shown here for applying dry ice to the polishing table 15 and / or the polishing plate 13.
- the cleaning device it is possible in the set-up position 16 shown here possibly on the polishing plate 13 and the polishing table 15 adhering residues without residue to eliminate .
- the polishing machine 10 may further have a dosing device, not shown here, can be dosed with the rinsing liquid on the polishing table 15 with the then placed thereon polishing agent.
- a supply of Spülflüs fluid takes place through a through hole also not shown here in the polishing table 15, so that an application of Spülflüs fluid can also be done during a polishing process.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/057885 WO2018184658A1 (de) | 2017-04-03 | 2017-04-03 | Poliermaschine und verfahren zum polieren von lichtwellenleitern |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3606700A1 true EP3606700A1 (de) | 2020-02-12 |
Family
ID=58609357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17718842.2A Withdrawn EP3606700A1 (de) | 2017-04-03 | 2017-04-03 | Poliermaschine und verfahren zum polieren von lichtwellenleitern |
Country Status (3)
Country | Link |
---|---|
US (1) | US11667006B2 (de) |
EP (1) | EP3606700A1 (de) |
WO (1) | WO2018184658A1 (de) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6102785A (en) * | 1998-02-27 | 2000-08-15 | Ciena Corporation | Polishing apparatus for optical fibers having a pressure transducer and a magnetically attached leveling device |
US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
JP2000354948A (ja) * | 1999-06-14 | 2000-12-26 | Matsushita Electronics Industry Corp | 基板研磨方法および基板研磨装置 |
AU2003259535A1 (en) * | 2002-12-20 | 2004-07-14 | Sagitta Engineering Solutions Ltd. | A system and a method for polishing optical connectors |
US8556063B2 (en) * | 2012-01-18 | 2013-10-15 | Xerox Corporation | Dry ice belt cleaning system for laser cutting device |
US20130203320A1 (en) * | 2012-02-06 | 2013-08-08 | Hamid R. Ghalambor | Methods and Systems for Sensor-Based Deburring |
WO2014208762A1 (ja) * | 2013-06-29 | 2014-12-31 | Hoya株式会社 | ガラス基板の製造方法及び磁気ディスクの製造方法、並びにガラス基板用研磨液組成物 |
JP6065802B2 (ja) | 2013-10-03 | 2017-01-25 | 信越半導体株式会社 | 研磨布の洗浄方法及びウェーハの研磨方法 |
US10058975B2 (en) * | 2016-02-12 | 2018-08-28 | Applied Materials, Inc. | In-situ temperature control during chemical mechanical polishing with a condensed gas |
CN106239356B (zh) | 2016-09-05 | 2018-02-06 | 咏巨科技有限公司 | 研磨垫修整方法、研磨垫修整装置及化学机械研磨设备 |
-
2017
- 2017-04-03 WO PCT/EP2017/057885 patent/WO2018184658A1/de unknown
- 2017-04-03 EP EP17718842.2A patent/EP3606700A1/de not_active Withdrawn
- 2017-04-03 US US16/499,346 patent/US11667006B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11667006B2 (en) | 2023-06-06 |
US20210114161A1 (en) | 2021-04-22 |
WO2018184658A1 (de) | 2018-10-11 |
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